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1.
万清  王胜  王成 《电子与封装》2009,9(7):22-25,36
开关电源具有体积小、效率高等一系列优点,在各类电子产品中得到广泛的应用。文章首先从系统的角度,阐述了用内带限流保护的可变频调制工作模式,来实现升压型DC-DC电源转换器的原理。同时给出了一种基于变频模式开关电源变换器的设计过程,最后基于Hspice电路模拟软件对设计进行仿真,并通过CMOS工艺流片验证,该开关变换器电路达到了预期的设计指标。采用这种设计模式的DC-DC变换器具有功耗低、转换效率高的特点,电路工作电压范围为1V-5V,输出电压为1.5V-5V可调,步距为0.1V,可用于一般的电池供电设备,最终实现了一种基于VFM的高效非隔离式直流升压电源的电路设计。  相似文献   
2.
The Virtual Fields Method (VFM) is an inverse technique used for parameter estimation and calibration of constitutive models. Many assumptions and approximations—such as plane stress, incompressible plasticity, and spatial and temporal derivative calculations—are required to use VFM with full‐field deformation data, for example, from Digital Image Correlation (DIC). This work presents a comprehensive discussion of the effects of these assumptions and approximations on parameters identified by VFM for a viscoplastic material model for 304L stainless steel. We generated synthetic data from a Finite‐Element Analysis (FEA) in order to have a reference solution with a known material model and known model parameters, and we investigated four cases in which successively more assumptions and approximations were included in the data. We found that VFM is tolerant to small deviations from the plane stress condition in a small region of the sample, and that the incompressible plasticity assumption can be used to estimate thickness changes with little error. A local polynomial fit to the displacement data was successfully employed to compute the spatial displacement gradients. The choice of temporal derivative approximation (i.e., backwards difference versus central difference) was found to have a significant influence on the computed rate of deformation and on the VFM results for the rate‐dependent model used in this work. Finally, the noise introduced into the displacement data from a stereo‐DIC simulator was found to have negligible influence on the VFM results. Evaluating the effects of assumptions and approximations using synthetic data is a critical first step for verifying and validating VFM for specific applications. The results of this work provide the foundation for confidently using VFM for experimental data.  相似文献   
3.
Polymer dielectrics are widely used in the microelectronics industry for several applications including interlevel dielectrics, encapsulants, and passivating layers. To attain the desired properties, these materials need to be processed via lengthy cure cycles. Variable frequency microwave (VFM) processing has been investigated as a rapid curing alternative for the processing of thin‐film dielectrics. Previous studies on epoxies and polyimide‐based materials have shown significant reduction in cure time and improvement in properties on VFM processing. In this study, VFM curing of Dow Chemical Cyclotene? 3022 benzocyclobutene (BCB) was investigated. The kinetics of the cure reaction were studied by Fourier transform infrared (FTIR) spectroscopy. FTIR studies indicated no significant differences in chemical structure between VFM and thermally cured films. The electrical, optical, mechanical, and chemical properties of VFM‐processed films were characterized and compared with thermally processed films to determine the effectiveness of microwave processing. The results showed that VFM curing of BCB is feasible, and properties comparable to thermally cured films can be attained. The residual stress of partially cured BCB was lower for VFM processing than for traditional thermal processing. The residual stress in fully cured BCB was similar. Improvements such as shorter cure times and lower processing temperatures than conventional thermal processing can be achieved. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 3055–3067, 2002; DOI 10.1002/app.10286  相似文献   
4.
目的 准确表述TC4钛合金的力学性能,对TC4钛合金进行了单轴热拉伸实验,使用虚场法识别和提取不同高温条件下TC4钛合金的弹塑性参数。方法 在不同试验温度(650、700、750℃)下,选用TC4钛合金(Ti-6Al-4V合金),按轧制方向以应变速率为0.1 s-1进行热拉伸试验。采用立体数字图像相关系统(DIC)测量试样的真实应变,得到真实应力-应变曲线,并捕捉热拉伸过程中的随机点,计算出试样的真实应变场。通过虚场法(VFM)在试件的弹性阶段设置不同虚拟位移场,建立虚场方程组以识别不同试验组中的弹性模量和泊松比,利用JC本构模型建立适合试件塑性变形阶段的虚场方程,使用K-Means聚类算法提取模型中的塑性参数。结果 在考虑计算误差的情况下,使用VFM识别出的弹性模量、泊松比与参考数值的加权相对误差分别在4.8%、6.4%以下;提取出的塑性参数可以用于建立JC本构模型,弹塑性参数的识别和提取均符合预期。结论 使用VFM可以有效识别出TC4在不同高温条件下的弹性参数,K-Means聚类算法在提取塑性参数方面的效果较为显著。  相似文献   
5.
PFI的科学内涵及经济效果   总被引:4,自引:0,他引:4  
在充分研究英、日等发达国家PFI理论成果的基础上,分析PFI的科学内涵问题,界定PFI与传统公共项目开发、项目融资和BOT等相关概念之间的联系与区别,探讨PFI的VFM和早期供应这两种微观经济效果及其计算方法,以期为PFI理论研究和政府决策提供指导和借鉴.  相似文献   
6.
何一慧  熊华平 《人民长江》2019,50(6):161-165
针对我国现有城市水生态PPP项目VFM定性评价方法下权重设置难以突出各项目因素层影响、评价结果模糊性和不确定性较大的问题,根据我国城市水生态PPP项目的特点,构建了适用于城市水生态PPP项目VFM定性评价的指标体系;提出了基于OWA-灰色聚类的城市水生态PPP项目定性评价方法,即利用OWA算子对指标进行赋权,并结合VFM灰色聚类评价模型进行评价。以湖北省某市污水处理项目为例进行实证研究,结果与实际情况相符,验证了该评价方法的有效性。研究结果可为城市水生态PPP项目的VFM定性评价提供参考。  相似文献   
7.
Microwave processing of materials is a relatively new technology advancement alternative that provides new approaches for enhancing material properties as well as economic advantages through energy savings and accelerated product development. This paper presents a state-of-the-art review of microwave technologies, processing methods and industrial applications. The characteristics of microwave interactions with materials are outlined together with the challenges that are difficult to process the materials present. To fully realise the potential benefits of microwave and hybrid processes, it is essential to scale-up process and system designs to large batch or continuous processes. This necessitates computational modelling and simulation, system design and integration and a critical assessment of the costs and benefit analysis. Impediments to industrial applications are identified and development opportunities that take advantage of unique performance characteristics of microwaves are discussed. Clearly, advantages in utilising microwave technologies for processing materials include penetrating radiation, controlled electric field distribution and selective and volumetric heating.

The aim of the work presented in this paper is to help guide those interested in using microwaves to improve current materials processing. Microwave fundamentals are described to provide a brief awareness of the advantages and limitations of microwaves in the processing of materials. Furthermore, the limitations in current understanding are included as a guide for potential users and for future research and development activities. Examples of successful applications are given to illustrate the characteristics of materials, equipment and processing methods applicable to industrial microwaves. Economic considerations are described and costs are provided as guidelines in determining the viability of using microwaves for processing materials.  相似文献   

8.
为解决监控视频分辨率不足的问题,在视频流体模型的基础上,提出一种图像超分辨率重建方法。视频流体模型记录了视频对象的整体区域,及区域内各像素的时域对应关系,利用流体区域在不同时刻的像素值进行滤波和拼接,达到去噪、扩展分辨率的目的,基于等色线构建视频流体模型,使用视频流体模型实现去噪,以起始帧作为参考图像,并依次在各帧中选择补入流纹,根据补入流纹的相邻流纹计算补入流纹在初始帧的位置,如果所得位置非整数,对参考图像插值拉伸,采用补入流纹中的值代替相关坐标的像素值。实验结果表明,将添加噪声的CIF格式视频重建到2CIF格式,该方法的重建结果比最大后验估计与投影方法、梯度投影等方法的峰值信噪比提高1 dB~4 dB。  相似文献   
9.
The global variable-fidelity modelling (GVFM) method presented in this article extends the original variable-complexity modelling (VCM) algorithm that uses a low-fidelity and scaling function to approximate a high-fidelity function for efficiently solving design-optimization problems. GVFM uses the design of experiments to sample values of high- and low-fidelity functions to explore global design space and to initialize a scaling function using the radial basis function (RBF) network. This approach makes it possible to remove high-fidelity-gradient evaluation from the process, which makes GVFM more efficient than VCM for high-dimensional design problems. The proposed algorithm converges with 65% fewer high-fidelity function calls for a one-dimensional problem than VCM and approximately 80% fewer for a two-dimensional numerical problem. The GVFM method is applied for the design optimization of transonic and subsonic aerofoils. Both aerofoil design problems show design improvement with a reasonable number of high- and low-fidelity function evaluations.  相似文献   
10.
A novel lead-free interconnect technique using variable frequency microwave (VFM) was investigated. The lead-free solder interconnection between the component chips and the metal pads through VFM was first demonstrated. Comparison between the microstructures of the lead-free solder joints on Cu and Sn surfaces formed by a conventional thermal reflow process and VFM was conducted. The VFM heating technique successfully created the lead-free solder/Cu and Sn joints through their intermetallic compounds (IMCs), while maintaining the substrate temperature as low as 210°C.  相似文献   
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