PSO-based Parameter Tuning for a Two-Degree-of-Freedom IMC Scheme and Its Application to Paper Basis Weight Control

Basis weight is an important indicator for evaluating paper quality and a major factor directly affecting the economic benefits of enterprises. Focusing on the large time-delay, time-varying, and nonlinear characteristics of a basis weight control system, a two-degree-of-freedom(TDF) internal model control(IMC) method based on a particle swarm optimization(PSO) algorithm was proposed. The method took the integral of time multiplied by the absolute error(ITAE) as the objective function, and the PSO algorithm was used to optimize the time constant of the tuning IMC filter. The simulation results for the control system under the proposed TDF-IMC method based on the PSO algorithm demonstrate good set-point tracking performance, strong anti-interference capabilities, and good robustness properties. The application results revealed that the basis weight fluctuation range of the paper was ±2 g/m~2, which significantly improved both the control quality and the product quality.     

Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging

A U-shape clamp was designed to apply stress perpendicular to the interface of Cu/Sn/Cu solder joints, and its influence on the growth behavior of Cu-Sn intermetallic compound (IMC) during thermal aging at 150 °C was investigated. The results show that compared with the sample at general stress-free state, the growth rate of IMC under compression is faster, while that under tension is slower. Moreover, the interface between IMC and Sn is smoother under compressive stress, and the corresponding IMC grains are smaller and more uniform than that under tensile stress. According to the growth kinetic analysis, the growth of IMC under general, compressive and tensile states is all controlled by the combination of grain boundary diffusion and volume diffusion with a similar growth exponent (n ≈ 0.4). However, external stress can affect the Ostwald ripening process of grain growth, causing a change of grain size and grain boundary density in the IMC layer. As a result, the IMC growth behavior at the interface of the solder joint will be affected by the applied external normal stress.     

键合界面金属间化合物对可靠性影响的研究现状

在微电子封装过程中,键合丝被广泛应用,而键合可靠性对于产品的应用性能有着极大的影响,受到人们的广泛关注。键合丝与常用的铝焊盘之间是异质材料,在应用和服役的过程中会在界面上产生金属间化合物(IMC),对器件可靠性产生影响,同时,键合强度也与键合丝和焊盘之间的界面反应联系密切,因此了解键合丝与铝焊盘之间金属间化合物的形成与演变对键合可靠性的影响是有必要的。本文综述了Au/Al、Ag/Al和Cu/Al三种键合界面上金属间化合物的形成与演变的研究现状,并根据目前的应用状况,展望了未来的应用发展前景。     

永磁同步电机变频调速系统的内模控制

永磁同步电机是典型的非线性多变量强耦合系统,在同步旋转坐标系下dq轴电流存在耦合,传统的PI控制器无法实现解耦,提出一种基于内模控制原理和空间矢量算法相结合的高性能永磁同步电机解耦控制方法,用内模控制策略控制理想电机模型,对定子电流交叉耦合电势动态解耦,提高系统的动态响应性能,同时在整个电流闭环过程中对参数摄动和外扰动具有良好的鲁棒性,这种方法不需要额外的电机参数和检测硬件,实验结果验证了方法有效可行。     

添加0.05％(La+Ce)对SnXCuNi焊料与Cu基板间界面组织的影响

在Sn-4.1X-1.5Cu-Ni焊料合金中添加0.05％(质量分数,下同)(La+Ce),对焊料/Cu焊点等温时效后其界面组织的变化规律以及界面金属间化合物的形成和生长行为进行分析研究,结果表明:随着等温时效时间的延长,Sn-4.1X-1.5Cu-Ni/Cu和Sn-4.1X-1.5Cu-Ni-0.05(La+Ce)/...     

铜线键合Cu/Al界面金属间化合物微结构研究

由于铜线具有较高的热导率、卓越的电学性能以及较低的成本,被普遍认为将逐渐代替传统的金线而在IC封装的键合工艺中得到广泛的应用。铜线键合工艺中Cu/Al界面金属间化合物(IMC)与金线键合的Au/Al IMC生长情况有很大差别,本文针对球焊键合中键合点的Cu/Al界面,将金属间化合物生长理论与分析手段相结合,研究了Cu/Al界面IMC的生长行为及其微结构。文中采用SEM测试方法,观察了IMC的形貌特点,测量并得到了IMC厚度平方正比于热处理时间的关系,计算得到了生长速率和活化能数值,并采用TEM,EDS等测试手段,进一步研究了IMC界面的微结构、成分分布及其金相结构。     

蒸汽裂解模拟装置的二自由度内模控制

针对中石化某裂解装置的控制问题,通过实测模型,根据内模控制理论,提出一种二自由度的内模控制器的设计和参数整定方法.通过参数整定,所设计的控制器可以控制系统,同时具有良好的设定值跟踪特性和抑制干扰特性.将该二自由度控制器设计方法应用于蒸汽裂解装置中,减小了装置升温过程的波动,克服了保温过程的扰动,并且缩短了升温时间,提高...     

Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging

The effects of isothermal aging on the microstructure and shear strength of Sn37Pb/Cu solder joints were investigated. Single-lap shear solder joints of eutectic Sn37Pb solder were aged for 1–10 days at 120 °C and 170 °C, respectively, and then loaded to failure in shear with a constant loading speed of 5 × 10⁻³ mm/s. The growth of the interfacial Cu–Sn intermetallic compounds (IMC) layer (Cu₆Sn₅ + Cu₃Sn) of Sn37Pb/Cu solder joints subjected to isothermal aging exhibited a linear function of the square root of aging time, indicating that the formation of Cu–Sn IMC was mainly controlled by the diffusion mechanism. And the diffusion coefficient (D) values of IMC layer were 1.07 × 10⁻¹⁷ and 3.72 × 10⁻¹⁷ m²/s for aged solder joints at 120 °C and 170 °C, respectively. Shear tests results revealed that as-reflowed solder joint had better shear strength than the aged solder joints and the shear strength of all aged solder joints decreased with increasing aging time. The presence of elongated dimple-like structures on the fracture surfaces of these as-reflowed or aged for short time solder joints were indicative of a ductile failure mode. As aging time further increased, the solder joints fractured in the mixed solder/IMC mode at the solder/IMC interface.     

Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests

This paper describes the use of in-situ High Temperature Storage Life (HTSL) tests based on a four point resistance method to evaluate Cu wire interconnect reliability. Although the same set up was used in the past to monitor Au–Al ball bond degradation, a different approach was needed for this system. Using conventional statistical methods of failure probability distributions and a fixed failure criterion were found to be unsuitable in this case. Besides this, tests usually take very long until a sufficient percentage of the population have failed according to that criterion. A simple physical model was used to electrically quantify ball bond degradation due to the prevailing failure mechanism in a substantially smaller amount of test time. The method enabled the determination of activation energies for a number of moulding compounds and is extremely useful for a fast screening of such materials regarding their suitability for Cu wire.     

Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints

Fe-Ni films with compositions of Fe-75Ni, Fe-50Ni, and Fe-30Ni were used as under bump metallization （UBM） to evaluate the interracial reliability of SnAgCu/Fe-Ni solder joints through ball shear test, high temperature storage, and temperature cycling. The shear strengths for Fe-75Ni, Fe-5ONi, and Fe-3ONi solder joints after reflow were 42.57, 53.94 and 53.98 MPa, respectively, which were all satisfied the requirement of industrialization （〉34.3 MPa）. High temperature storage was conducted at 150, 175 and 200 ℃. It was found that higher Fe content in Fe-Ni layer had the ability to inhibit the mutual diffusion at interface region below 150 ℃, and the growth speed of intermetallic compound （IMC） decreased with increasing Fe concentration. When stored at 200 ℃, the IMC thickness reached a limit for all three films after 4 days, and some cracks occurred at the interface between IMC and Fe-Ni layer. The activation energies for the growth of FeSn2 on Fe-30Ni, Fe-5ONi, and Fe-75Ni films were calculated as 246, 185, and 81 kJ/mol, respectively. Temperature cycling tests revealed that SnAgCu/Fe-5ONi solder joint had the lowest failure rate （less than 10%）, and had the best interfacial reliability among three compositions.