Design of Deep Convolution Neural Networks for categorical signature classification of raw panchromatic satellite images

Multimedia Tools and Applications - Remote Sensing categorical signature classification has gained significant implications on spatial resolution image analysis due to differences in the...     

Ultrafast Electron–Phonon Coupling at Metal-Dielectric Interface

Energy transfer from photo-excited electrons in a metal thin film to the dielectric substrate is important for understanding the ultrafast heat transfer process across the two materials. Substantial research has been conducted to investigate heat transfer in a metal-dielectric structure. In this work, a two-temperature model in metal was used to analyze the interface electron and dielectric substrate coupling. An improved temperature and wavelength-dependent Drude–Lorentz model was implemented to interpret the signals obtained in optical measurements. Ultrafast pump-and-probe measurements on Au-Si samples were carried out, where the probe photon energy was chosen to be close to the interband transition threshold of gold to minimize the influence of non-equilibrium electrons on the optical response and maximize the thermal modulation to the optical reflectance. Electron-substrate interface thermal conductance at different pump laser fluences was obtained, and was found to increase with the interface temperature.     

Low temperature crystallographic data on Kevlar 49 fibres

Using X-ray diffraction data, the behaviour of Kevlar 49 fibres at low temperatures, up to –100°C, has been analysed. During cooling, the basal plane of the monoclinic unit cell shrinks whereas the c- (unique, chain axis) length is not significantly affected. In contrast, in the return heating cycle to ambient temperature, the basal plane expands and contraction occurs along the chain direction. The unit cell registers a reduction in volume in both the cooling and heating cycles. Conspicuously, after a cycle of cooling and heating, the unit cell does not return to its initial volume.     

Reducing cycle times in manufacturing and supply chains by input and service rate smoothing

A key performance parameter of a manufacturing network or supply chain is its cycle time; the time that a typical item spends in the network. A previous simulation study on a semiconductor assembly and test facility showed that cycle times could be reduced by having smooth input and service rates. This suggested that there is a “cycle time principle” that, for a system with a specified throughput or input rate, the shortest cycle times are obtained when the input and service rates do not vary over time. We prove that this principle is true for the M/G/1 and M/M/s queueing systems and Jackson networks. The analysis involves establishing several results on the concavity of waiting time probabilities and the convexity of expected waiting times and queue lengths, as functions of input and service rates. These results also have natural uses in other optimization problems.     

Synthesis of new sulphides of transition metal ions in presence of sun light

New sulphides of transition metal ions [M⁺ⁿ = Cu⁺¹, Cu⁺² and Zn⁺²] have been synthesised in sunlight. XRD patterns show that these compounds are not MxSy but are mercaptyl, hydroxyl metal sulphides [M(SH)(OH)(H₂O)₂] which is further ascertained by I.R. spectra showing bands due to T _d-symmetry. ESCA of compound of copper in solid state shows presence of Cu¹⁺ and Cu²⁺ ion. The presence of hydroxyl, mercaptyl, aqua and S^–2 groups has finally been confirmed with TGA, DTA and ESCA. Conductivity and Seebeck coefficient measurements show that compound of copper is p-type semiconductor and compound of zinc is n-type semiconductor. The production of these low cost materials opens an interesting area of research and development for their use in solar cell devices.     

A Low-Supply-Voltage CMOS Sub-Bandgap Reference

A low-power (21 $muhbox{W}$ ) bandgap reference source that is operable from a nominal supply voltage of 1.4 V is described. The circuit provides an output voltage equal to the bandgap voltage having a low output resistance and allows resistive loading. It does not use resistors or operational amplifiers. Thus, the design is suitable for fabrication in any digital CMOS technology. The circuit uses a current conveyor and current mirrors to convert the proportional to absolute temperature voltage into a current using a MOSFET. The current is converted back to a voltage by using the functional inverse of the FET $v-i$ characteristics. This makes the voltage gain linear and temperature independent. The absence of back-gate bias is the reason for achieving the low supply voltage of operation. Simulation results using the transistor models for the 0.18-$mu$m TSMC process show that the voltage-variation over the temperature range 0 to 100 $^{circ} {hbox {C}}$ is $≪$1 mV.      

Development of Stretch Solder Interconnections for Wafer Level Packaging

A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.     

Effects of situational demand upon social enjoyment and preference in schizotypy.

The socioemotional functioning of schizophrenic and schizotypic individuals is marked by withdrawal, poor organization, and limited emotional displays. Such behavioral tendencies and lack of social enjoyment in schizotypy could be linked to the relative situational demands or role ambiguity inherent in specific social activities. To determine whether high-schizotypy individuals prefer more clearly role-defined social activities (e.g., visiting relatives) to more ambiguous, novel situations (e.g., going alone to a party), the authors gathered reports from 52 high-schizotypy and 60 low-schizotypy individuals on their enjoyment and frequency of engaging in social situations varying in relative situational demand. Parallel reports were obtained from knowledgeable others. Group × Situational Demand interactions revealed the hypothesized pattern of reduced frequency and enjoyment ratings for ambiguous or novel situations by the high-schizotypy participants in both self and others' reports. Groups were more comparable in their reported frequency and enjoyment of less ambiguous situations. Results suggest the importance of situational demands in the socioemotional experience and behavioral withdrawal in schizotypy. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

Disaster recovery planning in an automated manufacturingenvironment

Disasters may strike at any moment in any location. When they do, no distinction is made about the type of firm that is being affected, whether it is a bank or a manufacturing plant. Most firms do not plan for possible disasters, and those that do have typically focused on computer and data contingency planning. In this paper, the focus is shifted to incorporate disaster recovery planning for manufacturing enterprises, especially those that are automated. Automated manufacturing enterprises have characteristics that put them at an increased risk to disasters. The methodological framework proposed in this paper will aid manufacturing organizations and their managers in reducing the risks associated with unanticipated disasters. The framework is termed the “Manufacturing Operations Recovery and Resumption” model. Recommended activities and tools for effective management of this methodology are identified