全文获取类型
收费全文 | 71篇 |
免费 | 6篇 |
国内免费 | 10篇 |
专业分类
综合类 | 4篇 |
化学工业 | 2篇 |
金属工艺 | 37篇 |
机械仪表 | 11篇 |
武器工业 | 1篇 |
无线电 | 3篇 |
一般工业技术 | 27篇 |
冶金工业 | 2篇 |
出版年
2022年 | 1篇 |
2021年 | 1篇 |
2020年 | 1篇 |
2019年 | 1篇 |
2018年 | 1篇 |
2016年 | 2篇 |
2014年 | 2篇 |
2012年 | 5篇 |
2011年 | 6篇 |
2010年 | 4篇 |
2009年 | 14篇 |
2008年 | 4篇 |
2007年 | 7篇 |
2006年 | 7篇 |
2005年 | 12篇 |
2004年 | 3篇 |
2003年 | 6篇 |
2002年 | 1篇 |
2001年 | 1篇 |
2000年 | 1篇 |
1999年 | 1篇 |
1998年 | 3篇 |
1987年 | 1篇 |
1983年 | 1篇 |
1982年 | 1篇 |
排序方式: 共有87条查询结果,搜索用时 31 毫秒
1.
为研究基体合金对B4C/Al复合材料力学性能及抗弹性能的影响,选择强度、硬度和塑性各不相同的5083Al、2024Al和7075Al铝合金为基体合金,采用压力浸渗工艺制备B4C颗粒增强体积分数为55%的B4C/5083Al、B4C/2024Al和B4C/7075Al复合材料,并对其进行力学性能和抗弹性能测试。结果表明:3种B4C/Al复合材料的力学性能特征与基体铝合金相对应,B4C/7075Al复合材料的强度和硬度最高,抗侵彻能力最好,侵彻深度为15.7 mm,防护系数为4.13;B4C/5083Al复合材料的塑性最好,其靶板整体能力最好。 相似文献
2.
在不同真空度条件下(0.01、0.03、0.05、0.07和0.1MPa),采用销盘式摩擦磨损试验机研究气压对TiB2/Al复合材料的摩擦学行为的影响。结果表明:随着气压的增加,摩擦系数呈现下降的趋势,而磨损率变化不大。能谱分析表明,随着真空度的升高,磨损表面的Fe含量逐渐下降,与摩擦系数的下降趋势保持一致。 相似文献
3.
Recyclable Sip/1199Al composites with high volume fraction of Si particles were fabricated by squeeze-casting method. The microstructure was observed and the thermal properties were tested and calculated by theoretical models. Sip/1199Al composites are all dense and macroscopically homogeneous without any particle clustering. The interface of Sip/1199Al is clean, smooth and free from any interfacial reaction products. Sip/1199Al composites have high thermal diffusivity (65.083 mm2/s) and thermal conductivity (168.211 W/(m· °C)). The specific heat capacity of Sip/1199Al composites at constant pressure increases while the thermal diffusivity and thermal conductivity decrease with increasing temperature. Annealing treatment could improve the thermal properties. The results of Maxwell model and P.G. model are higher than those of experiment. 相似文献
4.
5.
6.
7.
Sip/1 199, Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure, panicle volume fraction, panicle size, matrix alloy and heat treatment on the electrical properties of composites were discussed, and the electrical conductivity was calculated by theoretical models. It is shown that the Si/Al interfaces are clean and do not have interface reaction products. For the same matrix alloy, the electrical conductivity of composites decreases with increasing the reinforcement volume fraction. As for the same panicle content, the electrical conductivity of composites decreases with increasing the alloying element content of matrix. Panicle size has little effects on the electrical conductivity. Electrical conductivity of composites increases slightly after annealing treatment. The electrical conductivity of composites calculated by P.G model is consistent with the experimental results. 相似文献
8.
热挤压变形对亚微米A12O3p/Al复合材料组织性能的影响 总被引:9,自引:0,他引:9
利用金相显微镜、扫描电镜、透射电镜和万能拉伸试验机等手段考察了粒度为0.3μm的A12O3颗粒(体积分数为26%)增强6061A1复合材料在热挤压前后的显微组织及室温拉伸性能。结果表明:以10:1的挤压比热挤压后复合材料组织的均匀性得到了明显改善,显微组织变化上呈现位错由压铸态的近无位错转变为位错有明显增殖特征,并促进了时效析出;复合材料挤压材的抗拉强度、屈服强度和延伸率较压铸材普遍提高;热挤压没有改变复合材料的断裂机制,由于挤压后颗粒分布均匀等原因,使复合材料的塑性得到改善。 相似文献
9.
采用液相包裹法对Al2O3微粉进行稀土Y2O3表面改性,用挤压铸造法制备表面经稀土Y2O3改性的Al2O3/Al复合材料,并对复合材料的显微组织及界面进行观察和分析。结果表明:表面经稀土Y2O3改性的Al2O3微粉能均匀的分布于基体中,界面润湿性得以改善,复合材料组织更加均匀。拉伸性能测试表明:改性粉体对Al合金拉伸性能增强效果明显。对复合材料界面进行TEM,HREM及电子衍射分析表明,界面结合良好,界面处有Y2Al生成。EDAX分析表明界面相是钇、铝含量很高的物相;XRD图谱中也显示出Y2Al的衍射峰。 相似文献
10.
For the electronic packaging applications, copper matrix composites reinforced with different sized SiC particles (10 μm, 20 μm and 63 μm) were fabricated by squeeze casting technology. And the effect of particle size on their thermo-physical properties was discussed. The composites are free of porosity and the SiC particles are distributed uniformly in the composites. It is found that the mean linear thermal expansion coefficients(20 - 100 ℃ ) of SiCp/Cu composites are in the range of (8.4 - 9.2) × 10-6/℃, and smaller expansion coefficient can be obtained for the composites with finer SiC particles because of the larger restriction in expansion through interfaces. Their thermal conductivities are reduced with the decrease of SiC sizes. This is attributed to the fact that the negative effect of interfacial thermal resistance becomes increasingly dominant as the particles becomes smaller. 相似文献