Study of the effect of BDMA catalyst in the epoxy novolac curing process by isothermal DSC

Epoxy novolac/anhydride cure kinetics has been studied by differential scanning calorimetry under isothermal conditions. The system used in this study was an epoxy novolac resin (DEN431), with nadic methyl anhydride as hardener and benzyldimethylamine as accelerator. Kinetic parameters including the reaction order, activation energy and kinetic rate constants, were investigated. The cure reaction was described with the catalyst concentration, and a normalized kinetic model developed for it. It is shown that the cure reaction is dependent on the cure temperature and catalyst concentration, and that it proceeds through an autocatalytic kinetic mechanism. The curing kinetic constants and the cure activation energies were obtained using the Arrhenius kinetic model. A suggested kinetic model with a diffusion term was successfully used to describe and predict the cure kinetics of epoxy novolac resin compositions as a function of the catalyst content and temperature. Copyright © 2003 Society of Chemical Industry     

分布式光纤喇曼放大技术及其在WDM系统中的应用

介绍了分布式光纤喇曼放大技术的原理、特点和应用 ,并从受此影响的 WDM传输系统的信噪比、噪声指数和品质因数三个方面讨论了光纤喇曼放大技术在提升光纤通信系统性能方面的重要作用。     

Poly(butylene terephthalate)–clay nanocomposites prepared by melt intercalation: morphology and thermomechanical properties

Nanocomposites based on poly(butylene terephthalate) (PBT) and an organoclay (Cloisite 30B) were prepared by melt blending using a twin‐screw extruder. Two kinds of PBTs, ie PBT‐A and PBT‐B, with different inherent viscosities (η_inh), were used for this study (η_inh of PBT‐A and PBT‐B were 0.74 and 1.48, respectively). Dispersion of the clay layers in the PBT nanocomposites was characterized by using X‐ray diffraction (XRD) and transmission electron microscopy (TEM). Tensile and dynamic mechanical properties and non‐isothermal crystallization temperatures of the nanocomposites were also examined. Nanocomposites based on the higher‐viscosity PBT (PBT‐B) showed a higher degree of exfoliation of the clay and a higher reinforcing effect when compared to the composites based on the lower‐viscosity PBT (PBT‐A). The clay nanolayers dispersed in PBT matrices lead to increases in the non‐isothermal crystallization temperatures of the PBTs, with such increases being more significant for the PBT‐B nanocomposites than for the PBT‐A nanoocomposites. Copyright © 2004 Society of Chemical Industry     

聚醚酰亚胺热焓松弛的分子量依赖关系

采用ＤＳＣ对不同分子量的聚醚酰亚胺的等温及动态热焓松弛行为进行了研究，并以ＫＷＷ方程对实验数据进行了非线性拟合。结果表明，分子量对热焓松弛的影响是由高分子端基引起自由体积的差异所致。不同分子量的聚醚酰亚胺分子具有不同数量的端基，淬冷时端基数目的差异将产生不同数量的过剩自由体积，从而影响松弛热焓及松弛速率、低分子量的聚醚酰亚胺松弛相对较快，且起始热焓高，松弛的表观活化能亦较小。     

Morphological and kinetics study of PEO/PVC blends

The kinetics of spherulite radial growth and the morphology of the compatible system PEO/PVC have been studied by optical microscopy. The usual spherulite radial growth behaviour has been found for compatible blends with PEO content higher than 70%. For lower composition, distortion of the usual spherulite morphology has been observed; the anomalies have been attributed to partial miscibility of the components.     

Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.     

A positive‐working photosensitive polyimide based on thermal cross‐linking and acidolytic cleavage

A novel positive‐working photosensitive polyimide (PSPI) based on a poly(hydroxyimide) (PHI), a crosslinking agent having vinyl ether groups, and a photoacid generator (PAG) was prepared. The PHI as a base resin of the three‐component PSPI was synthesized from 4,4′‐oxydiphthalic anhydride and 2,2′‐bis(3‐amino‐4‐hydroxyphenyl)hexafluoropropane through ring‐opening polymerization and subsequent thermal cyclization. 2,2′‐bis(4‐(2‐(vinyloxy)ethoxy)phenyl)propane (BPA‐DEVE) was used as a vinylether compound and diphenyliodonium 5‐hydroxynaphthalene‐1‐sulfonate was used as a PAG. The phenolic hydroxyl groups of the PHI and the vinyl ether groups of BPA‐DEVE are thermally crosslinked with acetal structures during prebake step, and the crosslinked PHI becomes completely insoluble in an aqueous basic solution. Upon exposure to UV light (365 nm) and subsequent postexposure bake (PEB), a strong acid generated from the PAG cleaves the crosslinked structures, and the exposed area is effectively solubilized in the alkaline developer. The dissolution behavior of the PSPI containing each 11.5 wt % of BPA‐DEVE and of the PAG was studied after UV exposure (365 nm) and PEB. It was found that the difference in dissolution rates between exposed and unexposed areas was enough to get high resolution. A fine positive pattern with a resolution of 5 μm in a 3.7‐μm‐thick film was obtained from the three‐component PSPI. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

TA15合金的热变形行为及加工图

研究了TA15合金的热模拟压缩实验。结果表明：变形温度的升高和应变速率的减小使峰值应力和稳态应力显著降低，变形温度会影响进入稳态流动所需变形量。以热模拟压缩实验为基础，建立的加工图表明：TA15合金高温变形时存在2个非稳定区域，一个是变形温度1300K以上和应变速率10．0s^-1以上的区域，另一个是变形温度1200K以下和应变速率0．006s^-1～1．995s^-1之间的区域。同时，建立的TA15合金高温变形时的流动应力模型表征了变形温度、应变速率和变形程度对流动应力的影响，模型的计算精度较高。     

大型钛合金压气机盘超塑性等温锻造模具结构及工艺参数实验研究

通过超塑拉伸和压缩试验，用金属铅进行模拟实验，探讨了大型ＴＣ１１合金压气机盘超塑性等温锻造的工艺参数，模具结构，锻坯形状尺寸及润滑剂的选择、并讨论了其模具材料及加热方式的选择。     

Effects of temperature and blank holding force on biaxial forming behavior of aluminum sheet alloys

Biaxial forming behavior is investigated for three aluminum sheet alloys (Al 5182 containing 1% Mn (5182+Mn), Al 5754, and 6111-T4) using a heated die and punch in the warm forming temperature range of 200–350 °C. It is found that, while all three alloys exhibit significant improvement in their formability compared with that at room temperature, the non-heat-treatable alloys 5182 + Mn and 5754 give higher part depths than that of heat-treatable 6111-T4. The formability generally increases with decreasing BHP (BHP), but increasing the forming temperature and/or BHP minimizes the wrinkling tendency and improves the forming performance. The stretchability of the sheet alloys increase with increasing temperature and increasing BHP. For the alloys and forming conditions involved in the current study, the formability, measured in terms of part depth, comes mainly from the drawing of metal into the die cavity, although stretching effects do influence the overall forming behavior. The optimum formability is achieved by setting the die temperature 50 °C higher than the punch temperature to enhance the drawing component. Setting the die temperature higher than the punch temperature also improves the strain distribution in a part in such a manner that postpones necking and fracture by altering the location of greatest thinning.