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1.
The durability of adhesive interfaces is still a problem in adhesive restorations in dentistry. Laboratorial ageing methods have been proposed to predict the performance of materials, but they still require standardization. The objective of this study was to evaluate the resin-dentin microtensile bond strength of composite restorations subjected to pH cycling and different levels of mechanical loading. Resin blocks were built over a flat superficial dentin of bovine incisors (n = 40), using a three-step adhesive system. Half of the specimens were submitted to 10 cycles of pH cycling, followed by mechanical loading (0, 500,000; 1,000,000; 2,000,000 cycles – 98 N, 4 Hz). The other half was directly subjected to mechanical loading. After ageing, all groups were subjected to a microtensile bond test. Data were analyzed using two-way ANOVA and Tukey’s test (α = 0.05). The frequency of the early de-bonding was compared using the Chi-square test (α = 0.05). The statistical analysis revealed that the cross-product interaction ‘pH cycling’ vs. ‘number of mechanical loading cycles’ (p = 0.72) as well as the main factor ‘pH cycling’ (p = 0.49) was not statistically significant, and they were not able to reduce the resin–dentin bond strength values. Regarding the number of mechanical loading cycles, the groups subjected to 2,000,000 cycles showed lower bond strength values than the others (p = 0.003). The frequency of debonded specimens increased with mechanical loading. Therefore, it can be concluded that in this restorative model, at least 2,000,000 mechanical cycles are need to decrease the microtensile strength and simulate the ageing of the interface.  相似文献   
2.
黄铜箔拉伸屈服强度的尺寸效应   总被引:2,自引:0,他引:2  
郭斌  周健  单德彬  王慧敏 《金属学报》2008,44(4):419-422
为了研究金属箔的塑性变形性能与尺寸的相关性,在常温下对不同厚度和晶粒尺寸的黄铜箔试样进行了单向拉伸实验.结果表明:随着厚度或晶粒尺寸的减小,箔的屈服强度都会升高,晶粒尺寸对屈服强度的影响满足Hall-Petch细晶强化关系,厚度减小使屈服强度升高也可以主要归结于晶粒尺寸的减小.此外,当箔的厚度小于100 靘时,厚度/晶粒尺寸比不能表征屈服强度的尺寸效应.  相似文献   
3.
Purpose: To investigate the effects of phosphoric acid esters (PAEs)-containing primers on the micro-tensile bond strengths (MTBS) of etched enamel, the micro-morphologies of the resin–enamel interfaces, and the enamel surfaces.

Materials and Methods: Thirty-three bovine incisors were used in this study. After the labial enamel surfaces were highly polished, they were etched, water sprayed, and air-dried. Afterward, the enamel surfaces were treated with or without (control) one of three PAEs-containing primers (40%MDP, Ivoclar Vivadent; Resulcin AquaPrime A + B, DMG; Xeno V, Dentsply), water sprayed, and air-dried. Subsequently, an adhesive Heliobond (Ivoclar Vivadent) was applied and resin composite (Core Build-up, Bisco) was placed incrementally. They were prepared into multiple beams of about 1 × 1 × 8 mm for MTBS tests. The enamel surfaces and resin–enamel interfaces were analyzed by SEM and TEM. The data were analyzed by two-way ANOVA and LSD test.

Results: Using PAEs-containing primers could increase the enamel MTBS (p < 0.05). The primer MDP produced higher MTBS than the primer Resulcin AquaPrime A + B and Xeno V. The SEM findings revealed the primed enamel surfaces were covered with a thin or glue-like layer of monomer-calcium salts of PAEs and the residual enamel crystallites, and various micro-porosities were detected within the hybrid layers. The TEM findings revealed the hydroxyapatite crystallites were tightly covered by the adhesive, the adhesive mixed with resin composite, or sparse irregular enamel crystallites.

Conclusion: The application of PAEs-containing primers on the etched enamel substrate could significantly increase the immediate enamel bond strengths. However, this effect was dependent on the individual PAEs-containing primer used.  相似文献   

4.
Objective: The purpose of this in vitro study was to evaluate the effect of thermal cycling on the micro-tensile bond strength (Mtbs) of multimode adhesive agents. Materials and methods: Eight freshly extracted caries-free human third molars were used. The flat dentin surfaces were prepared and polished with 600-grit SiC abrasive paper for standard smear layer formation. The teeth were restored using Single Bond Universal Adhesive [(total etch (G1, G2)/self etch (G3, G4)]?+?Filtek Z550 and All-Bond Universal Adhesive [(total etch (G5, G6)/self etch (G7, G8)]?+?Aelite all-purpose. The specimens in groups G1, G3, G5, and G7 were subjected to thermal cycling (1000 cycles at 5–55 °C, for a 30?s dwell time), while the specimens in other groups were not exposed to an aging procedure. The Mtbs test was determined in all procedures. Data were submitted to three-way ANOVA and post hoc tests. The significance level was set at?=?0.05. Results: Group five was highly affected by the thermal cycling following the total etch procedure, while group one was not significantly affected. Group seven was highly affected by thermal cycling, while group three was not significantly affected after the self etch procedure. Group eight exhibited a higher mean Mtbs value after the thermal cycling procedure. Conclusion: The bond strength of multimode (universal) adhesives was found to be material dependent. The total etch procedure showed a higher Mtbs value than the self etch procedure.  相似文献   
5.
Fumed silica is one of the most commonly used fillers for dental resin adhesives. However, fumed silica produced by flame hydrolysis of chlorosilanes are typically agglomerated aggregates instead of isolated primary particles. The fumed silica aggregates may affect the dispersion of fillers in the resin matrix, thus affect the bonding performance of the dental adhesives. In this study, fumed silica fillers chemically treated with methacrylsilane were loaded into an etch & rinse model dental adhesive. Filler 1 was only chemically pre-treated, while Filler 2 was combined chemically and mechanically pre-treated to break the agglomerated aggregates. The experiment result indicated that Filler 1 has faster rheology control effect than Filler 2 on the handling property of the filled resin adhesive showing as the rapid increased viscosity, which may due to the fast inorganic phase growing in the Filler 1 filled resin matrix. As for the mechanical properties, neither Filler 1 nor Filler 2 has an positive effect on the micro-tensile bond strength in short term and long term, despite of the fact that lower weight percent of Filler 2 loading is favourable to the penetration of the experimental adhesive into dentin substrate. In conclusion, mechanically pre-treatment to break the agglomerated fumed silica is helpful to increase the limit of filler loading percent while maintaining appropriate handling property, but the chemically and mechanically pre-treatment cannot provide positive effect on bonding performance within the range of this study.  相似文献   
6.
激光复合焊可用于不锈钢焊接,但激光复合焊接头热影响区小,组织变化梯度大.研究接头微区性能可以确定接头薄弱环节,为焊接接头的工艺评定和断裂分析提供理论依据.为此,本文对4 mm厚SUS301L-HT不锈钢进行激光-MAG复合焊接,采用维氏硬度、微型剪切和微拉伸等试验,研究了焊接接头焊缝、热影响区及母材的微区力学性能,并结合金相、断口扫描等分析了各微区力学性能的差异.结果表明:焊缝区域组织主要为柱状奥氏体树枝晶+少量的δ铁素体;母材的剪切强度和抗拉强度最高,分别为560和1 066 MPa,其次为复合焊接头热影响区,焊缝区域最差,接头硬度分布规律与各微区强度变化趋势一致;运用数学方法,得出了接头微拉伸强度与微型剪切强度、硬度之间关系的经验公式.接头各微区剪切断口和拉伸断口SEM分析呈现典型的韧性断裂特征.  相似文献   
7.
8.
目的 基于电流辅助微拉伸实验,研究SUS304不锈钢箔的流动应力和微观结构的影响规律,为SUS304不锈钢箔的电流辅助微成形工艺提供指导。方法 通过电流辅助微拉伸工艺,研究在应变速率为0.001 s−1、频率为100 Hz、占空比为50%的条件下,不同电流密度和晶粒尺寸对SUS304不锈钢箔力学性能的影响规律,通过扫描电子显微镜和准原位电子背散射衍射分析电流密度和晶粒尺寸对SUS304不锈钢箔微观组织的影响规律。结果 SUS304不锈箔的流动应力随着晶粒尺寸的增加而降低。脉冲电流的引入可以降低SUS304不锈钢箔的流动应力,同时也降低了SUS304不锈钢箔整体的伸长率。随着电流密度的增加,韧窝尺寸变得大而深,断裂模式由准解理断裂向韧性断裂转变,脉冲电流改善了SUS304不锈钢箔的局部韧性。另外,脉冲电流可以减小KAM值,脉冲电流的引入可以减小几何必须位错密度,对于晶粒尺寸为11.98 μm的不锈钢箔,其几何必须位错密度降低得更显著,晶粒间变得更均匀,变形协调性更好。结论 采用电流辅助微拉伸有效降低了SUS304不锈钢箔的流动应力。晶粒尺寸较小的SUS304不锈钢箔具有更好的变形协调性。  相似文献   
9.
高精度微拉伸台数据处理方法研究   总被引:1,自引:0,他引:1  
针对现有微拉伸台系统误差较大的问题,作者研究了提高微拉伸台测量精度的数据处理方法.设计了高速、高精度数据采集系统,对比了线性拟合、多项式拟合、分段拟合和逐点比较数据处理方法,分析了各种数据处理方法在消除系统误差中的优缺点.数据处理方法采用VC++语言编程实现,可以在线矫正系统误差.实验结果表明,灵活运用上述处理方法可以有效地提高微拉伸台测量精度.  相似文献   
10.
垂直晶界铜双晶的拉伸变形行为   总被引:1,自引:0,他引:1  
利用数字图像相关法研究了垂直晶界铜双晶试样的拉伸变形行为,获得了拉伸过程中试样表面的全场变形分布。结果表明:试样整体变形呈"双颈缩"现象,试样表面的应变分布不均匀,晶界附近的应变水平低于晶粒内部的,试样总是在软取向的晶粒内首先发生塑性变形并断裂。借助扫描电镜(SEM)原位拉伸实验观察到在拉伸过程中滑移带不能穿过晶界。以上结果说明,铜双晶试样拉伸变形行为与组元晶粒的晶体取向和晶界的属性有关,软取向的晶粒更容易发生塑性变形,而大角度晶界在拉伸过程中具有强化效应,对晶粒的滑移变形有阻碍作用。  相似文献   
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