Ni-Cu低温TLP扩散连接接头组织及性能

采用厚度40 μm的纯锡钎料中间层在镍和铜基板间实现了低温瞬态液相扩散连接(transient liquid phase bonding,TLP Bonding),通过延长等温反应时间,获得了完全由(Cu,Ni)6Sn5和Cu3Sn两种金属间化合物相(intermetallic compounds,IMCs)组成的焊接接头. 在Ni-Cu TLP扩散连接液-固反应过程中,Sn/Ni和Sn/Cu界面处均形成了(Cu,Ni)6Sn5,但晶粒形貌存在差异,从镍侧到铜侧化合物形貌依次是小颗粒状、针状和扇贝状. 此外,Cu3Sn的生长受到了抑制. 该IMCs接头具有418.4℃的重熔温度和49.8 MPa的平均抗剪强度,能够满足高温功率器件封装中对耐高温互连的需求,并且有助于提高电子器件在恶劣条件下服役时的可靠性.     

Bonding mechanisms of SiO2 glass and 1060 Al by ultrasonic assisted active metal soldering process

In this work,the ultrasonic assisted active metal soldering of SiO₂ glass and Al was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250℃ in ambient atmosphere.A nano-crystalline α-Al₂O₃ layer with the average thickness of 13.9 nm and a nano-crystalline R-TiO₂ layer with the average thickness of 16.2 nm are formed at the interface of Al/Sn and SiO₂/Sn respectively because Al elements did not diffuse from Al...