Ti和Al反应的动力学分析

以Ti粉、纯Al和钛纤维为原料,采用压力浸渗法研制了Tif+Tip/Al复合材料,利用XRD和SEM测试分析了复合材料的相组成和显微组织,利用EDX测试分析了不同反应温度下纤维周围反应层中Al的浓度分布。计算了Ti和Al间的扩散系数,确定了扩散系数与温度和成分的变化规律,求出扩散激活能。结果表明,随着反应温度的升高,纤维周围的反应层厚度逐渐增大,各相的互扩散系数逐渐增大,各相的扩散激活能存在如下关系:Q_(Ti_3Al)〉Q_(TiAl_2)〉Q_(TiAl)〉Q_(TiAl_3)。     

Microstructure and electric properties of Sip/Al composites for electronic packaging applications

Sip/1 199, Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure, panicle volume fraction, panicle size, matrix alloy and heat treatment on the electrical properties of composites were discussed, and the electrical conductivity was calculated by theoretical models. It is shown that the Si/Al interfaces are clean and do not have interface reaction products. For the same matrix alloy, the electrical conductivity of composites decreases with increasing the reinforcement volume fraction. As for the same panicle content, the electrical conductivity of composites decreases with increasing the alloying element content of matrix. Panicle size has little effects on the electrical conductivity. Electrical conductivity of composites increases slightly after annealing treatment. The electrical conductivity of composites calculated by P.G model is consistent with the experimental results.     

电子封装用SiC_p／Cu复合材料制备与性能

采用挤压铸造方法制备了体积分数为55％、不同颗粒粒径增强的电子封装用SiCp／Cu复合材料,并分析了颗粒尺寸和热处理状态对材料物理性能和力学性能的影响规律。显微组织观察表明SiC颗粒分布均匀,复合材料组织致密;随着SiC颗粒尺寸的减小,复合材料的平均线膨胀系数和热导率均降低;退火处理可以降低复合材料的热膨胀系数,同时提高材料的热导率。复合材料具有高的弯曲强度和弹性模量,退火处理后材料的弯曲强度降低,但弹性模量变化不大。     

环保型电子封装用Sip/Al复合材料性能研究

为研究电子封装用Sip/Al复合材料热物理及力学性能,利用挤压铸造方法制备了体积分数为65%的Sip/LD11(Al-12%Si)可回收环保型复合材料.采用TEM观察、膨胀仪、激光导热综合测试仪以及万能电子拉伸试验机等设备及技术对复合材料进行研究.结果表明:Sip/LD11复合材料组织致密,材料中未观察到孔洞和缺陷;20～50℃时复合材料的热膨胀系数为8.1×10-6/℃,并随着温度的升高而增加,退火处理能够降低复合材料的热膨胀系数;Sip/LD11复合材料铸造状态和热处理状态的热导率分别为132.9、160.1 W/m·℃,复合材料的弯曲强度和比模量较高;可以采用化学镀方法在复合材料表面涂覆Ni层,镀层结合强度良好,是一种优异的电子封装用复合材料.     

一种环保型电子封装用复合材料

采用挤压铸造专利技术制备了体积分数为65%高纯Si的环保型Sip/Al-Si20复合材料。试验结果表明:复合材料的铸态组织均匀、致密,没有明显的颗粒团聚和偏聚,也不存在微小的孔洞和明显的缺陷;Sip/Al-Si20是一种轻质(密度为2.4g/cm3)、低膨胀系数(7.77×10-6℃-1)、高热导率[156.34W/(m·℃)]复合材料,电导率为4.08MS/m,具有较高的比模量和比强度;Sip/Al-Si20复合材料可以进行镀Ni和封装焊接。     

3D-Si/LG5复合材料微观组织及热物理性能研究

采用压力浸渗技术制备Sip/LG5复合材料并对其进行高温扩散处理。组织观察表明:复合材料增强体形貌经过高温扩散处理后由不规则的尖角形状转变为三维网络结构(3D)。对3D-Si/LG5复合材料界面的研究表明,与高温扩散处理前复合材料的界面相比,三维网络结构3D-Si/LG5复合材料的界面更光滑,界面结合程度也更好。三维网络结构3D-Si/LG5复合材料界面处及基体合金内部有Si析出,基体合金中存在着孪晶;三维网络结构3D-Si/LG5复合材料的平均线膨胀系数与高温扩散处理前相比,降低了10.5%;增强体三维网络化减少界面及基体中大量细小弥散的Si析出,使得三维网络3D-Si/LG5复合材料的热导率变化不大。     

Microstrucmre and thermal properties of recyclable Sip/1199A1 composites

Recyclable Si_p/1199Al composites with high volume fraction of Si particles were fabricated by squeeze-casting method. The microstructure was observed and the thermal properties were tested and calculated by theoretical models. Si_p/1199Al composites are all dense and macroscopically homogeneous without any particle clustering. The interface of Si_p/1199Al is clean, smooth and free from any interfacial reaction products. Si_p/1199Al composites have high thermal diffusivity (65.083 mm²/s) and thermal conductivity (168.211 W/(m· °C)). The specific heat capacity of Si_p/1199Al composites at constant pressure increases while the thermal diffusivity and thermal conductivity decrease with increasing temperature. Annealing treatment could improve the thermal properties. The results of Maxwell model and P.G. model are higher than those of experiment.     

钨丝增强铜基复合材料的动态力学性能及断裂特性

通过渗流铸造的方法制备出Wf/Cu82Al10Fe4Ni4复合材料,采用分离式霍普金森压杆(SHPB)和扫描电镜(SEM)研究其动态压缩行为及断裂特性。结果表明:复合材料界面结合紧密,受冲击时体现出良好的界面结合强度;在应变率为2000s-1下动态压缩材料发生部分塑性变形,局部表面出现裂纹;在应变率为3000s-1下动态压缩材料的动态压缩强度达到2500MPa,材料内部出现钨丝劈裂、钨丝弯曲断裂以及基体合金断裂3种破坏模式。同时,在材料的断裂面上出现大量熔化带,分析认为熔化是随着应变率的提高而出现的,它改变了复合材料的断裂方式,加速了Wf/Cu82Al10Fe4Ni4复合材料的整体失效。     

Microstructure and Mechanical Properties of AlSiTiCrNiCu Particles Reinforced Al6061 Composites by SPS and HPS Process

Three groups of AlSiTiCrNiCu high entropy alloy (HEA) particles reinforced Al606l composites were fabricated by spark plasma sintering at 520 and 570 ℃ (S520,S570) and by hot-pressed sintering at 570 ℃(H570).The AlSiTiCrNiCu (AST) particles used as reinforcements were synthesized by mechanical alloying.The influences of the sintering process on the microstructure and mechanical properties of composites were investigated.The results showed that the AST particles had a near-equiatomic composition ...     

Y2O3/Sn-58Bi复合钎料制备及其性能分析

文中通过粉末冶金法制备了Y₂O₃/Sn-58Bi复合钎料.结果表明,添加少量Y₂O₃,对复合钎料熔点影响较小;随着Y₂O₃质量分数提高,复合钎料的密度和显微维氏硬度先升高后降低;复合钎料的润湿角表现出相反的趋势,随着Y₂O₃质量分数提高,复合钎料的润湿角先降低后升高.通过测试Sn-58Bi钎料和0.1%（质量分数）Y₂O₃/Sn-58Bi复合钎料拉伸试样的力学性能发现,添加质量分数为0.1%的Y₂O₃对复合钎料强度稍有提高,但能明显提高复合钎料的延展性,从而解决传统Sn-58Bi钎料较脆的难题.通过观察钎料拉伸断口发现,添加Y₂O₃能够细化复合钎料微观组织,使裂纹沿着断裂方向扩展时受到阻碍,抑制了钎料脆性断裂的趋势.