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1.
Isocyanate-based graphene oxide-containing polyimide foams were synthesized by a semi-prepolymer method. In this method, while the first solution containing pre-polymer was derived from pyromellitic dianhydride and excess polymethylene polyphenylene isocyanate (PM200), the second solution contains dianhydride derivatives, water, catalysts, surfactants, and graphene oxide. PIFs were prepared with 0%, 0.25%, 0.50%, 0.75%, and 1% graphene oxide by weight, respectively. PIFs exhibited a minimum side reaction and urea generation was not seen for all PIFs instead of imide bonding. The addition of graphene oxide (GO) leads to a more close-packed structure. Therefore, crosslinking density and thermal stability of graphene oxide-containing polyimide foams increased. Upon the addition of 1% GO, almost seven times higher compression strength was obtained compared to neat PIFs. Also, LOI values supported the theory that thermally stable and flame retardant PIFs can be synthesized via the isocyanate-based process with GO.  相似文献   
2.
Achieving synergetic improvements of mechanical strength, toughness, and thermal stability of epoxy resin has been a crucial but very challenging issue. Herein, to explore a new solution for circumventing this issue, polyimide microspheres were successfully prepared through the inverse nonaqueous emulsion process, and the structure, size distribution and morphologies of polyimide (PI) microspheres were comprehensively investigated. Then the PI microspheres were incorporated in epoxy resin matrix to systematically investigate the mechanical and thermal properties of obtained epoxy/PI microspheres composites. It was found that the PI microspheres can not only enhance the mechanical strength of epoxy resin, but also significantly improve the toughness. Specially, the epoxy-based composites containing 3 wt% PI microspheres exhibit a 47% increase in tensile strength, while the GIC and Charpy impact strength increase by 106% and 200%, respectively. The toughing mechanism of epoxy/PI microspheres composites was discussed. Moreover, the PI microspheres can also endow the epoxy resin with excellent thermal stability and heat resistance. Thus, this work may open a new opportunity to synergistically enhance the mechanical and thermal properties of epoxy-based composites and may also give some valuable inspiration for the rational design of other high-performance thermosetting composites.  相似文献   
3.
In order to meet the requirements of polymer dielectric materials for high thermal stability and excellent dielectric properties in the application of high-temperature film capacitors, a series of polyimide (PI) films are fabricated by introducing a self-synthesized aniline trimer (ACAT) with a conjugated structure in this work. Since the conjugated ACAT in the main chains of PI improves the electron polarization and carrier mobility of the PI molecular chains, the dielectric constant of the ACAT-PI films is greatly enhanced (4.4–7.4). Meanwhile, the dissipation factor does not increase apparently (0.002–0.013). The dielectric properties are stable even when the temperature is up to 200 °C, the thermal degradation temperature is as high as 450 °C, and the mechanical properties are also excellent (70–105 MPa). Among all the films, the PI film with 5 mol% ACAT exhibits the maximal energy density of 3.6 J cm−3 under the field of 426 kV mm−1, the high tensile strength (90 MPa) and the excellent thermal stability (Td5 = 515 °C). The work paves the way to prepare high-temperature polymer dielectric film materials with high energy storage density.  相似文献   
4.
Gas transport properties of polyimides (PIs) and their silica hybrids were investigated. The PIs synthesized with several methyl-substituted phenylenediamines were hybridized with silica via a sol–gel process with different alkoxysilanes. The prepared hybrid membranes showed controlled gas permselectivity, depending on the selected phenylenediamines and alkoxysilanes. It was worth noting that the hybrids prepared with tetraethoxysilane possessed improved CO2 permselectivity with increasing silica content, which tended to exceed the upper-bound trade-off line. This fact suggested the additional formation of free volume holes especially favorable for the CO2/CH4 separation around the polymer/silica interfacial area.  相似文献   
5.
Polyimide (PI) composites with mixed fillers of BN flakes and SiC whiskers exhibit enhanced thermal conductivity and mechanical properties. In order to improve dispersion and interaction of these mixed fillers within the PI matrix, BN flakes were modified by a titanate coupling agent while SiC whiskers were oxidized at 750°C for 60 minutes to produce SiC@SiO2 followed by silane coupling agent modification. PI composites reached a maximum thermal conductivity of 0.95 W/m K at volume fraction of mixed fillers of 27.6 vol% when the weight ratio of BN flakes to SiC@SiO2 whiskers was 1:4. The enhanced thermal conductivity is likely attributed to the formation of heat conductive networks constructed by BN flakes and SiC@SiO2 whiskers and the improved interfacial affinity between fillers and matrix. The optimized Nielsen-mold confirms the distribution and morphology of fillers affect the thermal conductivity of PI composites. In addition, SiC whiskers enhanced the mechanical property of PI composites and the influence of fillers on the mechanical property was further elaborated.  相似文献   
6.
Two series of aromatic polyimides containing various linkage groups based on 2,7‐bis(4‐aminophenoxy)naphthalene or 3,3′‐dimethyl‐4,4′‐diaminodiphenylmethane and different aromatic dianhydrides, namely 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride), 4,4′‐(hexafluoroisopropylidene)bis(phthalic anhydride), 3,3′,4,4′ benzophenonetetracarboxylic dianhydride, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride and 4,4′‐(4,4′‐hexafluoroisopropylidenediphenoxy)bis(phthalic anhydride), were synthesized and compared with regard to their thermal, mechanical and gas permeation properties. All these polymers showed high thermal stability with initial decomposition temperature in the range 475–525 °C and glass transition temperature between 208 and 286 °C. Also, the polymer films presented good mechanical characteristics with tensile strength in the range 60–91 MPa and storage modulus in the range 1700–2375 MPa. The macromolecular chain packing induced by dianhydride and diamine segments was investigated by examining gas permeation through the polymer films. The relationships between chain mobility and interchain distance and the obtained values for gas permeability are discussed. © 2014 Society of Chemical Industry  相似文献   
7.
This study describes the equilibrium, kinetics, and thermodynamics of the palladium(II) (Pd(II)) adsorption onto poly(m‐aminobenzoic acid) (p‐mABA) chelating polymer. The p‐mABA was synthesized by the oxidation reaction of m‐aminobenzoic acid monomer with ammonium peroxydisulfate (APS). The synthesized p‐mABA chelating polymer was characterized by FTIR spectroscopy, gel permeation chromatography (GPC), thermal analysis, potentiometric titration, and scanning electron microscopy (SEM) analysis methods. The effects of the acidity, temperature, and initial Pd(II) concentration on the adsorption were examined by using batch adsorption technique. The optimum acidity for the Pd(II) adsorption was determined as pH 2. In the equilibrium studies, it was found that the Pd(II) adsorption capacity of the polymer was to be 24.21 mg/g and the adsorption data fitted better to the Langmuir isotherm than the Freundlich isotherm. The kinetics of the adsorption fitted to pseudo‐second‐order kinetic model. In the thermodynamic evaluation of the adsorption, the Δ values were calculated as ?16.98 and ?22.26 kJ/mol at 25–55°C temperatures. The enthalpy (ΔH°), entropy (ΔS°), and the activation energy (Ea) were found as 35.40 kJ/mol, 176.05 J/mol K, and 61.71 kJ/mol, respectively. The adsorption of Pd(II) ions onto p‐mABA was a spontaneous, endothermic, and chemical adsorption process which is governed by both ionic interaction and chelating mechanisms. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42533.  相似文献   
8.
Polymer dielectrics, with advanced dielectric properties and heat resistance, are critical for high‐temperature capacitors in various applications. However, the high performance of heat resistance and dielectric properties are quite difficult to achieve all together due to their mutual implication. Here, by intensively investigating the correlation between molecular structure and properties, polyimide dielectrics with i) enhanced dielectric constant by introducing sulfonyl group, ii) low dissipation factor by introducing flexible linkage, and iii) high Tg (glass transition temperature) by retaining an aromatic structure, are obtained. The sulfonyl‐containing polyimides with different flexible linkages exhibit simultaneously a high dielectric constant (4.50–5.98), low dissipation factor (0.00298–0.00426), and outstanding breakdown strength (most above 500 MV m?1), as well as superior heat resistance (Tg : 244–304 °C). Specifically, the polyimide (SPI‐1) with sulfonyl group in diamine moiety and para‐para linkage shows stable dielectric properties up to 150 °C, and the discharged energy density and charge–discharge efficiency can be as high as 7.04 J cm?3 and 91.3% at 500 MV m?1, respectively.  相似文献   
9.
Proton exchange membrane fuel cells (PEMFCs) with Pt/C gas diffusion electrodes and graphite single‐serpentine monopolar plates were constructed based on an aromatic poly(etherimide) with isopropylidene groups (PI)/imidazole (Im) and a popular Nafion‐115 matrix. The electrochemical properties of PEMFCs were tested at 25 and 60°C. The maximum power density of 171 mW/cm2 and the maximum current density of 484 mA/cm2 were detected for Nafion‐115/PI membrane. For both constructed PEMFCs the efficiency at 0.6 V was found about 41%. Immersion of Nafion‐115 in PI or PI/Im increased the thermal stability and mechanical properties of membranes. Thermal, mechanical properties and morphology of membranes were characterized by TGA, and AFM techniques including force spectroscopy. Interactions between the components in composite membranes were established by FT‐IR. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42436.  相似文献   
10.
The preparation of crosslinked polyimide (PI) composites via a blending technique is reported. Different kinds of organic or inorganic silicon-based nanofillers have been used for this purpose. A comparison is made between carefully chosen pairs of fillers, the choice depending on the compatibility of the crosslinked PI with the filler, to study the effects of the crosslinked PI matrix structure and fillers with different micromorphology. The dispersion of the filler is characterized with SEM as uniformly dispersed or gelled. It is found that with different micromorphology of filler, the PI matrix can be loaded with different mass fractions of filler, and the point at which gelation occurs is not the same. In order to study this behavior, these fillers are subjected to a quadratic mean equation calculation and analysis. Compared to pure PI, all obtained crosslinked composites have a higher glass-transition temperature and a lower dielectric constant. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 46875.  相似文献   
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