An efficient verifiable (t,n)-threshold secret image sharing scheme with ultralight shares

Multimedia Tools and Applications - A secret sharing scheme partitions a secret into a set of shares and distributes them among the eligible participants, with each participant receiving one share...     

Synthesis,structure, CO oxidation,and H2 production activities of CaCu3−xMnxTi4−xMnxO12 (x = 0, 0.5, and 1.0)

Synthesis of nanocrystalline pristine and Mn-doped calcium copper titanate quadruple perovskites, CaCu_3?xMn_xTi_4?xMn_xO₁₂ (x = 0, 0.5, and 1.0) by modified citrate solution combustion method has been reported. Powder X-ray diffraction patterns attest the phase purity of the perovskite materials. Average particle sizes of all the materials obtained from the Scherrer's formula are in the range of 55–70 nm. The specific surface areas for all the perovskites obtained from BET isotherms are found to be low as expected for the condensed oxide systems and fall in the range of 13–17 m² g^?1. Transmission electron microscopy studies show a reduction in particle size of CaCu₃Ti₄O₁₂ with increase in Mn doping. Ca and Ti are present in +2 and +4 oxidation states in all the materials as demonstrated by X-ray photoelectron spectroscopy analyses. Cu²⁺ gets reduced in CaCu₃Ti₄O₁₂ with higher Mn content. Mn is observed to be present only in +3 oxidation state. All the materials have been examined to be active in CO oxidation as well as H₂ production from methanol steam reforming. CaCu₃Ti₄O₁₂ with ~14 at.% Mn is found to show best catalytic activities among these materials. A comprehensive analysis of the catalytic activities of these perovskites toward CO oxidation and H₂ production from MSR reveal the cooperative activity of copper-manganese in the doped perovskites and it is more effective at lower manganese content.     

Synthesis and characterization of biocompatible hydroxyapatite coated ferrite

Ferrite particles coated with biocompatible phases can be used for hyperthermia treatment of cancer. We have synthesized substituted calcium hexaferrite, which is not stable on its own but is stabilized with small substitution of La. Hexaferrite of chemical composition (CaO)_0.75(La₂0₃)_0.20(Fe₂O₃)₆ was prepared using citrate gel method. Hydroxyapatite was prepared by precipitating it from aqueous solution of Ca(NO₃)₂ and (NH₄)₂HPO₄ maintaining pH above 11. Four different methods were used for coating of hydroxyapatite on ferrite particles. SEM with EDX and X-ray diffraction analysis shows clear evidence of coating of hydroxyapatite on ferrite particles. These coated ferrite particles exhibited coercive field up to 2 kOe, which could be made useful for hysteresis heating in hyperthermia. Studies by culturing BHK-21 cells and WBC over the samples show evidence of biocompatibility. SEM micrographs and cell counts give clear indication of cell growth on the surface of the sample. Finally coated ferrite particle was implanted in Kasaulli mouse to test its biocompatibility. The magnetic properties and biocompatibility studies show that these hydroxyapatite coated ferrites could be useful for hyperthermia.     

Life expectancies of Pb-free SAC solder interconnects in electronic hardware

The transition from lead (Pb) bearing solder to Pb-free solder has arisen in response to government restrictions on the use of lead (Pb) by the European Union. As a result, electronic manufacturers have sought a material comparable to the conventional 63Sn37Pb solder that has been traditionally used to assemble electronic hardware. Based on extensive review of various solder combination, the majority of electronic manufacturers appear to be adopting a tin–silver–copper (SAC) solder as a popular Pb-free solder replacement. Significant investments have been made by many researchers to characterize the material behavior and durability of this solder system. While the exact composition of the SAC solder is still in question, it now appears that the 96.5Sn3.0Ag0.5Cu (SAC305) solder is gaining wider acceptance as the favored Pb-free replacement, for surface mount assemblies that are going to be subjected predominantly to cyclic thermal environments. This paper presents a review of our current understanding of the life expectancy of Pb-free SAC solder interconnects for electronic hardware. To this end, the paper focuses on material characterization of SAC solder, as well as its temperature cycling and vibration fatigue reliability. From this review, SAC solder interconnects are shown to be suitable for providing adequate life expectancies for temperature cycling in electronic hardware. However, it is clear that there are differences between SAC and the conventional Sn37Pb solder, that need to be understood in order to design reliable electronic hardware.     

Time dispersion in large plastic scintillation neutron detectors

Time dispersion (TD) is computed for large neutron detectors using plastic scintillators. It is shown that TD seen by the photomultiplier (PM) tube does not necessarily increase with incident neutron energy, which is a result not fully in agreement with the usual finding     

A transmit/receive IF chip set for WCDMA mobiles in 0.35 /spl mu/m CMOS

An implementation of the IF section of WCDMA mobile transceivers with a set of two chips fabricated in an inexpensive 0.35-/spl mu/m two-poly three-metal CMOS process is presented. The transmit/receive chip set integrates quadrature modulators and demodulators, wide dynamic range automatic gain control (AGC) amplifiers, with linear-in-decibel gain control, and associated circuitry. This paper describes the problems encountered and the solutions envisaged to meet stringent specifications, with process and temperature variations, thus overcoming the limitations of CMOS devices, while operating at frequencies in the range of 100 MHz-1 GHz. Detailed measurement results corroborating successful application of the new techniques are reported. A receive AGC dynamic range of 73 dB with linearity error of less than /spl plusmn/2 dB and spread of less than 5 dB for a temperature range of -30/spl deg/C to +85/spl deg/C in the gain control characteristic has been measured. The modulator measurement shows a carrier suppression of 35 dB and sideband/third harmonic suppression of over 46 dB. The core die area of each chip is 1.5 mm/sup 2/.     

Function dependent fully testable programmable logic array

Two techniques for designing function-dependent easily testable programmable logic arrays are presented. The techniques can detect all the multiple stuck-at, crosspoint and bridging faults, as compared with most of the existing techniques where some of the faults, especially bridging faults, remain undetected.<>