A novel approach for bulk micromachining of 4H-SiC by tool-based electrolytic plasma etching in HF-free aqueous solution

Bulk micromachining of single-crystal SiC has been challenging due to its extreme stability both mechanically and chemically. To address this issue, a novel tool-based electrolytic plasma etching method is proposed, with which micropatterns and micro-holes are fabricated in SiC in a hydrofluoric acid-free aqueous solution with no need for masks. The material removal is the result of the combined effects of electrolytic plasma chemistry and physics. The chemistry refers to the reaction of Si with hydroxyl radical to form various SiO_x and with H to form silanes, and the reactions of C to form volatile carbon oxides or hydrocarbons, all of which are accomplished and enhanced under the electrolytic plasma atmosphere. Besides, the local high temperature of plasma thermally promotes the evaporation or dissolution of SiO₂ in NaOH solution. The tool-based electrolytic plasma etching method provides alternative approaches for the fabrication of SiC-based MEMS and devices.     

Mechanical Properties of Single-Layer Diamond Reinforced Poly(vinyl alcohol) Nanocomposites through Atomistic Simulation

Low-dimensional carbon nanostructures are ideal nanofillers to reinforce the mechanical performance of polymer nanocomposites due to their excellent mechanical properties. Through molecular dynamics simulations, the mechanical performance of poly(vinyl alchohol) (PVA) nanocomposites reinforced with a single-layer diamond – diamane is investigated. It is found the PVA/diamane exhibits similar interfacial strengths and pull-out characteristics with the PVA/bilayer-graphene counterpart. Specifically, when the nanofiller is fully embedded in the nanocomposite, it is unable to deform simultaneously with the PVA matrix due to the weak interfacial load transfer efficiency, thus the enhancement effect is not significant. In comparison, diamane can effectively promote the tensile properties of the nanocomposite when it has a laminated structure as it deforms simultaneously with the matrix. With this configuration, the interlayer sp³ bonds endows diamane with a much higher resistance under compression and shear tests, thus the nanocomposite can reach very high compressive and shear stress. Overall, enhancement on the mechanical interlocking at the interface as triggered by surface functionalization is only effective for the fully embedded nanofiller. This work provides a fundamental understanding of the mechanical properties of PVA nanocomposites reinforced by diamane, which can shed lights on the design and preparation of next generation high-performance nanocomposites.     

Dense and core-rim structured B4C-TiB2 ceramics with Mo-Co-WC additive

B₄C-TiB₂ ceramics (TiB₂ ranging 5~70 vol%) with Mo-Co-WC as the sintering additive were prepared by spark plasma sintering. In comparison with B₄C-TiB₂ without additive, the enhanced densification was evident in the sintered specimen with Mo-Co-WC additive. Core-rim structured grain was observed around TiB₂ grains. The interface of the rim between TiB₂ and B₄C phases demonstrated different feature: the inner borderline of the rim exhibited a smooth feature, whereas a sharp curved grain boundary was observed between the rim and the B₄C grain. The formation mechanism is discussed: the epitaxial growth of (Ti,Mo,W)B₂ rim around the TiB₂ core may occur as a result of the solid solution and dissolution-precipitation between TiB₂ phase and the sintering additive. It was revealed that the fracture toughness increased as the content of TiB₂ content increased, alongside the decreased hardness. B₄C-30 vol% TiB₂ specimen demonstrated the optimal combination of mechanical properties, reaching Vickers hardness of 24.3 GPa and fracture toughness of 3.33 MPa·m^1/2.     

Efficient key generation leveraging channel reciprocity and balanced gray code

Wireless Networks - Key generation leveraging wireless channel reciprocity can establish secret keys from unauthenticated broadcast channels and thus protect the communication of wireless networks....     

基于结构光的星箭对接环相对位姿测量方法

空间非合作目标位姿测量是空间在轨维护的前提。面向空间机械手对空间载体自动抓捕的应用需求，提出了基于结构光的空间非合作目标视觉测量方法。该方法以双套双线结构光测量装置作为测量传感器，以空间载体上普遍存在的星箭对接环作为抓捕目标。根据对接环的共同特点，选择直线特征和点特征相结合作为相对位姿的求解特征；基于直线特征求解圆环平面法向量，基于点特征求解圆环圆心坐标，进而得到机械手工具坐标系与对接环坐标系间的相对位姿关系；基于多重几何约束实现了不同光照条件下图像上目标直线的鲁棒识别。建立了演示验证实验系统，在大量演示实验的基础上，进行了实验结果分析。     

Influence of lanthanum on enhancement of mechanical and electrical properties of Cu-Al_2O_3 composites

Two kinds of Cu-Al_2O_3 composites(with and without La) were prepared via mechanical alloying-spark plasma sintering(MA-SPS) method. Microstructure, mechanical properties and electrical resistivity were investigated systematically using metallography, scanning electron microscopy, transmission electron microscopy, mechanical and electrical properties testing. The results indicate that an appropriate amount of La can homogenize the distribution of Al_2O_3. As such, yield strength, ultimate tensile strength and elongation of Cu-Al_2O_3-La are greatly increased. Some semi-coherent interface between Cu and Al_2O_3 is found, which means a low interface energy. The grain shape of Cu changes to irregular band with the addition of La. This change results in a density decrease of grain boundary and reduces electrical resistance. Lanthanum may exist in the form of La_2O_3.     

城市污水厂剩余污泥对水中F-的吸附性能研究

利用城市污水处理厂的剩余污泥对水中F-进行吸附处理,通过污泥投加量、F-初始质量浓度、时间、pH等反应条件的研究,探讨除氟效果和影响因素。结果表明,室温下,污泥对F-的吸附在60 min后达到平衡;20 g/L的污泥投加量对10 mg/L含氟水的F-去除率可达83.1%;污泥可在3~10的较大pH范围内保持稳定的除氟效果。准二级动力学模型很好地拟合了污泥对F-的吸附行为,Langmuir和Freundlich模型均符合污泥对F-的吸附特性,热力学参数的计算表明该吸附过程是自发的放热反应。     

高过滤性能石墨烯复合纳米纤维膜的制备及性能

将石墨烯(GR)纳米颗粒掺杂到聚丙烯腈(PAN)纺丝溶液中,利用静电纺丝技术制备石墨烯/聚丙烯腈(GR/PAN)复合纳米纤维膜。研究PAN质量分数、GR用量、纺丝电压及接收距离对GR/PAN复合纳米纤维膜形貌和过滤性能的影响,发现最优纺丝工艺参数为PAN质量分数14.0%、GR用量1.5%、纺丝电压26 kV、接收距离14 cm、注射速度1 mL/h。此最优纺丝工艺参数制备的GR/PAN复合纳米纤维膜的过滤效率为98.86%,过滤阻力为110.30 Pa。     

发芽小米淀粉热分解机制及动力学研究

发芽是改善谷物品质的绿色加工方法。为了探究发芽对小米淀粉热力学性质的影响,采用差示量热扫描法、热重分析法对发芽小米淀粉的热分解机制及其动力学行为进行了研究。结果表明,小米发芽后淀粉糊化温度升高,糊化焓、回生度、回生速率均减小;未处理及发芽处理小米淀粉热分解均是一个连续的过程,热分解温度范围为295~360℃,分解速率最快的温度范围为298.49~305.01℃;发茅小米淀粉活化能、指前因子、焓值、熵值(绝对值)及吉布斯自由能均较未处理小米淀粉减小;未处理及发茅小米淀粉热分解最概然机制函数均为G(α)=lnα,最概然机制为单分子消除反应,为一级反应。