单微乳液中制备Ag/TS-1及丙烯气相环氧化

采用N2H4还原含AgNO3的单微乳液制备了Ag／TS-1催化剂。TEM表征结果表明，Ag高度分散于TS-1之上。以H2、O2存在下的丙烯气相环氧化为探针反应，考察了Ag／TS-1的催化性能。结果表明，采用Ag／TS-1为催化剂，Ag的负载量为1％（质量分数，下同），823 K焙烧后，373 K下反应30 min时，丙烯转化率为1．69％，环氧丙烷（Propylene oxide，PO）选择性为93．2％。当Ag的负载量超过2％时，反应过程中生成大量的热，造成PO的选择性下降。采用Ag的负载量为8％的Ag／TS-1催化剂，消除热效应后，丙烯的转化率为2．46％．PO的选择性为79．2％。     

La改性的Ag/TS-1催化剂上丙烯选择氧化制环氧丙烷

在H2 和O2 混合气体存在下 ,在常压固定床、石英反应器上考察了La改性的Ag/TS - 1催化剂催化丙烯环氧化反应。研究结果表明 ,Ag和La负载在TS - 1上的先后顺序对丙烯环氧化反应有影响。H2 在丙烯气相氧化反应体系中起着重要的作用。     

厚膜导体的金属迁移研究

金属迁移能导致混合微电路发生灾难性失效。本文介绍一种简单易行的测试方法－水滴试验法，来测量厚膜电路的实际金属迁移率。用引方法测量时，发现Ｐｄ－Ａｇ导体的迁移率最大，Ｐｔ－Ａｕ导体的金属迁移率最小。     

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Low-cycle fatigue (LCF) tests on as-cast Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-3Ag-0.5Cu-1Bi, and Sn-3Ag-0.5Cu-3Bi solders was carried out using a noncontact strain-controlled system at 20°C with a constant frequency of 0.1 Hz. The addition of Cu does not significantly affect the fatigue life of eutectic Sn-Ag solder. However, the fatigue life was significantly reduced with the addition of Bi. The LCF behavior of all solders followed the Coffin-Manson relationship. The fatigue life of the present solders is dominated by the fracture ductility and can be described by the ductility-modified Coffin-Manson’s relationship. Steps at the boundaries of dendrite phases were the initiation sites for microcracks for Sn-3.5Ag, Sn-3Ag-0.5Cu, and Sn-3Ag-0.5Cu-1Bi solders, while for Sn-3Ag-0.5Cu-3Bi solder, cracks initiated along both the dendrite boundaries and subgrain boundaries in the dendrite phases. The linking of these cracks and the propagation of cracks inside the specimen occurred both transgranularly through eutectic phases and intergranularly along dendrite boundaries or subgrain boundaries.     

电双稳薄膜阻抗转变机理研究

采用真空蒸发的方法交替沉积Ag和TCNQ分子制备了Ag TCNQ金属 有机络合物薄膜 ,并研究了多种外加电压激发下膜的电阻转变特性。发现在转变过程中存在着一种能量效应 ,即当外电压超过某一阈值后 ,完成转变的能量不变。对此现象的可能解释是薄膜内分子在一定的外部电场能量诱导下发生重排 ,致使电导率发生跃变     

All Ag Nanoparticles Are Not the Same: Covalent Interactions between Ag Nanoparticles and Nitrile Groups Help Combat Drug- and Ag-Resistant Bacteria

Antimicrobial resistance has long been viewed as a lethal threat to global health. Despite the availability of a wide range of antibacterial medicines all around the world, organisms have evolved a resistance mechanism to these therapies. As a result, a scenario has emerged requiring the development of effective antibacterial drugs/agents. In this article, we exclusively highlight a significant finding reported by Zbořil and associates (Adv. Sci. 2021, 2003090). The authors construct a covalently bounded silver-cyanographene (GCN/Ag) with the antibacterial activity of 30 fold higher than that of free Ag ions or typical Ag nanoparticles (AgNPs). Ascribed to the strong covalent bond between nitrile and Ag, an immense cytocompatibility is shown by the GCN/Ag towards healthy human cells with a minute leaching of Ag ions. Firm interactions between the microbial membrane and the GCN/Ag are confirmed by molecular dynamics simulations, which rule out the dependence of antibacterial activity upon the Ag ions alone. Thus, this study furnishes ample scope to unfold next-generation hybrid antimicrobial drugs to confront infections arising from drug and Ag-resistant bacterial strains.     

STUDY OF INTERFACES AND SURFACES OF YBa_2Cu_3O_(7-x)-Ag

Interfaces and surfaces of YBa_2Cu_3O_(7-x)(YBCO)-Ag have been studied by SEM-EDXand AES.No effect of Ag on 123 structure in X-ray diffraction pattern was observedfor 0.4 mol Ag doped YBCO.AES analysis indicated that Ag segregated on surfaceof YBCO and resulted in decrease of YBCO-metal lead resistance.In addition,solutionand segregation of Ag as elemental state were often appeared on interfaces and surfacesof high temperature annealed YBCO,whether elemental Ag or compound Ag_2O andAgNO_3 adopted as doping material.     

半导体硫化银纳米管的制备与光学性能

在以Triton X-100为表面活性剂形成的反相胶束体系中,成功地制备了半导体硫化银纳米管,管径88 nm～120nm、长度大于2.6 μm.X射线衍射测定表明,产物为纯单斜结构.紫外-可见光谱在275 nm处发现新的吸收峰,最大发射波长与体相材料相比,蓝移了38 nm.     

贵金属Cu、Ag、Au的电子结构和物理性质

由纯金属单原子理论(OA)确定了面心立方结构(FCC)贵金属Cu、Ag、Au的电子结构依次为[Ar](3dn)5.58(3dc)4.21(4sc)0.23(4sf)0.98、[Kr](4dn)4.87(4dc)4.56(5sc)0.66(5sf)0.91、[Xe](5dn)4.20(5dc)4.90(6sc)1.57(6sf)0.33,并确定了Cu、Ag、Au的密排六方结构(HCP)和体心立方结构(BCC)两种初态特征晶体和初态液体的电子结构。根据自然态的电子结构定性解释了熔点、拉伸强度、维氏硬度、体弹性模量、电导和热导率物理性质差异与电子结构的关系,定量计算了晶格常数、结合能、势能曲线及线热膨胀系数随温度的变化。根据非自然态的电子结构,定性解释了晶体结构BCC和HCP的关系。     

少量Ag对低Cu／Mg比的Al—Mg—Cu—Li合金组织与性能的影响

通过显微硬度测试、拉伸试验、能谱分析、SEM及TEM观察，研究了少量Ag对低Cu／Mg比的Al-Mg-Cu-Li合金微观组织与性能的影响。实验结果表明：Ag的添加提高了该合金的硬度和强度，同时改善了其塑性，并延缓了过时效的发生。微观组织观察表明：Ag的添加促进Z相的均匀弥散析出，同时抑制了S＇相在缺陷处非均匀析出；并且Ag的添加还促使了时效初期合金中δ’相的细化和弥散分布，延缓了δ’相的长大。同时分析了析出相种类对合金塑性的影响。