Sub-zero cooling: A novel strategy for high performance cutting

In this paper, a novel cooling strategy for high performance cutting is presented. A metalworking fluid, composed of water and polyhydric alcohols is applied at temperatures below 0 °C, but above the temperatures used for cryogenic cutting. This cooling strategy is applied when rough turning Ti-6Al-4V. An analysis of temperatures, forces, tool wear and chip formation is carried out. The results are compared with those obtained using emulsion, CO₂, LN₂, and dry turning. It can be shown that when tempering the sub-zero metalworking fluid down to ?30° C, tool temperatures as well as tool wear are reduced, and favourable chips are produced.     

Theranostic USPIO‐Loaded Microbubbles for Mediating and Monitoring Blood‐Brain Barrier Permeation

Efficient and safe drug delivery across the blood‐brain barrier (BBB) remains one of the major challenges of biomedical and (nano‐) pharmaceutical research. Here, it is demonstrated that poly(butyl cyanoacrylate)‐based microbubbles (MB), carrying ultrasmall superparamagnetic iron oxide (USPIO) nanoparticles within their shell, can be used to mediate and monitor BBB permeation. Upon exposure to transcranial ultrasound pulses, USPIO‐MB are destroyed, resulting in acoustic forces inducing vessel permeability. At the same time, USPIO are released from the MB shell, they extravasate across the permeabilized BBB and they accumulate in extravascular brain tissue, thereby providing non‐invasive R ₂*‐based magnetic resonance imaging information on the extent of BBB opening. Quantitative changes in R ₂* relaxometry are in good agreement with 2D and 3D microscopy results on the extravascular deposition of the macromolecular model drug fluorescein isothiocyanate (FITC)‐dextran into the brain. Such theranostic materials and methods are considered to be useful for mediating and monitoring drug delivery across the BBB and for enabling safe and efficient treatment of CNS disorders.     

Flexible Splicing of Upper‐Body Motion Spaces on Locomotion

This paper presents an efficient technique for synthesizing motions by stitching, or splicing, an upper‐body motion retrieved from a motion space on top of an existing lower‐body locomotion of another motion. Compared to the standard motion splicing problem, motion space splicing imposes new challenges as both the upper and lower body motions might not be known in advance. Our technique is the first motion (space) splicing technique that propagates temporal and spatial properties of the lower‐body locomotion to the newly generated upper‐body motion and vice versa. Whereas existing techniques only adapt the upper‐body motion to fit the lower‐body motion, our technique also adapts the lower‐body locomotion based on the upper body task for a more coherent full‐body motion. In this paper, we will show that our decoupled approach is able to generate high‐fidelity full‐body motion for interactive applications such as games.     

Iron Oxide‐Labeled Collagen Scaffolds for Non‐Invasive MR Imaging in Tissue Engineering

Non‐invasive imaging holds significant potential for implementation in tissue engineering. It can be used to monitor the localization and function of tissue‐engineered implants, as well as their resorption and remodelling. Thus far, however, the vast majority of effort in this area of research have focused on the use of ultrasmall super‐paramagnetic iron oxide (USPIO) nanoparticle‐labeled cells, colonizing the scaffolds, to indirectly image the implant material. Reasoning that directly labeling scaffold materials might be more beneficial (enabling imaging also in the case of non‐cellularized implants), more informative (enabling the non‐invasive visualization and quantification of scaffold degradation), and easier to translate into the clinic (cell‐free materials are less complex from a regulatory point‐of‐view), three different types of USPIO nanoparticles are prepared and incorporated both passively and actively (via chemical conjugation; during collagen crosslinking) into collagen‐based scaffold materials. The amount of USPIO incorporated into the scaffolds is optimized, and correlated with MR signal intensity, showing that the labeled scaffolds are highly biocompatible, and that scaffold degradation can be visualized using MRI. This provides an initial proof‐of‐principle for the in vivo visualization of the scaffolds. Consequently, USPIO‐labeled scaffold materials seem to be highly suitable for image‐guided tissue engineering applications.     

金属沾污对超薄栅氧(2. 5nm)特性的影响

采用可控的金属沾污程序 ,最大金属表面浓度控制在 10 1 2 cm- 2数量级 ,来模拟清洗工艺最大可能金属沾污表面浓度 .利用斜坡电流应力和栅注入方式测量本征电荷击穿来评估超薄栅氧特性和金属沾污效应 .研究了金属锆和钽沾污对超薄栅氧完整性的影响 .实验结果表明金属锆沾污对超薄栅氧完整性具有最严重危害 ;金属钽沾污的栅氧发生早期击穿现象 ,而金属铝沾污对超薄栅氧完整性没有明显影响 .     

Resource-efficient routing and scheduling of time-constrained streaming communication on networks-on-chip

Network-on-chip-based multiprocessor systems-on-chip are considered as future embedded systems platforms. One of the steps in mapping an application onto such a parallel platform involves scheduling the communication on the network-on-chip. This paper presents different scheduling strategies that minimize resource usage by exploiting all scheduling freedom offered by networks-on-chip. It also introduces a technique to take the dynamism in applications into account when scheduling the communication of an application on the network-on-chip while minimizing the resource usage. Our experiments show that resource-utilization is improved when compared to existing techniques.     

Analysis of rectangular waveguide-gratings for amplifierapplications

A slow-wave structure composed of a grating inside a rectangular waveguide is analyzed. This type of slow-wave structure is examined for use in a low-voltage amplifier application with a sheet electron beam. Dispersion curves, mode field profiles, and taper designs for the waveguide-grating are presented. The amplifier application places stringent requirements on the taper sections that match the smooth waveguide to the waveguide-grating with minimal reflection     

New latchup mechanism in complementary bipolar power ICs triggered by backside die attach Glue

It is shown that in complementary bipolar power ICs latchup can be caused by a thyristor formed by the V-PNP power transistor at the frontside of the die and a Ag-filled glue die attach at the backside of the die (used to provide a good thermal contact between the die and the Cu-heatsink. The thyristor is triggered by saturation of the V-PNP power transistors or by forward biasing the backside diode between Ag-filled glue and p-type silicon. The effect is strongly temperature dependent. It can be eliminated by either leaving the backside floating or by applying backside metallization. Consequences for latchup qualification testing are discussed.