Modified atmosphere packaging of a mixed prepared vegetable salad dish

The aim of this study was to design a modified atmosphere package for a mixed vegetable salad consisting of 75 g of cut carrot, 55 g of cut cucumber, 20 g of sliced garlic and 50 g of whole green pepper. Respiration data of all the components were combined with film permeability data to predict package atmospheres and design optimal packages for experimental testing for improved shelf-life of the produce. The optimal package avoided minimum O₂ and maximum CO₂ tolerance limits, and chilling injury temperatures for any component. A pouch form package made of 27 mm low density polyethylene developed a modified atmosphere of 2.0–2.1% O₂ and 5.5–5.7% CO₂, which was beneficial for all components and provided better quality retention than other test packages.     

弹药包装冲击强度试验方法的改进研究

介绍一种新的弹药包装冲击强度试验方法，应用该试验方法可以防止冲击强度试验时出现与期望值相反的现象。     

广义预测控制系统的仿真软件设计与开发

介绍了基于广义预测控制的模型预测控制（MPC）系统仿真软件的开发与实现过程。该软件包含了MAC，IMAC，DMC，DDMC和GPC五种预测控制算法，可以用不同的方法实现对预测控制系统的综合性仿真以及控制器参数的调整。利用该软件可对模型预测控制系统的作用机理做进一步仿真分析，并有助于定性分析各种算法中设计参数对系统性能的影响以及不同算法之间的区别。     

近10年中国润滑脂产量与品种构成的发展

基于对中国27个润滑脂生产厂的调查统计结果，综述了1992～2001年10年间中国润滑脂产量、生产规模、品种结构及包装形式的发展变化情况，展望了今后的发展趋势。     

上市公司2001年业绩及前景

介绍了新闻纸、文化用纸有包装用纸上市公司2001年的主要业绩并对其发展前景作了分析。     

高层印制线路板正面临的对位挑战

封装工业正在推动着印制线路板技术水平朝着半导体要求的方向发展。高密度印制线路板正广泛用于网络路由器、自动测试设备和服务器领域。高密度要求(>150 IO/cm~2)正成为客户的普通需求。为满足现有的高密度封装要求,由于线宽、线距和通孔孔径正接近传统制作极限,普遍的方法就是不断增加印制线路板的层数。这些特征正驱动着印制线路板在基材、图像转移、蚀刻、电镀、阻焊、测试流程和对位系统的变化。此文主要讲述了印制线路板特性的变化趋势和利用对位模式和雷利分布去预测满足高级对位要求的能力以及印制线路板各流程中有关对准度的控制要点。     

High‐pressure processing effects on the mechanical,barrier and mass transfer properties of food packaging flexible structures: a critical review

Food products can be high‐pressure processed (HPP) either in bulk or prepackaged in flexible or semi‐rigid packaging materials. In the latter case the packaging material is subjected, together with the food, to high‐pressure treatment. A number of studies have been performed to quantify the effects of high‐pressure processing on the physical and barrier properties of the packaging material, since the integrity of the package during and after processing is of paramount importance to the safety and quality of the food product. This article reviews the results of published research concerning the effect of HPP on packaging materials. Copyright © 2004 John Wiley & Sons, Ltd.     

Filler-induced failure mechanism in plastic-encapsulated microelectronic packages

Based on empirical data, the present work provides a model to prevent filler-induced reliability degradation in plastic-encapsulated LOC (lead-on-chip) packages. According to the model, the maximum size of the silica fillers included in the plastic package body should be smaller than one half of the inter-distance between the device and its overlying lead-frame. In particular, it is shown in the model that the spherical silica particles, which are sometimes trapped in the space between the top surface of the device and the bottom of the lead-frame during the encapsulating process, can induce huge compressive stress on a specific site of the integrated circuit pattern due to the thermal shrinkage of the plastic package body. Further, the present model suggests that tiny fillers squeezed beneath a large trapping filler might directly attack the brittle layer of the device pattern because the compressive force from the large filler particle can develop into huge compressive stress due to the reduced load-carrying area.     

柯伐镀金盖板电化学腐蚀的剖析及其防腐措施

对半导体器件封装的气密性失效进行了研究。发现，柯伐镀金盖板遭致电化学腐蚀是导致气密性失效的主要原因。对电解液的形成和电化学腐蚀机理进行了深入的分析。提出了防止腐蚀，提高器件气密可靠性的思路和方法。