Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Low-cycle fatigue (LCF) tests on as-cast Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-3Ag-0.5Cu-1Bi, and Sn-3Ag-0.5Cu-3Bi solders was carried out using a noncontact strain-controlled system at 20°C with a constant frequency of 0.1 Hz. The addition of Cu does not significantly affect the fatigue life of eutectic Sn-Ag solder. However, the fatigue life was significantly reduced with the addition of Bi. The LCF behavior of all solders followed the Coffin-Manson relationship. The fatigue life of the present solders is dominated by the fracture ductility and can be described by the ductility-modified Coffin-Manson’s relationship. Steps at the boundaries of dendrite phases were the initiation sites for microcracks for Sn-3.5Ag, Sn-3Ag-0.5Cu, and Sn-3Ag-0.5Cu-1Bi solders, while for Sn-3Ag-0.5Cu-3Bi solder, cracks initiated along both the dendrite boundaries and subgrain boundaries in the dendrite phases. The linking of these cracks and the propagation of cracks inside the specimen occurred both transgranularly through eutectic phases and intergranularly along dendrite boundaries or subgrain boundaries.     

Low-cycle fatigue prediction model for pb-free solder 96.5Sn-3.5Ag

Low-cycle fatigue (LCF) data of Sn-Ag eutectic solder (96.5Sn-3.5Ag) under various temperatures and frequencies has been described using three different prediction models, i.e., Coffin-Manson model, Smith-Watson-Topper (SWT) model, and Morrow energy model. The LCF behavior represented by the present prediction models showed temperature and frequency dependences, i.e., the fatigue ductility coefficient increased with increasing frequency and decreasing temperature. In order to better correlate the LCF data, a flow stress and/or frequency-dependent modifications were introduced to the Coffin-Manson and Morrow energy models. The frequency-modified Coffin-Manson model could not describe the influence of temperature on LCF behavior, while the flow stress-modified frequency-modified Morrow energy model, into which the metallurgical response (flow stress and frequency) was introduced to account for the effect of temperature and frequency on LCF behavior, gave reasonable predictions of LCF data under various temperatures and frequencies.     

Delamination wear of metal injection moulded 316L stainless steel

The wear behavior of metal injection moulded (MIM) stainless steels was studied using a pin-on-disc apparatus under dry sliding conditions. Pin specimens were MIM 316L stainless steel, while disc specimens were wrought 316L stainless steel. At low sliding speeds (0.2–0.6 m/s), the wear rates gradually decreased with increasing sliding speed, but then increased at high sliding speeds (0.6–2 m/s). The adhesive-induced delamination wear dominated at low sliding speeds, while abrasive-induced delamination wear dominated at high sliding speeds. At low sliding speeds, the surface densification occurred on the worn surface of pin specimens, hence no difference was found between the wear resistances of MIM pins containing 2% and 6% porosity. In contrast, the abrasive-induced delamination wear at high sliding speeds was enhanced by porosity; therefore the wear rates of MIM pins containing 6% porosity were higher than those of MIM pins containing 2% porosity.     

Fatigue crack growth behavior and mechanism of closed‐cell PVC foam

The applicability of linear‐elastic fracture mechanics parameters (ΔK and K_max), elastic–plastic fracture mechanics parameter (ΔJ), and time‐dependent fracture mechanics parameter (C*) to characterize fatigue crack growth (FCG) rate of closed‐cell polyvinyl chloride foam was investigated in the present work. The effect of stress ratios (R = 0.1 and 0.4) on FCGs was observed when the ΔK, K_max and ΔJ were used as fracture mechanics parameters. As a fracture mechanics parameter that combines ΔK and K_max, the K* successfully characterized FCGs (da/dN) at R = 0.1 and 0.4. While, a time‐dependent fracture mechanics parameter (C*) successfully correlated da/dt of creep crack growth (CCG) test, but it failed to correlate da/dt of FCG tests. The FCGs at both R = 0.1 and 0.4 were cyclic dependent, while the CCG was time dependent. For cyclic‐dependent crack growth, the interaction between polymer‐chain scission and small scale crack‐tip blunting was the main mechanism, whereas the interaction between polymer‐chain pullout and large scale crack‐tip blunting dominated fracture process for time‐dependent crack growth. POLYM. ENG. SCI., 2013. © 2012 Society of Plastics Engineers     

Interaction of plastic zone, pores, and stress ratio with fatigue crack growth of sintered stainless steel

The relationships between plastic zone, pores, fatigue crack growth rate (da/dN), and fracture mechanics parameters of metal injection molding (MIM) 316L stainless steel at various stress ratios (R = 0.1 and 0.4) are investigated in the present work. Using two-dimensional (2D) plane strain finite element analysis (FEA), the stress intensity factor and cyclic-plastic zone at crack tip are evaluated. The slow-growth da/dN at near-threshold regime is in brittle manner, and can be characterized by maximum stress intensity factor (K_max). While, the mid-growth da/dN at Paris regime is in ductile manner, and can be characterized by stress intensity factor range (??K). As a fracture mechanics parameter that combines K_max and ??K, the K* successfully characterizes the stress ratio effect on FCG rate at near-threshold and Paris regimes. The transition from slow-growth da/dN to mid-growth da/dN occurs when the cyclic-plastic zone at crack tip coalesces with pore. The appearances of fracture surfaces at near-threshold and Paris regimes are in good agreement with the FEA results.     

Microstructure and Mechanical Properties of Resistance Spot Welding Joints of Carbonitrided Low-Carbon Steels

Metallurgical and Materials Transactions B - Carbonitrided low-carbon steels are resistance welded in various engineering components. However, there are no reports on the microstructure and...     

Low-cycle fatigue behavior and mechanisms of a lead-free solder 96.5Sn/3.5Ag

Low-cycle fatigue tests of as-cast Sn-Ag eutectic solder (96.5Sn/3.5Ag) were performed using a noncontact strain controlled system at 20°C. The fatigue behavior followed the Coffin-Manson equation with a fatigue-ductility exponent of 0.76. Without local deformation and stress concentration at contact points between the extensometer and the specimen surface in strain-controlled fatigue tests, crack initiation and propagation behavior was observed on the specimen surface using a replication technique. After failure, the longitudinal cross sections were also examined using scanning electron microscopy (SEM). Microcracks initiated from steps at the boundary between the Sn-dendrite and the Sn-Ag eutectic structure and cavities along the boundaries especially around the Ag₃Sn particles. Stage II crack propagated in mixed manner with intergranular cracks along the Sn-dendrite boundaries and transgranular cracks through the Sn-dendrites and the Sn-Ag eutectic structure. Propagation of stage II cracks could be expressed by the relation of da_c/dN = 4.7 × 10⁻¹¹[ΔJ]^1.5, where a_c is the average crack length and ΔJ is the J-integral range. After fatigue tests, small grains were observed in Sn-dendrites near the fracture surface.