高稳高效海上风电安装平台关键制造技术研究

海上风电作为可再生清洁能源之一,受到世界各国的高度重视与大力发展。我国将海上风电提升至解决能源危机、减缓气候变化、调整能源结构的国家战略高度,到2030年我国单位国内生产总值二氧化碳排放将比2005年下降65%以上,非化石能源占一次能源消费比重将达到25%左右。安装平台不足将是我国海上风电场无法如期建成投产的主要障碍。对自升自航式海上风电安装平台系列高端装备及其设计制造的三大技术难题——腿站立作业易“失稳”、大平台大跨距大倾覆力矩自升易“失控”、高空吊装巨型叶片逾百螺栓精准定位易“失准”,以及焊缝缺陷修复和局部裂纹损伤的激光锻造修复再制造进行了介绍,研制的具有不同规格的系列装备在中国、英国、丹麦、德国等国家的著名海上风电场建设应用情况良好。     

Microstructural and mechanical properties assessment of transient liquid phase bonding of CoCuFeMnNi high entropy alloy

The transient liquid phase (TLP) bonding of CoCuFeMnNi high entropy alloy (HEA) was studied. The TLP bonding was performed using AWS BNi-2 interlayer at 1050 °C with the TLP bonding time of 20, 60, 180 and 240 min. The effect of bonding time on the joint microstructure was characterized by SEM and EDS. Microstructural results confirmed that complete isothermal solidification occurred approximately at 240 min of bonding time. For samples bonded at 20, 60 and 180 min, athermal solidification zone was formed in the bonding area which included Cr-rich boride and Mn₃Si intermetallic compound. For all samples, the γ solid solution was formed in the isothermal solidification zone of the bonding zone. To evaluate the effect of TLP bonding time on mechanical properties of joints, the shear strength and micro-hardness of joints were measured. The results indicated a decrement of micro-hardness in the bonding zone and an increment of micro-hardness in the adjacent zone of joints. The minimum and maximum values of shear strength were 100 and 180 MPa for joints with the bonding time of 20 and 240 min, respectively.     

New insights into microstructural changes during transient liquid phase bonding of GTD-111 superalloy

The effects of joining temperature (T_J) and time (t_J) on microstructure of the transient liquid phase (TLP) bonding of GTD-111 superalloy were investigated. The bonding process was applied using BNi-3 filler at temperatures of 1080, 1120, and 1160 °C for isothermal solidification time of 195, 135, and 90 min, respectively. Homogenization heat treatment was also applied to all of the joints. The results show that intermetallic and eutectic compounds such as Ni-rich borides, Ni−B−Si ternary compound and eutectic-γ continuously are formed in the joint region during cooling. By increasing t_J, intermetallic phases are firstly reduced and eventually eliminated and isothermal solidification is completed as well. With the increase of the holding time at all of the three bonding temperatures, the thickness of the athermally solidified zone (ASZ) and the volume fraction of precipitates in the bonding area decrease and the width of the diffusion affected zone (DAZ) increases. Similar results are also obtained by increasing T_J from 1080 to 1160 °C at t_J=90 min. Furthermore, increasing the T_J from 1080 to 1160 °C leads to the faster elimination of intermetallic phases from the ASZ. However, these phases are again observed in the joint region at 1180 °C. It is observed that by increasing the bonding temperature, the bonding width and the rate of dissolution of the base metal increase. Based on these results, increasing the homogenization time from 180 to 300 min leads to the elimination of boride precipitates in the DAZ and a high uniformity of the concentration of alloying elements in the joint region and the base metal.     

风机主轴锻件锻后热处理工艺优化

通过对42CrMo4风机主轴结构尺寸、性能要求、材质特点等方面进行分析,对原有锻后热处理工艺进行优化,制定出既能达到锻后热处理效果又经济节能的工艺参数。     

热轧圆钢热顶锻裂纹原因分析

热顶锻合格率是反映热轧圆钢实物质量的一个重要指标。在对国内外热轧圆钢热顶锻质量控制研究成果综述的基础上，对热轧圆钢的热顶锻质量进行了全面的调查、统计和试验研究，归纳了引起热轧圆钢热顶锻裂纹的常见原因，介绍了热顶锻裂纹分析步骤。通过对热顶锻裂纹的形貌和金相组织进行分析，阐述了引起热顶锻裂纹的冶炼因素和轧制因素，并进行了举例说明。     

控轧控冷中碳非调质钢的高周疲劳性能

 采用中碳非调质钢制造的轴类等零件常承受交变载荷，因而对钢材疲劳性能具有高的要求。为了评估控轧控冷工艺生产的非调质钢棒材的疲劳性能，利用旋转弯曲疲劳试验机研究了一种常用的钒微合金化中碳非调质钢38MnVS及对比钢38MnS的高周疲劳性能。结果表明，与38MnS钢相比，38MnVS钢中铁素体体积分数增加，组织明显细化；相分析表明约有54%的钒处于M（C，N）相中，且尺寸小于10 nm的M（C，N）粒子质量分数为32%，这些细小粒子的析出强化增量约为116 MPa。38MnVS钢的疲劳极限较38MnS钢提高了62 MPa，提高幅度约为18%；疲劳极限比从38MnS钢的0.43提高到38MnVS钢的0.48。M（C，N）相的析出强化及组织细化是38MnVS钢较38MnS钢具有优异疲劳性能的主要原因，但其疲劳性能仍低于锻态非调质钢。根据试验结果及文献数据，给出了预测铁素体＋珠光体型非调质钢疲劳极限的简便方法。     

Effect of temperature on fast forging process of Mg-Ni samples for fast formation of Mg2Ni for hydrogen storage

Fast-Forging was used as a Severe Plastic Deformation technique to process Mg/Ni fine powder mixtures at a ratio corresponding to the eutectic composition. The samples were processed at different temperature, increased successively from room temperature up to above 500 °C. The one shock forging operation led to a reduction rate comprised between 80 to more than 90% depending of the applied temperature. Interestingly, a threshold temperature was pointed out for which amounts of the binary Mg₂Ni alloy were directly synthesized in increasing proportions when increasing temperature. A maximum amount of Mg₂Ni was synthesized according the nominal proportions at the highest applied temperature. Besides, numerical simulations were developed to consider and integrate to the forging process, the heat arising from the mechanical energy at deformation. Interestingly the total temperature at shock – heat applied to and heat developed in – indicates that the threshold temperature correspond well with the eutectic temperature as reported in the phase diagram. Early hydrogenation cycles suggest that both mechanical defects in brittle Mg and presence of amounts of Mg₂Ni as catalyst should be combined to optimize the hydrogenation characteristics.     

Loop-mediated isothermal amplification-based microfluidic chip for pathogen detection

Abstract

Due to the significant growth of food production, the potential likelihood of food contamination is increasing. Foodborne illness caused by bacterial pathogens has considerably increased over the past decades, while at the same time, the species of harmful microorganisms also varied. Conventional bacterial culturing methods have been unable to satisfy the growing requirement for food safety inspections and food quality assurance. Therefore, rapid and simple detection methods are urgently needed. The loop-mediated isothermal amplification (LAMP) technology is a highly promising approach for the rapid and sensitive detection of pathogens, which allows nucleic acid amplification under isothermal conditions. The integration of the LAMP assay onto a microfluidic chip is highly compatible with point-of-care or resource-limited settings, as it offers the capability to perform experiments in combination with high screening efficiency. Here, we provide an overview of recent advances in LAMP-based microfluidic chip technology for detecting pathogens, based on real-time or endpoint determination mechanisms. We also discuss the promoting aspects of using the LAMP technique in a microfluidic platform, to supply a guideline for further molecular diagnosis and genetic analysis.     

等温退火对8030铝合金导线组织性能的影响

研究了不同等温退火工艺对8030铝合金导线组织及性能的影响。结果表明:等温退火前后合金均由α-Al基体和Al₆Fe相组成。在同一等温温度下,随着等温时间的延长组织逐渐趋于均匀化;同一等温时间下,随着等温温度的升高,组织趋于均匀化的时间缩短。经过等温退火处理后铝合金导线的导电率均有所提高,在470 ℃均匀化退火24 h后再经240 ℃等温4 h,合金导电率达到最高值57.21%IACS,比未经热处理试样的导电率提高了2.4%IACS。经过等温退火处理后铝合金导线的硬度及抗拉强度均有所降低,塑性大幅度提高。在470 ℃均匀化退火24 h后再经260 ℃等温8 h,合金的伸长率最高可达23.64%。热处理前后合金均为塑性断裂。