NiuPt1-uSivGe1-v/Si0.72Ge0.28界面形貌的改善

针对锗硅在形成金属锗硅化物时存在部分应力释放、界面形貌特性变差的问题,提出了在Si0.72Ge0.28上分别外延薄硅(Si)覆盖层和锗硅(Si072Ge0.28)缓冲层的工艺方案.实验结果表明,通过两步快速热退火,两个方案的工艺条件都能形成低阻的NiuPt1-uSitGe1-v和改善NivPt1-uSitGe./Si0.72Ge0.28的界面形貌.但相比较而言,在Si0.72Ge0.28上外延10 nm Si覆盖层的方案能够形成更好的NiuPt1-uSivGe1-t/Si0.72Ge0.28界面形貌.与没有改进的方案相比,该方案形成的肖特基接触更具有更低的肖特基接触势垒高度,更易形成欧姆接触.     

Electrical characteristics and TDDB breakdown mechanism of N2-RTA-treated Hf-based high-κ gate dielectrics

This study investigates the effects of rapid thermal annealing (RTA) in nitrogen ambient on HfO₂ and HfSiO_x gate dielectrics, including their electrical characteristics, film properties, TDDB reliability and breakdown mechanism. The optimal temperature for N₂ RTA treatment is also investigated. The positive oxide trap charges (oxygen vacancies) in HfO₂ and HfSiO_x dielectric films can be reduced by the thermal annealing, but as the annealing temperature increased, many positive oxide trap charges (oxygen vacancies) with shallow or deep trap energy level will be formed in the grain boundaries, degrading the electrical characteristics, and changing the breakdown mechanism. We believe that variation in the number of positive oxide trap charges (oxygen vacancies) with shallow or deep trap energy levels is the main cause of the CV shift and difference in the breakdown behaviors between HfO₂ and HfSiO_x dielectrics. With respect to CV characteristics and TDDB reliability, the optimal temperature for N₂ RTA treatment is in the range 500-600 °C and 800-900 °C, respectively.     

Time‐resolved investigation of Cu(In,Ga)Se2 growth and Ga gradient formation during fast selenisation of metallic precursors

Ga segregation at the backside of Cu(In,Ga)Se₂ solar cell absorbers is a commonly observed phenomenon for a large variety of sequential fabrication processes. Here, we investigate the correlation between Se incorporation, phase formation and Ga segregation during fast selenisation of Cu–In–Ga precursor films in elemental selenium vapour. Se incorporation and phase formation are analysed by real‐time synchrotron‐based X‐ray diffraction and fluorescence analysis. Correlations between phase formation and depth distributions are gained by interrupting the process at several points and by subsequent ex situ cross‐sectional electron microscopy and Raman spectroscopy. The presented results reveal that the main share of Se incorporation takes place within a few seconds during formation of In–Se at the top part of the film, accompanied by outdiffusion of In out of a ternary Cu–In–Ga phase. Surprisingly, CuInSe₂ starts to form at the surface on top of the In–Se layer, leading to an intermediate double graded Cu depth distribution. The remaining Ga‐rich metal phase at the back is finally selenised by indiffusion of Se. On the basis of a proposed growth model, we discuss possible strategies and limitations for the avoidance of Ga segregation during fast selenisation of metallic precursors. Solar cells made from samples selenised with a total annealing time of 6.5 min reached conversion efficiencies of up to 14.2 % (total area, without anti‐reflective coating). The evolution of the Cu(In,Ga)Se₂ diffraction signals reveals that the minimum process time for high‐quality Cu(In,Ga)Se₂ absorbers is limited by cation ordering rather than Se incorporation. Copyright © 2014 John Wiley & Sons, Ltd.     

动态随机存储器栅极侧壁硅化钨残留的去除工艺

动态随机存储器栅极侧壁硅化钨残留造成的短路成为制约提高产品良率及可靠性的瓶颈.为此,采用X射线荧光光谱（XRF）、扫描电镜（SEM）等检测分析手段优化硅/钨原子组成比为2.45.透射电镜（TEM）及电性参数测试结果表明,经30s、1000℃快速热处理可获得方块阻值为12Ω/cm^2的硅化钨,且可刻蚀性能好.在硅化钨刻蚀前利用电子束扫描发现,15min的氢氟酸和10min浓硫酸与过氧化氢混合溶液（SPM）在300W超声波条件下的新湿法清洗工艺,能去除84.7%的表面微粒及残留聚合物.整合上述优化工艺可以将硅化钨残留造成的65nm动态随机存储器芯片失效率由31.3%降到1.9%,为研究下一代产品提供有效借鉴.     

Chemical structure and electrical properties of sputtered HfO2 films on Si substrates annealed by rapid thermal annealing

The chemical structure and electrical properties of HfO₂ thin film grown by rf reactive magnetron sputtering after rapid thermal annealing (RTA) were investigated. The chemical composition of HfO₂ films and interfacial chemical structure of HfO₂/Si in relation to the RTA process were examined by X-ray photoelectron spectroscopy. Hf 4f and O 1s core level spectra suggest that the as-deposited HfO₂ film is nonstoichiometric and the peaks shift towards lower binding energy after RTA. The Hf-Si bonds at the HfO₂/Si interface can be broken after RTA to form Hf-Si-O bonds. The electrical characteristics of HfO₂ films were determined by capacitance-voltage (C-V) and current density-voltage (J-V) measurements. The results showed that the density of fixed charge and leakage current density of HfO₂ film were decreased after the RTA process in N₂ atmosphere.     

Shift in room-temperature photoluminescence of low-fluence Si+-implanted SiO2 films subjected to rapid thermal annealing

Abstract

We experimentally demonstrate the effect of the rapid thermal annealing (RTA) in nitrogen flow on photoluminescence (PL) of SiO₂ films implanted by different doses of Si⁺ ions. Room-temperature PL from 400-nm-thick SiO₂ films implanted to a dose of 3×10¹⁶ cm^?2 shifted from 2.1 to 1.7 eV upon increasing RTA temperature (950–1150 °C) and duration (5–20 s). The reported approach of implanting silicon into SiO₂ films followed by RTA may be effective for tuning Si-based photonic devices.     

快速热退火对SPV法测试氧化硅片中铁的影响

研究了快速热退火(RTA)对表面光电压SPV法测试氧化硅片中铁的影响.结果表明,氧化硅片在1100℃的条件下RTA 3min后,SPV测出的铁含量大幅度地减小.由于RTA的均匀化作用,氧化硅片表层的铁浓度显著低于氧化刚结束时硅片表层的铁浓度.根据SPV测试理论,从硅片表面到少数载流子产生处这一区域的铁浓度最终决定了铁含量的测试结果,即硅片表层的铁含量代表了整个硅片的铁含量.因此,氧化硅片经RTA处理后,SPV测出的铁含量大幅度地减小.     

GaN蓝光LED电极接触电阻的优化

通过分析LED的工作电压和晶圆上两相邻N电极间电阻来讨论快速退火(RTA)和表面处理对GaN基蓝光LED接触电极的影响.研究了p-GaN表面处理对Ni/Au与p-GaN接触电阻的影响.结果表明,用KOH清洗p-GaN表面比用HCl清洗更能有效地改善Ni/Au与p-GaN的接触电阻.讨论了在氧和氮混合气氛下两种退火温度对P电极接触电阻的影响,当退火温度从570 ℃升到620 ℃时接触电阻升高.研究了氮气氛下不同退火温度和时间对LED电极接触的影响,发现在480 ℃下连续退火对N接触有利,但却使P接触变差,而450 ℃、10 min的氮气氛退火能同时得到较好P接触和N接触.     

Application of the Taguchi method for assessment of surface treatment procedures for Ti/n-type GaN contacts

Abstract

A Taguchi approach was used to appraise the relative importance of gallium nitride surface preparation on the processing of Ti/n-type GaN contacts. It is shown that a potassium hydroxide etch, silicon tetrachloride etch or hydrochloric acid clean prior to metal deposition can significantly improve the performance of the contact for the criteria of metal adhesion, contact resistance, electrical behaviour and across wafer uniformity.     

Halogen lamp rapid thermal annealing of Si- and Be-implanted In0.53Ga0.47As

Halogen lamp rapid thermal annealing was used to activate 100 keV Si and 50 keV Be implants in In_0.53Ga_0.47As for doses ranging between 5 × 10¹²−4 × 10¹⁴ cm⁻². Anneals were performed at different temperatures and time durations. Close to one hundred percent activation was obtained for the 4.1 × 10¹³ cm⁻² Si-implant, using an 850° C/5 s anneal. Si in-diffusion was not observed for the rapid thermal annealing temperatures and times used in this study. For the 5 × 10¹³ cm⁻² Be-implant, a maximum activation of 56% was measured. Be-implant depth profiles matched closely with gaussian profiles predicted by LSS theory for the 800° C/5 s anneals. Peak carrier concentrations of 1.7 × 10¹⁹ and 4 × 10¹⁸ cm⁻³ were achieved for the 4 × 10¹⁴ cm⁻² Si and Be implants, respectively. For comparison, furnace anneals were also performed for all doses.