Determining the Toughness of Ceramics from Vickers Indentations Using the Crack-Opening Displacements: An Experimental Study

Recently, a method for evaluating the fracture toughness of ceramics has been proposed by Fett based on the computed crack-opening displacements of cracks emanating from Vickers hardness indentations. To verify this method, experiments have been conducted to determine the toughness of a commercial silicon carbide ceramic, Hexoloy SA, by measuring the crack-opening profiles of such Vickers indentation cracks. Although the obtained toughness value of K _o= 2.3 MPa·m^1/2 is within 10% of that measured using conventional fracture toughness testing, the computed crack-opening profiles corresponding to this toughness display poor agreement with those measured experimentally, raising concerns about the suitability of this method for determining the toughness of ceramics. The effects of subsurface cracking and cracking during loading are considered as possible causes of such discrepancies, with the former based on direct observations of lateral subsurface cracks below the indents.     

Characteristic dimensions and the micro-mechanisms of fracture and fatigue in `nano' and `bio' materials

The behavior of small-volume (so-called `nano') structures, where size-scales are comparable with microstructural dimensions, and biological/bio-implantable materials, which invariably display a hierarchy of structural dimensions, is currently much in vogue in materials science. One aspect of this field, which to date has received only limited attention, is the fracture and fatigue properties of these materials. In this paper, we examine two topics in this area, namely the premature fatigue failure of silicon-based micron-scale structures for microelectromechanical systems (MEMS), and the fracture properties of mineralized tissue, specifically human bone.     

Fatigue crack growth behavior of a Zr58.5Cu15.6Ni12.8Al10.3Nb2.8 bulk metallic glass-forming alloy

Fatigue crack growth behavior was studied for a Zr_58.5Cu_15.6Ni_12.8Al_10.3Nb_2.8 bulk metallic glass in ambient air, demonstrating a fatigue threshold of ΔK_TH = 1.4 MPa√m and a Paris law exponent of 1.7. A nearly stress intensity-independent crack growth regime occurred at 2.5 × 10^?8 m cycle^–1, suggesting an environmental influence of ambient air on the fatigue crack growth, as has been observed for Zr–Ti–Ni–Cu–Be bulk metallic glasses. However, this environmental fatigue effect was shifted to 25× higher growth rates due to the different chemistry.     

The dentin-enamel junction and the fracture of human teeth

The dentin-enamel junction (DEJ), which is the interfacial region between the dentin and outer enamel coating in teeth, is known for its unique biomechanical properties that provide a crack-arrest barrier for flaws formed in the brittle enamel1. In this work, we re-examine how cracks propagate in the proximity of the DEJ, and specifically quantify, using interfacial fracture mechanics, the fracture toughness of the DEJ region. Careful observation of crack penetration through the interface and the new estimate of the DEJ toughness ( approximately 5 to 10 times higher than enamel but approximately 75% lower than dentin) shed new light on the mechanism of crack arrest. We conclude that the critical role of this region, in preventing cracks formed in enamel from traversing the interface and causing catastrophic tooth fractures, is not associated with the crack-arrest capabilities of the interface itself; rather, cracks tend to penetrate the (optical) DEJ and arrest when they enter the tougher mantle dentin adjacent to the interface due to the development of crack-tip shielding from uncracked-ligament bridging.     

Deducing the Fatigue Crack Growth Rates of Natural Flaws in Silicon Nitride Ceramics: Role of R‐Curves

Fatigue failure is a concern when high‐strength, high‐toughness silicon nitride ceramics are used in mechanical components and the growth of natural flaws will determine the usable upper bound strength. In this study a fracture resistance curve (R‐curve) model is incorporated into an established method for deducing natural flaw growth rates from a combination of strength and fatigue life data for smooth specimens. Experimental data for a commercial silicon nitride, SL200, were examined. When compared with results deduced using a constant fracture toughness model, the new method gives more physically realistic growth rate results. Specifically, by incorporating the R‐curve the deduced fatigue threshold is equal to the reported intrinsic toughness for crack propagation of 2.2 MPa√m, whereas the constant fracture toughness model gives a physically unrealistic threshold value. Furthermore, much better agreement is achieved with the growth rates measured using macroscopic compact‐tension specimens. Overall, it is concluded that the R‐curve effect should not be ignored when deducing the fatigue crack growth rates of natural flaws in high‐toughness silicon nitride ceramics.     

On the Room-Temperature Mechanical Properties of an Ion-Irradiated TiZrNbHfTa Refractory High Entropy Alloy

JOM - Refractory high-entropy alloys (RHEAs) are potential candidate materials for use in next-generation nuclear reactors due to their excellent mechanical performance at high temperatures. Here,...     

Fracture and Fatigue Behavior at Ambient and Elevated Temperatures of Alumina Bonded with Copper/Niobium/Copper Interlayers

Interfacial fracture toughness and cyclic fatigue-crack growth properties of joints made from 99.5% pure alumina partially transient liquid-phase bonded using copper/niobium/copper interlayers have been investigated at both room and elevated temperatures, and assessed in terms of interfacial chemistry and microstructure. The mean interfacial fracture toughness, G _c, was found to decrease from 39 to 21 J/m² as temperature was raised from 25° to 1000°C, with failure primarily at the alumina/niobium interfaces. At room temperature, cyclic fatigue-crack propagation occurred both at the niobium/alumina interface and in the alumina adjacent to the interface, with the fatigue threshold, Δ G _TH, ranging from 20 to 30 J/m²; the higher threshold values in that range resulted from a predominantly near-interfacial (alumina) crack path. During both fracture and fatigue failure, residual copper at the interface deformed and remained adhered to both sides of the fracture surface, acting as a ductile second phase, while separation of the niobium/alumina interface appeared relatively brittle in both cases. The observed fracture and fatigue behavior is considered in terms of the respective roles of the presence of ductile copper regions at the interface which provide toughening, extrinsic toughening due to grain bridging during crack propagation in the alumina, and the relative crack propagation resistance of each crack path, including the effects of segregation at the interfaces found by Auger spectroscopy.     

Optimization of Mo-Si-B intermetallic alloys

Mo-Si-B intermetallics consisting of the phases Mo₃Si and Mo₅SiB₂, and a molybdenum solid solution (“α-Mo”), have melting points on the order of 2000 °C. These alloys have potential as oxidation-resistant ultra-high-temperature structural materials. They can be designed with microstructures containing either individual α-Mo particles or a continuous α-Mo phase. A compilation of existing data shows that an increase in the volume fraction of the α-Mo phase increases the room-temperature fracture toughness at the expense of the oxidation resistance and the creep strength. If the α-Mo phase could be further ductilized, less α-Mo would be needed to achieve an adequate value of the fracture toughness, and the oxidation resistance would be improved. It is shown that microalloying of Mo-Si-B intermetallics with Zr and the addition of MgAl₂O₄ spinel particles to Mo both hold promise in this regard. This article is based on a presentation made in the symposium entitled “Beyond Nickel-Base Superalloys,” which took place March 15–17, 2004, at the TMS Spring meeting in Charlotte, NC, under the auspices of the SMD-Corrosion and Environmental Effects Committee, the SMD-High Temperature Alloys Committee, the SMD-Mechanical Behavior of Materials Committee, and the SMD-Refractory Metals Committee.