A semi-static complementary gain cell technology for sub-1 V supplyDRAM's

A new semi-static complementary gain cell for future low power DRAM's has been proposed and experimentally demonstrated. This gain cell consists of a write-transistor and its opposite conduction type read-transistor with a heating gate as a storage node which causes a shift in the threshold voltage. This gain cell provides a two orders of magnitude larger cell signal output and higher immunity to noise on the bitlines when compared with a conventional one-transistor DRAM cell without increasing the storage capacitance even at a supply voltage of 0.8 V. The 0.87 μm² cell size is achieved by using a 0.25 μm design rule with a polysilicon thin-film transistor built in the trench and phase shifted i-line lithography     

Explanation of P/E cycling impact on drain disturb in flash EEPROMs under CHE and CHISEL programming operation

The impact of program/erase (P/E) cycling on drain disturb in NOR Flash EEPROM cells under channel hot electron (CHE) and channel-initiated secondary electron (CHISEL) programming operation is studied. Charge gain disturb increases and charge loss disturb decreases after cycling under CHE and CHISEL operation. Carefully designed experiments and fullband Monte Carlo simulations were used to explain this behavior. P/E cycling induced degradation in gate coupling coefficient and the resulting increase in source/drain leakage, reduction in band-to-band tunneling and change in carrier injection area seems to explain well the behavior of CHE and CHISEL drain disturb after cycling.     

A system LSI memory redundancy technique using an ie-flash(inverse-gate-electrode flash) programming circuit

A new memory redundancy technique using inverse-gate-electrode flash (ie-flash) memory cells has been developed. The ie-flash can be fabricated by the conventional logic CMOS process, so no additional processes are necessary in using it in system LSIs, and it can be programmed by logic testers. We enhanced the reliability of ie-flash by using some circuits, increasing reliability to endure practical use. This new redundancy technique was successfully implemented in the cache memories of a 32-b RISC microprocessor     

A multigigabit DRAM technology with 6F2 open-bitlinecell, distributed overdriven sensing, and stacked-flash fuse

A multigigabit DRAM technology was developed that features a low-noise 6F² open-bitline cell with fully utilized edge arrays, distributed overdriven sensing for operation below 1 V, and a highly reliable post-packaging repair scheme using a stacked-flash fuse. This technology, which can be used to fabricate a 0,13-μm 180-mm² 1-Gb DRAM assembled in a 400-mil package, was verified using a 57.6-mm², 200-MHz array-cycle, 256-Mb test chip with 0.109-μm² cells     

CHISEL programming operation of scaled NOR flash EEPROMs-effect of voltage scaling, device scaling and technological parameters

The impact of programming biases, device scaling and variation of technological parameters on channel initiated secondary electron (CHISEL) programming performance of scaled NOR Flash electrically erasable programmable read-only memories (EEPROMs) is studied in detail. It is shown that CHISEL operation offers faster programming for all bias conditions and remains highly efficient at lower biases compared to conventional channel hot electron (CHE) operation. The physical mechanism responsible for this behavior is explained using full band Monte Carlo simulations. CHISEL programming efficiency is shown to degrade with device scaling, and various technological parameter optimization schemes required for its improvement are explored. The resulting increase in drain disturbs is also studied and the impact of technological parameter optimization on the programming performance versus drain disturb tradeoff is analyzed. It is shown that by judicious choice of technological parameters the advantage of CHISEL programming can be maintained for deeply scaled electrically erasable programmable read-only memory (EEPROM) cells.     

Improvement of Thermal Stability via Outer-Loop Ion Pair Interaction of Mutated T1 Lipase from Geobacillus zalihae Strain T1

Mutant D311E and K344R were constructed using site-directed mutagenesis to introduce an additional ion pair at the inter-loop and the intra-loop, respectively, to determine the effect of ion pairs on the stability of T1 lipase isolated from Geobacillus zalihae. A series of purification steps was applied, and the pure lipases of T1, D311E and K344R were obtained. The wild-type and mutant lipases were analyzed using circular dichroism. The T_m for T1 lipase, D311E lipase and K344R lipase were approximately 68.52 °C, 70.59 °C and 68.54 °C, respectively. Mutation at D311 increases the stability of T1 lipase and exhibited higher T_m as compared to the wild-type and K344R. Based on the above, D311E lipase was chosen for further study. D311E lipase was successfully crystallized using the sitting drop vapor diffusion method. The crystal was diffracted at 2.1 Å using an in-house X-ray beam and belonged to the monoclinic space group C2 with the unit cell parameters a = 117.32 Å, b = 81.16 Å and c = 100.14 Å. Structural analysis showed the existence of an additional ion pair around E311 in the structure of D311E. The additional ion pair in D311E may regulate the stability of this mutant lipase at high temperatures as predicted in silico and spectroscopically.     

3.3-V BiCMOS circuit techniques for 250-MHz RISC arithmetic modules

A quasi-complementary BiCMOS gate for low-voltage supply is applied to a 3.3V RISC data path. For a parallel RISC processor, the major issues are the construction of arithmetic modules in a small number of transistors and the shortening of the cycle time as well as the delay time. The feedbacked massive-input logic (FML) concept is proposed to meet these requirements. It reduces the number of transistors and the power within the framework of fully static logic 3-4 times. A low-voltage BiCMOS D-flip-flop is also conceived to allow the single-phase clocking scheme, which is favorable for high-frequency operation of RISCs. To demonstrate these circuit techniques, a 32-b ALU is designed and fabricated using 0.3-μm BiCMOS to demonstrate 1.6 times performance leverage over CMOS at 3.3 V     

256-Mb DRAM circuit technologies for file applications

256-Mb DRAM circuit technologies characterized by low power and high fabrication yield for file applications are described. The newly proposed and developed circuits are a self-reverse-biasing circuit for word drivers and decoders to suppress the subthreshold current to 3% of the conventional scheme, and a subarray-replacement redundancy technique that doubles chip yield and consequently reduces manufacturing costs. An experimental 256-Mb DRAM has been designed and fabricated by combining the proposed circuit techniques and a 0.25-μm phase-shift optical lithography, and its basic operations are verified. A 0.72-μm² double-cylindrical recessed stacked-capacitor (RSTC) cell is used to ensure a storage capacitance of 25 fF/cell. A typical access time under a 2-V power supply voltage was 70 ns. With the proper device characteristics, the simulated performances of the 256-Mb DRAM operating with a 1.5-V power supply voltage are a data-retention current of 53 μA and an access time of 48 ns     

Drain disturb during CHISEL programming of NOR flash EEPROMs-physical mechanisms and impact of technological parameters

The origin of drain disturb in NOR Flash EEPROM cells under channel initiated secondary electron (CHISEL) programming operation is identified. A comparative study of drain disturb under channel hot electron (CHE) and CHISEL operation is performed as a function of drain bias and temperature on bitcells having different floating gate length and junction depth. The disturb mechanism is shown to originate from band-to-band tunneling under CHISEL operation, unlike that under CHE operation that originates from source-drain leakage. The effect of technological parameters (channel doping and drain junction depth) on CHISEL drain disturb is studied for both the charge gain (erased cell) and charge loss (programmed cell) disturb modes. Fullband Monte Carlo device simulations are used to explain the experimental results. It is shown that methods for improving CHISEL programming performance (higher channel doping and/or lower drain junction depth or halo) increase drain disturb, which has to be carefully considered for efficient design of scaled cells.     

A 3.5-ns, 500-mW, 16-kbit BiCMOS ECL RAM

A 16-kbit BiCMOS ECL SRAM with a typical address access time of 3.5 ns and 500-mW power dissipation was developed. The RAM was fabricated using half-micrometer, triple-poly, and triple-metal BiCMOS technology. The fast access time with moderate power dissipation has been achieved using new circuit techniques: a grounded-gate, nonlatching-type level converter with a wired-OR predecoder and a direct column sensing scheme having a cascode differential amplifier. As a result of extensive use of high-speed bipolar ECL circuits with self-aligned bipolar transistors, the RAM attains high-speed performance without degrading the low-power BiCMOS RAM characteristics.<>