Measurement of the density and surface tension of Ni-based superalloys in the liquid and mushy states

The densities of three Ni-based superalloys have been measured in both liquid and mushy states by both a modified sessile drop method (MSDM) and a modified pycnometric method (MPM) for alloys CMSX-4 and CM186LC, and for CMSX-10 alloy by MSDM only. The surface tensions of liquid CMSX-4, CM186LC, and CMSX-10 superalloys were measured using the sessile drop method. All measurements were carried out in a highly purified argon atmosphere with the oxygen partial pressure of less than 10⁻¹⁹ MPa in the gas outlet. The densities of all superalloys in both liquid and mushy states were found to decrease with increasing temperature. The volume thermal expansion of each superalloy in the mushy state was found to be higher than that in the liquid state. The densities determined by different methods have been critically assessed and recommended values in both liquid and mushy states are given as a linear function of temperature for the three Ni-based superalloys. The surface tension of liquid CMSX-4 superalloy was found to decrease with increasing temperature, while that of liquid CMSX-10 superalloy increases with increasing temperature. The wetting behavior of liquid CM186LC on the alumina substrate was found (1) to differ significantly from that of CMSX-4 and CMSX-10 and (2) to vary with time. A HfO₂-rich layer was found in the contact area of CM186LC with the alumina substrate, which could lead to some uncertainty in the value obtained for the surface tension determined for CM186LC.     

Density Measurement of Liquid Ni-Ta Alloys by a Modified Sessile Drop Method

The density of liquid Ni- Ta alloys was measured by using a modified sessile drop method. It is found that the density of the liquid Ni- Ta alloys decreases with the increasing temperature, but increases with the increase of tantalum concentration in the alloys. The molar volume of liquid Ni- Ta binary alloys increases with the increase of temperature ancl tantalum concentration.     

Bolted tension flanges joining square hollow section members

Tests and theoretical analysis on the maximum strength of high strength bolted tension flanges joining square hollow section members have been carried out. Yield line theory has been applied in a similar way to that presented in a previous paper. Correlation between test results and theoretical predictions is quite satisfactory. Based on this study, a simple design formula has been proposed.     

Preface

Multimedia Tools and Applications -     

A 286 mm2 256 Mb DRAM with ×32 both-ends DQ

This paper describes a 256 Mb DRAM chip architecture which provides up to ×32 wide organization. In order to minimize the die size, three new techniques: an exchangeable hierarchical data line structure, an irregular sense amp layout, and a split address bus with local redrive scheme in the both-ends DQ were introduced. A chip has been developed based on the architecture with 0.25 μm CMOS technology. The chip measures 13.25 mm×21.55 mm, which is the smallest 256 Mb DRAM ever reported. A row address strobe (RAS) access time of 26 ns was obtained under 2.8 V power supply and 85°C. In addition, a 100 MHz×32 page mode operation, namely 400 M byte/s data rate, in the standard extended data output (EDO) cycle has been successfully demonstrated     

Strength and ductility under dynamic loading in fine- grained IN905XL aluminum alloy

Three IN905XL aluminum alloys with fine grain (1 μm), intermediate grain (3 μm), and coarse grain (5 μm) have been developed by a combination of mechanical alloying (MA) and conventional extrusion in order to investigate their mechanical properties at dynamic strain rates of 1 × 10³ and 2 × 10³ s⁻¹ and a quasi-static strain rate of 10^-3 s⁻¹. Flow stresses are found to increase with decreasing grain size for all the strain rates tested. Negative strain-rate sensitivity of flow stress is observed up to 1 × 10³ s⁻¹ in both intermediate- and coarse-grained IN905XL. At the highest strain rate of 2 × 10³ s⁻¹ however, all samples showed a positive strain-rate sensitivity of strength. Total elongation at high strain rates is generally larger than that at low strain rates. Total elongation also decreases with grain size for all the strain rates. This decrease in elongation results from an initiation of microcracks at interfaces between the matrix and particles finely dispersed near grain boundary regions, introduced during MA processing; then, this initiation leads elongation of alloys to small limited values. Formerly with the Department of Mechanical Systems Engineering, University of Osaka Prefecture. This article is based on a presentation made in the symposium “Dynamic Behavior of Materials,” presented at the 1994 Fall Meeting of TMS/ASM in Rosemont, Illinois, October 3-5, 1994, under the auspices of the TMS-SMD Mechanical Metallurgy Committee and the ASM-MSD Flow and Fracture Committee.     

A unified proposal for characteristic testing methods and figure of merit of 8‐kV/3.5‐kVA class light‐triggered thyristors

Power devices with high capability have been developed. 8‐kV/3.5‐kA‐class light‐triggered thyristors have the highest capability among power devices. These devices are used in the Kii Channel HVDC transmission system in Japan. In this paper, we report the extracted problems of conventional testing methods of 8‐kV/3.5‐kA‐class light‐triggered thyristors among manufacturers, and the proposed unified testing methods on the basis of element characteristics and operating conditions in the Kii Channel HVDC system. Furthermore, we propose a figure of merit for power devices for the practical use, and try to extract elements used at the Kii Channel HVDC system with small margins and low withstand capabilities. © 2002 Wiley Periodicals, Inc. Electr Eng Jpn, 140(3): 61–70, 2002; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.10024     

Gain saturation dependence on signal wavelength in a travelling-wave semiconductor laser amplifier

Gain saturation dependence on signal wavelength in a 1.5 ?m InGaAsP travelling-wave semiconductor laser amplifier is experimentally studied. Saturation output powers were 6.9dBm, 8.3dBm and 10.6dBm for signal wavelengths of 1490 nm, 1510 nm and 1540 nm, respectively. This saturation dependence on wavelength, i.e. higher saturation output power for longer signal wavelength, results from signal gain peak shift towards longer wavelength with increasing input power.     

Fine physical mapping of Ph1, a chromosome pairing regulator gene in polyploid wheat

The diploid-like chromosome pairing in polyploid wheat is controlled by the Ph1 (pairing homoeologous) gene that is located on chromosome arm 5BL. By using a combination of cytogenetic and molecular techniques, we report the physical location of the Ph1 gene to a submicroscopic chromosome region (Ph1 gene region) that is flanked by the breakpoints of two deletions (5BL-1 and ph1c) and is marked by a DNA probe (XksuS1). The Ph1 gene region is present distal to the breakpoint of deletion 5BL-1 but proximal to the C-band 5BL2.1. Two other DNA probes (Xpsr128 and Xksu75) flank the region-Xpsr128 being proximal and Xksu75 being distal. The estimated size of the region is less than 3 Mb. The chromosome region around the Ph1 gene is high in recombination as the genetic distance of the region between 5BL-1 breakpoint and C-band 5BL2.1 (not resolved by the microscope) is at least 9.3 cM.     

Implicit integration and consistent tangent modulus of a time‐dependent non‐unified constitutive model

This paper describes the implicit integration and consistent tangent modulus of an inelastic constitutive model with transient and steady strain rates, both of which are time‐ and temperature‐dependent; the transient rate is influenced by the evolution of back stress decomposed into parts, while the steady rate depends only on applied stress and temperature. Such a non‐unified model is useful for high‐temperature structural analysis and is practical owing to the ease in determining material constants. The implicit integration is shown to result in two scalar‐valued coupled equations, and the consistent tangent modulus is derived in a quite versatile form by introducing a set of fourth‐rank constitutive parameters into the discretized evolution rule of back stress. The constitutive model is, then, implemented in a finite element program and applied to a lead‐free solder joint analysis. It is demonstrated that the implicit integration is very accurate if the multilinear kinematic hardening model of Ohno and Wang is employed, and that the consistent tangent modulus certainly affords quadratic convergence to the Newton–Raphson iteration in solving nodal force equilibrium equations. Copyright © 2003 John Wiley & Sons, Ltd.