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A computer simulation is used to study the problem of internal scattering for targets that are imaged using X-ray microtomography. A strategy is outlined for selecting X-ray energy and image resolution based on properties of the material being imaged. The X-ray scanning process is simulated by applying a Monte Carlo technique to a modeled target that emulates the material properties of a microelectronic device. The X-ray photons are subject to photoelectric absorption, Rayleigh scattering, and Compton scattering. The simulation applies a method of high-resolution image reconstruction based on discrete Fourier transforms. Examples of reconstructed images that have 0.5-μm spatial resolution are shown for images of simulated lead and aluminum targets  相似文献   
2.
Principal components analysis (PCA) of X-ray transmission tomography images made at several different energies can produce images that allow individual materials to be distinguished more clearly than in single-energy images. Computer simulations and tests on a five-band mineral data set demonstrate the application of PCA  相似文献   
3.
The authors describe a novel technique for the nondestructive evaluation of microelectronic components using X-ray microtomography. Existing microtomography systems have spatial resolution of order 1 μm but require X-ray source brilliance that would become unachievable at higher resolutions. The authors describe an imaging method that reduces the number of X-ray photons required from the source without degrading the resolution. The feasibility of the technique is demonstrated through a series of computer simulations. The results are verified with real data from synchrotron experiments  相似文献   
4.
For two-dimensional x-ray imaging of thin films, the technique of scanning transmission x-ray microscopy (STXM) has achieved images with feature sizes as small as 40 nm in recent years. However, calibration of three-dimensional tomographic images that are produced with STXM data at this scale has not yet been described in the scientific literature, and the calibration procedure has novel problems that have not been encountered by x-ray tomography carried out at a larger scale. In x-ray microtomography, for example, one always has the option of using optical imaging on a section of the object to verify the x-ray projection measurements; with STXM, on the other hand, the sample features are too small to be resolved by light at optical wavelengths. This fact implies that one must rely on procedures with higher resolution, such as atomic force microscopy (AFM), for the calibration. Such procedures, however, generally depend on a highly destructive sectioning of the sample, and are difficult to interpret because they give surface information rather than depth information. In this article, a procedure for calibration is described that overcomes these limitations and achieves a calibration of an STXM tomography image with an AFM image and a scanning electron microscopy image of the same object.A Ge star-shaped pattern was imaged at a synchrotron with a scanning transmission x-ray microscope. Nineteen high-resolution projection images of 200 × 200 pixels were tomographically reconstructed into a three-dimensional image. Features in two-dimensional images as small as 40 nm and features as small as 80 nm in the three-dimensional reconstruction were resolved. Transverse length scales based on atomic force microscopy, scanning electron microscopy, x-ray transmission and tomographic reconstruction agreed to within 10 nm. Toward the center of the sample, the pattern thickness calculated from projection images was (51 ± 15) nm vs (80 ± 52) nm for tomographic reconstruction, where the uncertainties are evaluated at the level of two standard deviations.  相似文献   
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