我国光纤通信用光器件产业的现状和发展

概述了我国光纤通信用光有源器件和光无源器件的现状和发展方向  

室内覆盖基站中拉远有源设备供电方式的研究

随着中国城市化进程快速推进,城市中高层住宅小区、商务写字楼、商务酒店等高大密集建筑物雨后春笋般的崛起,为解决高大建筑物中众多用户的通信需求,运营商越来越关注室内覆盖基站的建设。随着分布式基站的推广,WLAN网络的逐步解禁,加之高大建筑的固有特点,在室内覆盖基站建设中出现了越来越多的拉远有源设备。拉远有源设备的可靠稳定工作,决定了室内覆盖的效果和用户体验。文中就室内覆盖基站中拉远有源设备的可靠性供电方式进行探讨,以期能为后期的室内覆盖基站建设提供参考。  

光通信有源器件的可靠性试验

本文主要报导日本光纤通信用光发射和探测器件的可靠性试验。  

农村有线电视分配网的设计与讨论

介绍农村有线电视分配网络建设的特点及设计方法,通过分析、比较、优选,提出较为合理的建设方案。  

β-SiC-on insulator waveguide structures for modulators and sensor systems

In this work waveguide structures using the cubic polytype of SiC are analyzed. The β-SiC-on-insulator wageguides were fabricated by two different methods. In the first case, a technological process similar to that used for SIMOX material was used, a buried SiO₂ layer being formed by high-energy (2 MeV) ion implantation of oxygen in SiC/Si wafers. For the second case, the heteroepitaxy of SiC on SOI (SIMOX) wafers was used. The losses of the waveguides have been measured at 0.633, 1.3 and 1.55 μm in both TE and TM polarization and a detailed analysis and interpretation of the different loss mechanisms is presented. Using these two types of waveguides we have designed waveguide modulators using the Pockels effect. A 2D semiconductor device simulator was used to determine the electric field configuration in a double-Schottky diode structure and the local modulation of the refractive index was used to determine the effective index modulation of the guided mode. Optical simulations were performed using the spectral index and the effective index methods. Different 2D geometries are analyzed and the material parameters needed for fabricating such a device are determined. Such devices have potential for high-speed Si-based photonic devices compatible with silicon technology.  

日本降低光纤接入网成本的措施

主要介绍了日本在降低光纤接入网综合造价所采取的具体措施，包括采用新型组网技术，降低ONU和SLT成本，降低有源器件，无源器件和光纤成缆成本，供电技术，施工技术和设备等。  

埋嵌元件印制板技术的最新动向

概述了元件埋嵌印制板技术的开发必要性、背景、类型及其特征,最新的开发动向和今后的技术课题。  

农村有线电视分配网的设计与讨论

介绍农村有线电视分配网络建设的特点及设计方法,通过分析、比较、优选,提出较为合理的建设方案。  

高密度封装进展之一元件全部埋入基板内部的系统集成封装（上）

将无源元件及IC等全部埋入基板内部的三维封装,不仅能提高电子设备的整体性能,有利于轻薄短小化,而且 由于钎焊连接部位减少,可提高可靠性并能有效降低封装的总价格。