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1.
三维表面测量的发展   总被引:9,自引:0,他引:9       下载免费PDF全文
 在过去八年里,三维表面测量已经由一个新鲜事物发展成为评估工程表面特性的重要依据,并得到广泛应用。表面形貌对于表面特性,如摩擦、磨损、腐蚀、疲劳、涂层等,具有举足轻重的影响。为了充分分析和研究表面特性,表面测量与评估应按三维考虑。近年来,许多世界上著名的学术团体已致力于研究一个系列的三维表面粗糙度标准。作者在本文介绍近年来三维表面评定和标准化的进展。  相似文献
2.
光针式轮廓仪的研制   总被引:5,自引:0,他引:5  
介绍了一种新型的基于动态聚焦探测法的光学轮廓仪,该仪器可实现表面形貌的快速、非接触测量,其最大测量范围为500μm,最小分辨率可达10nm,文中详细地描述了该轮廓仪的工作原理、关键技术的实现及其应用。  相似文献
3.
三维表面粗糙度的均一性研究   总被引:5,自引:1,他引:4  
基于分形几何理论,通过分析各种机加工表面的轮廓谱矩和表面谱矩的关系,给出了三维表面形貌的均一性定义和定量评价方法。实验表明:精车和平磨工件的高度,斜度均一性较好,而镗和铣加工表面高度,斜率的均一性都比较差;刨加工表面的高度均一性较好,但斜率均一性较差。  相似文献
4.
扫描探针显微镜是近十几年来在表面特征、表面形貌观测方面最重大的进展之一,是纳米测量学的基本工具。叙述了扫描探针显微镜的工作原理、检测模式及在观察检测纳米级的粗糙度、微小尺寸、表面形貌方面的特点和方法,比较了原子力显微镜、常规的表面轮廓仪、干涉显微镜、扫描电子显微镜在表面特性、表面形貌观测方面的性能,着重介绍了扫描探针显微镜在粗糙度、纳米尺寸、表面形貌观测方面的应用和存在的问题。  相似文献
5.
基于分形的表面形貌特征描述与评定参数的研究   总被引:4,自引:1,他引:3  
运用Weierstras-Mandelbrot函数对表面形貌进行描述,并利用结构函数求出表面形貌的分形维数和形貌系数。研究了分形参数与表面支承长度率曲线的关系。理论分析和实验结果表明:支承长度率曲线主要与分形维数有关,而形貌系数对该曲线的影响较小。用分形理论研究表面形貌时,分形维数是主要的评定参数,它能提供表面接触承载能力的单值定量的评估,从而比支承长度率曲线更简洁而实用。  相似文献
6.
扫描探针显微镜测壳聚糖材料的表面电荷分布   总被引:2,自引:0,他引:2  
提出一种测量材料表面电荷是非均匀的、没有中性区的弱电荷的方法.即测试时,利用扫描探针显微镜(SPM)的静电力显微镜(EFM)测量技术,依靠轻敲模式(Tapping Mode)和抬举模式(Lift Mode),用相位成像测量有机高分子膜--壳聚糖膜(CHI)的表面电荷密度空间分布,但由于仪器设计中相位的泰勒展开是:sin△φ≈1/2△φ,所以所获的电荷图像只能确定材料的表面电荷分布和表面电荷密度的近似值.然而,嵴宽约为2.12μm表面正电荷微沟槽结构的这种特殊电荷形貌分布有利于细胞的生长,因此获得的表面电荷分布补充了生物材料表面理化性质.  相似文献
7.
表面形貌焦点跟踪测量方法的研究   总被引:1,自引:1,他引:0  
谢峰  谢铁邦  张新宝 《计量学报》2000,21(3):173-177
介绍了一种新型的基于聚焦探测法的自然焦点跟踪传感器,该传感器可实现表形貌的快速、非接触测量,其垂直测量范围为500μm,最高分辨率为3nm。中详细叙述了该传感器的工作原理、关键技术的实现及其应用。  相似文献
8.
Hydrogenated nanocrystalline silicon thin films were deposited with high hydrogen dilution ratio by plasma enhanced chemical vapor deposition technique. The effects of high hydrogen dilution on the surface topography and mechanical properties of the films were studied with atomic force microscopy and TriboIndenter nano indenter. The results indicate that the average grain size in films deposited with high hydrogen dilution is about 3.18 ± 0.02 nm. The surface roughness and densification of the films decrease with the increase of hydrogen dilution ratio at certain range, resulting in the enhancement of the elastic modulus E and hardness H. Oppositely, the increase of hydrogen dilution can increase the surface roughness induced by the increase of the cavities on the film surfaces, and lead to the decrease of the elastic modulus and hardness correspondingly. In this paper, the detailed analysis and discussion were carried out to investigate the mechanism of the observed phenomena.  相似文献
9.
In copper chemical mechanical planarization process, stains are often generated on the pad surface due to the build-up of polishing by-products. Pad staining is a major concern because it might affect defect, non-uniformity across the wafer, and removal rate variation during polishing. In this study, the characteristics of stains formed on an IC1000 XY grooved pad obtained under various polishing conditions were investigated. In addition, wafers were polished on an IC1000 plain pad to determine the effect of hydrodynamic pressure on staining pattern. Experiments were performed on a table-top axisymmetric polishing system consisting of a 300-mm non-rotating platen and 100-mm rotating wafers. Stains were successfully generated on the pad surface and X-ray photoelectron spectroscopy (XPS) analysis confirmed that the stains contained copper polishing by-products. As the stains deposited on the pad land areas were darker in the direction of wafer rotation as well as in the pad radial direction, it was believed that staining agents were produced during polishing and subsequently advected downstream by the slurry flow. Although staining increased with polishing pressure, wafer rotation rate, polishing time and slurry flow rate, it did not seem to affect removal rate. The white light interferometric analysis indicated that the stains did not physically change the pad surface topography. It was observed that the hydrodynamic pressure significantly impacted the staining pattern on an IC1000 plain pad.  相似文献
10.
This paper presents the results of a study of microstructure and surface topography of electron-beam deposited nano-scale (10-500 nm thick) thin films of Ti and Ni. The films are deposited on substrates with different moduli (Ni, NaCl, and Si). The microstructure of each film is characterized using transmission electron microscopy. The surface topography is also studied using atomic force microscopy. The microscopic observations show that the grain size and film roughness increase with increasing film thickness. The grain coarsening observed in Ni films was greater than that observed in Ti films. Furthermore, the effects of coarsening amplitude on (001) oriented NaCl crystals were much greater than those on stiffer (001) oriented silicon substrates. The implications of the results are then discussed for applications of thin films in biomedical engineering, microelectronics, and micro-electro-mechanical systems (MEMS).  相似文献
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