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排序方式: 共有234条查询结果,搜索用时 953 毫秒
1.
叶禹康 《固体电子学研究与进展》1994,14(3):272-276
叙述了外内向功率波复数比的测量方法,给出了散射参数测量的交互换位双信号测量线方法。用此方法测量了双栅GaAsMESFET适用散射参数,并用它设计S波段混合集成双栅GaAsMESFET可控增益放大器。测试结果与设计吻合。 相似文献
2.
介绍了用热壁反应炉在50mm SiC半绝缘衬底上制备的SiC MESFET外延材料.其沟道层厚度约为0.35μm,掺杂浓度约为1.7×1017cm-3.沟道和衬底之间的缓冲层为非有意掺杂的弱n型.欧姆接触用的帽层掺杂浓度约1019cm-3.器件制备采用了ICP刻蚀等技术.微波测试结果表明,1mm栅宽功率器件封装后在2GHz下输出功率达到了2W. 相似文献
3.
An improved analytical model for the current-voltage (I-V) characteristics of the 4H-SiC metal semiconductor field effect transistor (MESFET) on a high purity semi-insulating (HPSI) substrate with trapping and thermal effects is presented. The 4H-SiC MESFET structure includes a stack of HPSI substrates and a uniformly doped channel layer. The trapping effects include both the effect of multiple deep-level traps in the substrate and surface traps between the gate to source/drain. The self-heating effects are also incorporated to obtain the accurate and realistic nature of the analytical model. The importance of the proposed model is emphasised through the inclusion of the recent and exact nature of the traps in the 4H-SiC HPSI substrate responsible for substrate compensation. The analytical model is used to exhibit DC I-V characteristics of the device with and without trapping and thermal effects. From the results, the current degradation is observed due to the surface and substrate trapping effects and the negative conductance introduced by the self-heating effect at a high drain voltage. The calculated results are compared with reported experimental and two-dimensional simulations (Silvaco®-TCAD). The proposed model also illustrates the effectiveness of the gate-source distance scaling effect compared to the gate-drain scaling effect in optimizing 4H-SiC MESFET performance. Results demonstrate that the proposed I-V model of 4H-SiC MESFET is suitable for realizing SiC based monolithic circuits (MMICs) on HPSI substrates. 相似文献
4.
SiC MESFET反向截止漏电流的研究 总被引:2,自引:0,他引:2
给出了一种减小SiC MESFET栅漏反向截止漏电流的工艺方法,通过采用LPCVD淀积厚SiO2和高温氧化工艺,使器件的性能得到一定的提升.从实验数据看出,器件在S波段工作时,器件的反向截止漏电流大幅度下降,且分散性得到改善,其功率附加效率和功率增益也分别提高了10%和1.5 dB.该方法充分发挥了SiC材料能形成自身氧化层的优势,结合Si工艺的特点,减小了氧化层的缺陷,并在一定程度上减小了器件的寄生电容. 相似文献
5.
Layers of LPE GaAs have been grown with background carrier levels in the low 1014 cm−3 range by systematic bakeouts of the Ga melts together with between-run loading in a dry N2 environment. High resistivity layers in the range 103-104Ω cm have been grown by making use of the compensation of free carriers by the out diffusion of Cr from the substrate. Intentional
Cr-doping from the melt resulted in layers with poor surface morphologies. Buffered MESFET structures have been grown which
show near ideal carrier concentration profiles and which do not exhibit interfacial space charge effects. 相似文献
6.
M. Kameche 《Journal of Computational Electronics》2007,6(4):421-424
This paper describes the temperature dependence of the drain current and the drain temperature in dual-gate GaAs MESFETs.
The model presented, effectively couples together the effects of the operating temperature and the polarization voltages on
the electron temperature and the drain current. This offers improved accuracy over existing models by considering a nonlinear
field-dependent diffusivity-to-mobility ratio. Two-dimensional numerical simulation is used to describe significant physics
in the characteristics for 0.5 μm gates GaAs DGMESFET. 相似文献
8.
9.
Masayoshi Umeno Takashi Egawa Hiroyasu Ishikawa 《Materials Science in Semiconductor Processing》2001,4(6)
A recessed gate AlGaN/GaN high-electron mobility transistor (HEMT) on sapphire (0 0 0 1), a GaN metal-semiconductor field-effect transistor (MESFET) and an InGaN multiple-quantum well green light-emitting diode (LED) on Si (1 1 1) substrates have been grown by metalorganic chemical vapor deposition. The AlGaN/GaN intermediate layers have been used for the growth of GaN MESFET and LED on Si substrates. A two-dimensional electron gas mobility as high as 9260 cm2/V s with a sheet carrier density of 4.8×1012 cm−2 was measured at 4.6 K for the AlGaN/GaN heterostructure on the sapphire substrate. The recessed gate device on sapphire showed a maximum extrinsic transconductance of 146 mS/mm and a drain–source current of 900 mA/mm for the AlGaN/GaN HEMT with a gate length of 2.1 μm at 25°C. The GaN MESFET on Si showed a maximum extrinsic transconductance of 25 mS/mm and a drain–source current of 169 mA/mm with a complete pinch-off for the 2.5-μm-gate length. The LED on Si exhibited an operating voltage of 18 V, a series resistance of 300 Ω, an optical output power of 10 μW and a peak emission wavelength of 505 nm with a full-width at half-maximum of 33 nm at 20 mA drive current. 相似文献
10.
Ho-Young Cha Y. C. Choi R. M. Thompson V. Kaper J. R. Shealy L. F. Eastman M. G. Spencer 《Journal of Electronic Materials》2004,33(8):908-911
The SiC metal-semiconductor field-effect transistors (MESFETs) have been reported to have current instability and strong dispersion
caused by trapping phenomena at the surface and in the substrate, which degrade direct-current (DC) and radio-frequency (RF)
performance. This paper illustrates the change in electrical characteristics of SiC MESFETs after Si3N4 passivation. Because of a reduction of surface trapping effects, Si3N4 passivation can diminish current collapse under pulsed DC conditions, increasing the RF power performance. The reduction
of surface trapping effects is verified by the change in the ratio of the drain current to the gate current under pinch-off
conditions. 相似文献