On the dissipation process in Bi2Sr2Ca2Cu3O10 tapes and bulk samples with preferential grain orientation in zero external magnetic field

Current-voltage characteristics of Bi₂Sr₂Ca₂Cu₃O₁₀ tapes and bulk samples with preferentially oriented crystallites have been measured in zero applied magnetic field and for temperatures close to the mean-field critical-temperature,T _c0. It was shown that the power-law dependence,V=AI ^a, valid for two-dimensional systems, does not correctly describe the data, which clearly indicate the existence of a finite critical-current density,J _c. The experimentalI-V curves are fitted quite well with the model which attributes the finite critical-current density to the coupling between the CuO₂ double layers. It was found thatJ _c vanishes at a temperature value belowT _c0. This behavior can result from the occurrence of vortex fluctuation-induced layer decoupling and/or from the contribution of entropy to the vortex unbinding process.     

氧化亚铜微米晶的水热合成与生长机理

氧化亚铜是一种重要的P型半导体材料，目前因其独特的可见光催化性能在科研领域引起了广泛的重视。以CuSO4·5H2O为铜源，以α—D-葡萄糖为还原剂，并利用水热还原反应合成出了不同形貌的Cu2O微米晶。利用X射线粉末衍射分析（XRD）、透射电子显微镜（TEM）对合成的样品进行了形貌与结构的表征与分析。结果表明所合成的晶粒尺寸均匀且分散性好。讨论了不同条件下的晶粒生长机理，运用扩散机制与聚集机制解释了不同形貌的成因。     

Effect of Hot Band Annealing on Magnetic Properties in 3% Si Grain‐oriented Electrical Steels

Hot band annealing is known to be a prerequisite for good magnetic properties irrespective of manufacturing methods in grain‐oriented Fe‐3 wt.% Si electrical steels. In this study, the effects of hot band annealing on magnetic properties were investigated in 3% grain‐oriented electrical steels of low soluble AI contents and one‐stage cold rolling. Microstructure and precipitate distribution were compared with hot band annealing conditions. Secondary recrystallization behaviour with hot band annealing condition was also discussed.     

Aspects of microstructure in low carbon steels produced by the CSP process

The solidification structure, microstructure evolution during rolling and precipitates with nanometers in dimension of the low carbon steels produced by CSP process with thin slabs have been studied in recent years. Important differences in microstructure and mechanical properties between the CSP products and the conventional one were observed. These differences may arise from the much rapider solidification rate and cooling rate after casting of the thin slabs. Some aspects of the microstructure for the low carbon steels of the CSP thin slabs are summarized and compared with the conventional one.     

基于图象识别的水泥预加水成球闭环控制方法

分析现有参加水成球开环控制系统存在的问题，提出一种基于计算机图象识别的技术的水泥预加水成球闭环控制方法。     

Effect of AlP master alloy on grain refinement of primary silicon in eutectic Al-Si alloys

To obtain the finer primary silicon crystals, the proprietary Al-P master alloy was adopted to modify the eutectic Al-Si alloys and the most suitable modification process was made in the experiments. The SEM (Scanning Electron Microscope) and DSC (Differential Scanning Calorimeter) analysis indicate that the Al-P modifier has more advantages over Cu-P and Fe-P modifier in easily addition, no elemental alteration and less undercooling of primary silicon′s solidification, which suggests the Al-P master alloy is an effective modifier of eutectic Al-Si alloys.     

Numerical Modeling of Grain Boundary Effects in the Diffusional Creep of Copper Interconnect Lines

We propose a numerical simulation technique to model the process of diffusional creep and stress relaxation that occurs in Cu-damascene interconnects of integrated circuit devices in processing stage. The mass flow problem is coupled to the stress analysis through vacancy flux and equilibrium vacancy concentration. The technique is implemented in a software package that seamlessly integrates the problem-oriented code with commercially available finite element program MSC.Marc. It is utilized to model the Coble creep phenomenon by introducing the nanoscale grain boundary region having the thickness on the order of several layers of atoms. As an illustration, the two-dimensional problem of stress relaxation in a single grain subjected to prescribed displacements and tractions is examined.     

Influence of grain boundaries on short crack growth behaviour of IGSCC

Understanding short crack behaviour is essential for predicting the lifetime of light water reactor components. However, crack growth rates of short cracks are unsteady due to microstructural obstacles such as grain boundaries. On the other hand, the statistical behaviour of short cracks can be deduced from crack size distributions. Some papers have pointed out that the crack size distributions obtained by stress corrosion cracking tests showed a kink in the distribution line. This kink suggests that the short crack growth rate is slow compared with that of long cracks. And it can be thought that the slow growth rate is caused by the microstructural obstacles. This study investigated the influence of grain boundaries on the short crack growth behaviour of intergranular stress corrosion cracking. A crack growth simulation model, which considered the mechanical effects of the crack kink and bifurcation by grain boundaries, was developed. The crack depth distribution obtained by the simulation also exhibited a kink in the distribution line as seen in the experimental results. This suggests that grain boundaries play an important role in short crack growth behaviour.