几种复合材料的简介

介绍几种主要复合材料的性能和使用情况,对我国的木材利用提供一些参考。     

Neural network systems to reproduce crash behavior of structural components

The use of neural networks as global approximation tool in crashworthiness problems is here investigated. Neural networks are not only asked to return some meaningful indices of the structural behavior but also to reproduce load-time curves during crash phenomena. To contain the number of examples required for the training process, parallel subsystems of small neural networks are designed. Design points for the training process are obtained by explicit finite element analyses performed by PAMCRASH. The settlement of the points in the design domain is defined using a maximum distance concept. The procedure is applied to different typical absorption structures made of aluminum alloy: riveted tubes, honeycomb structures, longitudinal keel beam and intersection elements of helicopter subfloors.     

The ethics of asking about abuse and the harm of "don't ask, don't tell."

Replies to comments by J. Read (see record 2007-07130-012), D. Gleaves et al (see record 2007-07130-013), V. Edwards et al (see record 2007-07130-014), M. Black and R. Black (see record 2007-07130-015), and S. Ullman (see record 2007-07130-016), which raised important points about the authors' original article (see record 2006-03947-003). Those comments extend our thinking about how to ask participants about abuse in an ethical way. Together, the comments point to the importance of researchers examining our own reasons for asking--or not asking--about abuse and of paying attention to how we respond when we ask. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

材质对蜂窝纸板缓冲性能的影响

对两种不同材质的蜂窝纸板静态应力应变性能和动态缓冲结果进行了比较分析。讨论了蜂窝纸板力学性能对应变速度的敏感性及两种纸板的缓冲性能差异。缓冲试验结果表明。在不同的冲击应变率下蜂窝纸板的材质影响蜂窝纸板缓冲性能。     

Trade-off analysis on cost and manufacturing technology of an electronic product: Case study

A trade-off analysis on the cost and system packaging metrics of an electronic product aimed at the commercial/retail industry has been carried out. By comparing the system cost and packaging metrics with those of comparable consumer products, we have determined that there is opportunity for significant cost, size, and weight reduction of the overall electronics packaging system. These include the use of fine pitch IC packages, smaller discrete components, denser PCB wiring technology, double sided IC package surface mount, surface mount connectors, and improved plastics for the product housing. The analysis concluded that PCB area reduction of 40%, using a single PCB instead of three boards, reduction in board cost of over 50% and product weight reduction of over 28% are possible using available technologies.     

The globally Bi-3-connected property of the honeycomb rectangular torus

The honeycomb rectangular torus is an attractive alternative to existing networks such as mesh-connected networks in parallel and distributed applications because of its low network cost and well-structured connectivity. Assume that m and n are positive even integers with n ? 4. It is known that every honeycomb rectangular torus HReT(m,n) is a 3-regular bipartite graph. We prove that in any HReT(m,n), there exist three internally-disjoint spanning paths joining x and y whenever x and y belong to different partite sets. Moreover, for any pair of vertices x and y in the same partite set, there exists a vertex z in the partite set not containing x and y, such that there exist three internally-disjoint spanning paths of G-{z} joining x and y. Furthermore, for any three vertices x, y, and z of the same partite set there exist three internally-disjoint spanning paths of G-{z} joining x and y if and only if n ? 6 or m = 2.     

Low Dielectric Polyimide/Fluorinated Ethylene Propylene (PI/FEP) Nanocomposite Film for High-Frequency Flexible Circuit Board Application

The low dielectric polymer films have drawn great attention to the application as the dielectric insulating materials in high-frequency circuit boards, while the weak adhesion to the copper foils and the poor processability resulted from the fluorinated or rigid structures limited their high-frequency application. In this work, the low dielectric and high adhesive polyimide/fluorinated ethylene propylene (PI/FEP) nanocomposite film for high-frequency flexible circuit board application is developed. It is indicated that the fluorocarbon surfactants can significantly improve the dispersion of FEP in PI substrate, and thus, the PI/FEP nanocomposite film exhibits excellent mechanical properties, including the tensile strength increases to 46.6 MPa and the elongation at the break increases to 13.7%. Importantly, at the high-frequency of 10 GHz, the 60 wt% FEP filled PI nanocomposite film displays an ultralow dielectric loss (0.006) and a reduced dielectric constant (2.69). In addition, the high-frequency flexible circuit board with the PI/FEP film as the dielectric insulating layer has a high peel strength of 0.75 N mm⁻¹, indicating this PI/FEP nanocomposite film can meet the requirements of the high-frequency flexible circuit board application.     

3D Printing Conductive Composites with Poly(ionic liquid) as a Noncovalent Intermedia to Fabricate Carbon Circuits

In this study, a kind of imidazole type poly(ionic liquid) ([PEP-MIM]Cl) is synthesized, which can disperse carbon effectively. [PEP-MIM]Cl is used as an intermediate to coat carbon on the poly(acrylic acid)(PAA-co-MBA) via ion exchange to obtain conductive polymer composite (CPC). A series of characterizations are performed. Experiments show that carbon can be coated on the PAA-co-MBA uniformly, and compared with using carbon as filler, this method requires less carbon to achieve good conductive performance. The carbon layer on the polymer's surface is enriched via the swelling-shrinking properties of PAA-co-MBA according to the SEM images. Furthermore, in combination with 3D printing technology, PAA-co-MBA can be designed into different shapes to achieve various functions such as pressure-sensing element. Finally, a new type of CPC named carbon clad polymeric laminate (CCPL) is prepared by using the carbon coating method and 3D printing technology. It has the potential to replace copper clad laminate (CCL) and printed circuit board (PCB), to a certain extent. This technology expands the preparation method and application of the CPC such as flexible and wearable conductive fabrics.     

废旧印刷电路板熔池熔炼技术节能降碳分析

分析了废旧印刷电路板主要种类的理化特性,结合顶吹熔池熔炼技术的优势,在控制入炉料热值为8.5~9.5 MJ/kg时,通过增加富氧空气使炉料中的有机质充分燃烧,基本能够实现自热熔炼。经过计算,粗铜能耗为220 kgce/t,与矿铜相比可节约2 520 kgce/t,减少CO2排放6.60 t/t,与再生铜相比节约170 kgce/t,减少CO2排放459 kg/t。废旧印刷电路板熔池熔炼技术示范工程实际生产过程中,维持进料时间在2.5~3.0 h时,除停炉放渣及停炉期间需补加燃料外,正常生产时,超过80%生产时间能够实现自热熔炼。     

Detection of water ingress in composite sandwich structures: a magnetic resonance approach

Water ingress inside honeycomb sandwich panels during service has been linked to in-flight failure in some aircraft. There is an ongoing effort to develop nondestructive testing methods to detect the presence of water within the panels. Magnetic resonance (MR) represents an attractive approach in that it is sensitive to moisture. Using a unilateral MR sensor, testing can be applied directly to the surface of the panel. The viability of MR is demonstrated through laboratory imaging of both water within sandwich panels, as well as the adhesive itself. The detection of water using a one-sided handheld MR sensor is presented. It is shown that simple detection, as well as spatial localization of water within sandwich panels is possible.