Anisotropic mesh adaption by metric‐driven optimization

We describe a Gauss–Seidel algorithm for optimizing a three‐dimensional unstructured grid so as to conform to a given metric. The objective function for the optimization process is based on the maximum value of an elemental residual measuring the distance of any simplex in the grid to the local target metric. We analyse different possible choices for the objective function, and we highlight their relative merits and deficiencies. Alternative strategies for conducting the optimization are compared and contrasted in terms of resulting grid quality and computational costs. Numerical simulations are used for demonstrating the features of the proposed methodology, and for studying some of its characteristics. Copyright © 2004 John Wiley & Sons, Ltd.     

高性能各向异性Sm2Fe17Nx磁粉的制备

本文研究了高性能各向异性Ｓｍ２Ｆｅ１７Ｎｘ磁粉的制备工艺路线与工艺参数。优化了制备与工艺参数。已制备出磁性能达到：Ｂｒ＝１．３９Ｔ，Ｈｃｉ＝８５０ＫＡ／ｍ和（ＢＨ）ｍ＝２３６ＫＪ／ｍ＾３的各向异性Ｓｍ２Ｆｅ１７Ｎ２．８８磁粉，该磁粉的各向异性场ＨＡ达到２０Ｔ。     

二维金属凹槽填充各向异性介质时散射的边界元方法:TE情形

由各向异性介质无界空间Green函数和Green恒等式出发，推导了TE波入射时二维任意截面金属凹槽填充各向异性介质时所满足的边界积分方程，并用边界元法和广义网络原理计算了金属凹槽填充各向异性介质时的散射。用文中方法退化计算了凹槽填充各向同性介质时的散射，计算结果与解析结果一致。并给出了凹槽填充各向异性介质时的散射算例。     

波在PTL介质中传播的旅行时反演

本文对Byun(1990)的横向各向同性介质的旅行时反演方法作了两点改进:其一是根据优化后的V_r值计算一个初始的F值,然后再根据这个初始值进行最小均方误差分析;其二是对初始值进行优化分析时,提出用测量值(或由式(4)和式(10)计算的理论值)作为实际值进行拟合,而Byun的方法是用式(11)的计算来得到一个实际值。理论模型证明:本文所述方法有一个比较宽的适应性,而Byun方法只在弱各向异性时才可以得到较精确的结果。     

VTI介质中弹性参数地震反演方法

根据地震波在具有垂直对称轴的横向各向同性（VTI）介质中的运动学特征，应用传播时间反演方法，进行了水平层状VTI介质的地层弹性参数反演方法研究。在VTI介质中，P－P波的传播时间曲线不再是双曲线，尤其在长排列情况下，已不能用二项泰勒展式精确地反演P－P波的传播时间，用三项泰勒展式则可以达到更高精度；P－SV波的传播时间也可用三项泰勒展式表达，在中等及短排列长度时可达到一定精神。对P－P波、P－SV波的传播时间进行三项泰勒展开时，它们的系数中包含了地震波的各向异性信息及垂直速度信息，中以为地震波的弹性参数反演提供提供基础，模试验分析及江苏油田某地区的二维多波资料实际反演结果表明，在最大炮间距为1．5倍地层埋深时，可以很精确地得到三项泰勒展式的系数，应用这些系数能精确反演地层弹性参数，包括P波、S波的垂直速度和各向异性参数。图4表1参5（杜丽英摘）     

提高干压各向异性SrM磁体磁性能的方法

以Y30H-1的SrM预烧料为原料,通过对二次添加剂、二次球磨及烧结曲线的调整,做出了Br≥380mT,Hcb≥240kA穖-1,Hcj≥250kA穖-1,(BH)max≥27.0kJm-3的干压各向异性锶铁氧体产品。     

桩土物理模型及结构—桩—土相互作用

本文将工程中常用的密集打桩土体模拟为正交各向异性弹性体。建立了刚性基础-桩-土这一空间相互作用系统的模型。根据圆柱体柱坐标的极点条件。分别选取了两组位移函数来表征桩基和土的位移,并用子区间法分析了结构-桩-土系统的相互作用地震反应。     

各向异性Sm2Fe17Nx磁粉的结构与磁性能

研究了Sm2Fe12Nx磁粉的制备、结构与磁性能，发现Sm—Fe合金的铸态组织主要由Sm2Fe17、α—Fe和SmFe2三种物相组成，而经过1000℃均匀化退火48h处理后富Sm的SmFe2相基本消失，α—Fe相的品粒变小，数量减少。随着氯化时间延长到10h，Sm2Fe17相始终未改变其Th2Zn17型结构，而氯原子浓度增加，所有的X射线衍射峰均向小角度方向移动；但在氮化时间超过10h后，物相要发生变化，导致磁性能降低。在500℃下流动的氮气氛中对Sm2Fe17合金氮化2、4、6、10h未加磁场取向的磁粉中，以氮化6h的磁性能值最高：σr＝35．44Am^2/kg(emu／g)，Hc＝58kA／m(729．03Oe)。磁性能值偏低的原因与测量磁场较低，粒径分布不均匀及粒径较大有关。     

Contraction stress build‐up of anisotropic conductive films (ACFs) for flip‐chip interconnection: Effect of thermal and mechanical properties of ACFs

The important mechanical mechanism for the electrical conduction of anisotropic conductive films (ACFs) is the joint clamping force after the curing and cooling processes of ACFs. In this study, the mechanism of shrinkage and contraction stress and the relationship between these mechanisms and the thermomechanical properties of ACFs were investigated in detail. Both thickness shrinkages and modulus changes of four kinds of ACFs with different thermomechanical properties were experimentally investigated with thermomechanical and dynamic mechanical analysis. Based on the incremental approach to linear elasticity, contraction stresses of ACFs developed along the thickness direction were estimated. Contraction stresses in ACFs were found to be significantly developed by the cooling process from the glass‐transition temperature to room temperature. Moreover, electrical characteristics of ACF contact during the cooling process indicate that the electrical conduction of ACF joint is robustly maintained by substantial contraction stress below T_g. The increasing rate of contraction stresses below T_g was strongly dependent on both thermal expansion coefficient (CTE) and elastic modulus (E) of ACFs. A linear relationship between the experimental increasing rate and E × CTE reveals that the build‐up behavior of contraction stress is closely correlated with the ACF material properties: thermal expansion coefficient, glassy modulus, and T_g. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2634–2641, 2004