Modified atmosphere packaging of a mixed prepared vegetable salad dish

The aim of this study was to design a modified atmosphere package for a mixed vegetable salad consisting of 75 g of cut carrot, 55 g of cut cucumber, 20 g of sliced garlic and 50 g of whole green pepper. Respiration data of all the components were combined with film permeability data to predict package atmospheres and design optimal packages for experimental testing for improved shelf-life of the produce. The optimal package avoided minimum O₂ and maximum CO₂ tolerance limits, and chilling injury temperatures for any component. A pouch form package made of 27 mm low density polyethylene developed a modified atmosphere of 2.0–2.1% O₂ and 5.5–5.7% CO₂, which was beneficial for all components and provided better quality retention than other test packages.     

JAVA新类库中Swing的事件传送机制

ＳＵＮ公司最新发布的一套ＡＰＩ中的Ｓｗｉｎｇ组件集采用了ＭＶＣ结构，其中Ｍ、Ｖ、Ｃ三者间的事件传送及与外界的通信机制相当重要。本文从Ｓｗｉｎｇ的组件如何响应外部事件、如何处理自身的变化及如何把自身变化传递给外界三个方面详细阐述Ｓｗｉｎｇ的事件传送机制。     

Computer Solutions in Choosing Automatic Process Regulators

The paper discusses the use of the URA software for choosing automatic regulators and calculating their setting parameters, as it is intended for simulating transient response by computer.     

盘式自动折叠纸盒结构设计中的数学模型

盘式自动折叠纸盒因其方便性得到了广泛的应用.本文讨论了盘式自动折叠纸盒的折叠角及体板高度等数学问题,为该类包装纸盒CAD开发建立了有效的数学模型.     

供电用户配电方式的探索

阐述了电力企业对大工业用户供电与商业户供电的现状、存在的问题、以及解决的办法。根据电力负荷不同的情况,提出利用开关站供电的配电方式、箱式变电站配电并集中计量的想法,在商业户的配电上采取"分电计量箱"配电的模式,利用新技术加强管理,从源头上防范窃电。     

模块化技术在包装机械中的应用

对制袋-充填-封口包装机进行了功能分析和模块划分,且通过模块的优化组合和管理实现了包装机械的模块化设计.     

新型莫来石瓷在高密度封装中的应用

描述了低介电常数，低膨胀系数新型莫来石瓷在高密度封装中的应用，从设计考虑、封装结构、工艺及电性能方面进行了探讨，以期获得满足高速、超高速集成电路使用要求的高性能封装。     

Study on the fluid/structure interaction at different inlet pressures in molded packaging

This paper presents the computational study of fluid/structure interaction (FSI) analysis in the molding process using the Mesh-based parallel Code Coupling Interface (MpCCI) method with finite volume coding (FLUENT 6.3) and finite element coding (ABAQUS 6.9). The FSI analysis is implemented on the molded package during the encapsulation process with different inlet pressures. Real-time flow visualization, deformation and stress of the silicon die during the encapsulation process are presented in this paper. A fluctuation phenomenon of the silicon die is found in the encapsulation process when the inlet pressure increases. The maximum deformation during the process is determined at different locations on the silicon die, calculated during the final stage of the filling process. The deformation and stress of the die is exponentially increased with increasing inlet pressure. The maximum stress on the solder bump is concentrated near to the inlet gate. Thus, the present FSI analysis approach is expected to be a guideline or reference and provides better understanding of the encapsulation process for package design in the microelectronic industry.     

Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

<正>Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Array ( LGA ) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled.     

基于家庭关联关系识别模型的电信融合套餐营销

本文回顾了中国电信承接原联通C网以来的全业务融合套餐现状,分析了识别原有CDMA手机号码与固定电话号码的关联关系对于电信融合套餐营销的意义,详细描述了利用决策树算法来构建家庭关联关系识别模型的过程和方法,并简要介绍了如何应用模型结果进行融合套餐的针对性营销.