Effects of washing with oxidising agents on the gel-forming ability and physicochemical properties of surimi produced from bigeye snapper (Priacanthus tayenus)

The effects of washing with hydrogen peroxide (H₂O₂) and sodium hypochlorite (NaOCl) solutions on the gel-forming ability and physicochemical properties of surimi produced from bigeye snapper (Priacanthus tayenus), stored in ice for up to 14 days, were investigated. Generally, pH and the trichloroacetic acid (TCA)-soluble peptide content of washed mince varied, depending on the type of oxidizing agent and storage time of the fish. With increasing time of storage, the pHs of water- and H₂O₂-washed mince were lower than that of NaOCl-washed mince (P < 0.05). However, no differences in the TCA-soluble peptide contents of the resulting mince washed with any media were observed (P > 0.05). Washing with 20 ppm NaOCl resulted in the highest increase in both the breaking force and the deformation of mince from fish stored in ice for all the times studied (P < 0.05). Natural actomyosin (NAM) extracted from NaOCl-washed mince had higher surface hydrophobicity and disulfide bond (SS) content than that of water-washed mince (P < 0.05). With no effect on Ca²⁺-, Mg²⁺-, or Mg²⁺–Ca²⁺-ATPase activities, NaOCl washing resulted in an increase in Mg²⁺–EGTA-ATPase activity of NAM (P < 0.05). The results suggested that washing mince with the appropriate type and concentration of oxidizing agent can improve the gelling ability of surimi, particularly from low quality fish.     

Benchmark test of the effectiveness of a nitrogen cooled beryllium reflector-filter

We present a comparison between the calculated and the measured effectiveness of a nitrogen cooled beryllium reflector-filter in increasing the cold flux of a polyethylene moderator at the same temperature. We also discuss the impact of the quality of beryllium on the results.     

Effect of chromium on the mechanical properties of powder-processed Fe–0.45 wt.% P alloys

The present investigation shows the role of chromium in Fe–P binary and Fe–P–Cr ternary alloys. The compositions are characterized in terms of microstructure, porosity content, hardness and tensile properties. The alloys were made using a hot powder forging technique. In this process mild steel encapsulated powders were hot forged into slabs. Then the slabs were hot rolled and annealed to relieve the residual stresses. Densifications as high as 98.9% of theoretical density have been realized. Microstructures of these alloys consist of single-phase ferrite only. Both Fe–0.45P and Fe–0.45P–3Cr alloys showed very high strength. As forged and hot rolled Fe–0.45P alloy showed low elongation. It was observed that, the addition of Cr to Fe–P based alloys caused an increase in strength associated with the reduction in ductility. Alloys developed in the present investigation were capable of hot working to very thin gage of sheets and wires.     

Electrical and reliability characterization of metal-gate/HfO2/Ge FET’s with Si passivation

Field-effect transistors with metal gate and HfO₂ gate dielectric on silicon-passivated germanium substrate are studied. Capacitance-Voltage characteristics show lower gate capacitance at negative gate voltages, irrespective of the device channel polarity. Possible mechanisms for this asymmetry are discussed. Reliability of the metal/high-k gate stack on sub-micron p-channel transistors is evaluated. Time-dependent dielectric breakdown analysis indicates comparable gate-stack quality on germanium and silicon substrates.     

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

The effect of moderate electric current density (1 × 10³ to 3 × 10³ A/cm²) on the mechanical properties of Ni-P/Sn-3.5Ag/Ni-P and Ni/Sn-3.5Ag/Ni solder joints was investigated using a microtensile test. Thermal aging was carried out at 160°C for 100 h while the current was passed. The interfacial microstructure and intermetallic compound (IMC) growth were analyzed. It was found that, at these levels of current density, there were no observable voids or hillocks. Samples aged at 160°C without current stressing failed mostly inside the bulk solder with significant prior plastic deformation. The passage of current was found to cause brittle failure of the solder joints and this tendency for brittle failure increased with increasing current density. Fractographic analysis showed that, in most of the electrically stressed samples, fracture occurred at the interface region between the solder and the joining metals. The critical current density that caused brittle fracture was about 2 × 10³ A/cm². Once brittle fracture occurred, the tensile toughness, defined as the energy per unit fractured area, was usually lower than ~5 kJ/m², compared with the case of ductile fracture where this value was typically greater than ~9 kJ/m². When comparing the two types of joint, the brittle failure was found to be more severe with the Ni than with the Ni-P joint. This work also found that the passage of electric current affects the IMC growth rate more significantly in the Ni than in the Ni-P joint. In the case of the Ni joint, the Ni₃Sn₄ IMC at the anode side was appreciably thicker than that formed at the cathode side. However, in the case of electroless Ni-P metallization, this difference was much smaller.