应用于60GHz无线收发机内的带宽大于3GHz的无电感CMOS可编译增益放大器

这篇文章呈现了一个应用于60GHz无线收发机内的带宽大于3GHz的无电感CMOS可编译增益放大器,使用了改进的带负电容抵消技术Cherry-hooper放大器作为增益单元,采用了新颖的电路技术来实现增益调节,该技术在宽带PGA的设计中具有普适性,并且可以大大简化宽带PGA的设计。PGA通过两级增益单元和一级输出BUFFER的级联获得了最大增益30dB和远宽于3GHz的带宽。该PGA集成进整个60GHz无线收发机里面并且用TSMC65nm的CMOS工艺获得实现。整个接收机前端的测试结果表明接收机前端获得了18dB的可变增益范围和>3GHz的带宽,这证明提出的PGA本身获得了18dB的可变增益范围并且带宽是远大于3GHz的。该PGA电源电压为1.2V,功耗为10.7mW,核心版图面积仅仅为0.025mm^2。     

应用于60-GHz无线通信的全差分锁相环频率综合器

A 40-GHz phase-locked loop(PLL) frequency synthesizer for 60-GHz wireless communication applications is presented. The electrical characteristics of the passive components in the VCO and LO buffers are accurately extracted with an electromagnetic simulator HFSS. A differential tuning technique is utilized in the voltage controlled oscillator(VCO) to achieve higher common-mode noise rejection and better phase noise performance. The VCO and the divider chain are powered by a 1.0 V supply while the phase-frequency detector(PFD)and the charge pump(CP) are powered by a 2.5 V supply to improve the linearity. The measurement results show that the total frequency locking range of the frequency synthesizer is from 37 to 41 GHz, and the phase noise from a 40 GHz carrier is –97.2 d Bc/Hz at 1 MHz offset. Implemented in 65 nm CMOS, the synthesizer consumes a DC power of 62 m W, including all the buffers.     

一种38.4~43.4 GHz CMOS压控振荡器

设计了一种基于65 nm CMOS工艺的交叉耦合全差分40 GHz压控振荡器(VCO)。为了减小仿真结果与测试结果的差距,对电感及其连接其他元件而延长的金属线在电磁场仿真软件里重新进行了仿真。设计中应用了厚栅容抗管来增大电压的调谐范围,从而实现更高的频率覆盖范围。流片后的测试结果表明,VCO的振荡频率覆盖38.4~43.4 GHz,调谐范围达到12.2%,符合基于无线局域网IEEE 802.11ad标准设计的两级下变频60 GHz无线收发机对本振频率的要求。当振荡频率为39 GHz时,应用该VCO的锁相环锁定在41.76 GHz时测得1 MHz偏移频率处的相位噪声为－90.9 dBc/Hz。芯片采用1 V电源电压供电,功耗为5.7~8.6 mW,核心芯片面积为(0.197×0.436) mm²。     

A wideband on-chip millimeter-wave patch antenna in 0.18/Lm CMOS

A wideband on-chip millimeter-wave patch antenna in 0.18 μm CMOS with a low-resistivity （10 Ω.cm） silicon substrate is presented. The wideband is achieved by reducing the Q factor and exciting the high-order radiation modes with size optimization. The antenna uses an on-chip top layer metal as the patch and a probe station as the ground plane. The on-chip ground plane is connected to the probe station using the inner connection structure of the probe station for better performance. The simulated S11 is less than -10 dB over 46-95 GHz, which is well matched with the measured results over the available 40-67 GHz frequency range from our measurement equipment. A maximum gain of-5.55 dBi with 4% radiation efficiency at a 60 GHz point is also achieved based on Ansofi HFSS simulation. Compared with the current state-of-the-art devices, the presented antenna achieves a wider bandwidth and could be used in wideband millimeter-wave communication and image applications.     

A wideband on-chip millimeter-wave patch antenna in 0.18 μm CMOS

A wideband on-chip millimeter-wave patch antenna in 0.18 μm CMOS with a low-resistivity(10Ω·cm) silicon substrate is presented.The wideband is achieved by reducing the Q factor and exciting the high-order radiation modes with size optimization.The antenna uses an on-chip top layer metal as the patch and a probe station as the ground plane.The on-chip ground plane is connected to the probe station using the inner connection structure of the probe station for better performance.The simulated S11 is less than –10 dB over 46–95 GHz,which is well matched with the measured results over the available 40–67 GHz frequency range from our measurement equipment.A maximum gain of –5.55 dBi with 4% radiation efficiency at a 60 GHz point is also achieved based on Ansoft HFSS simulation.Compared with the current state-of-the-art devices,the presented antenna achieves a wider bandwidth and could be used in wideband millimeter-wave communication and image applications.     

CMOS mm-wave transceivers for Gbps wireless communication

The challenges in the design of CMOS millimeter-wave (mm-wave) transceiver for Gbps wireless communication are discussed. To support the Gbps data rate, the link bandwidth of the receiver/transmitter must be wide enough, which puts a lot of pressure on the mm-wave front-end as well as on the baseband circuit. This paper discusses the effects of the limited link bandwidth on the transceiver system performance and overviews the bandwidth expansion techniques for mm-wave amplifiers and IF programmable gain amplifier. Furthermore, dual-mode power amplifier (PA) and self-healing technique are introduced to improve the PA''s average efficiency and to deal with the process, voltage, and temperature variation issue, respectively. Several fully-integrated CMOS mm-wave transceivers are also presented to give a short overview on the state-of-the-art mm-wave transceivers.