一种用于热阴极的高可靠热子

微波真空电子器件广泛应用于雷达、卫星通信、电子加速器等方面,热子又是微波真空电子器件中最为核心的部件之一,其性能好坏将直接影响微波源的可靠性和寿命。为了克服传统热子制备工艺的缺点,避免螺旋腿部分的钨或钨合金丝出现损伤,提供一种高可靠热子制备方法,采用高温焊料焊接技术将螺旋丝与插腿焊接在一起,从而制备出具有螺旋腿与插腿之间接触电阻小、耐震动性能好、抗热冲击性能好和可靠性高等优点的热阴极用热子。采用新方法制备的热子在1100℃高温下寿命已超过3000 h,没有出现断路现象,目前在各种微波管上使用了新方法制备的热子,没有出现一只断路。     

Comparison of in-situ measurement techniques of solder joint reliability under thermo-mechanical stresses

Thermo Mechanical Cycle Lifetime (TMCL) test is a widely used test methodology for evaluating the reliability of solder joints in the microelectronics industry. The commonly used measurement techniques to monitor solder joint failures during the TMCL test are either event detector or data logger. In this study, TMCL test has been carried out on the same devices in parallel with both measurement techniques. The pros and cons of both techniques are compared. It is observed that the solder joint reliability results on the investigated samples by both techniques are comparable. The event detector can catch short intermittent events, while the data logger is able to capture the details of the solder joint degradation process. In applications for which performance is dependent on the transmission of signals with a frequency of several hundred megahertz or more, the event detector technique shall be used. In such cases the data logger technique may overestimate product lifetime. On the other hand, for some applications where the performance is less susceptible to intermittent solder joint interconnect interruption but more to the increase of the solder joint resistance, the data logger shall be used. In such cases the event detector technique may underestimate product lifetime. In conclusion depending on the end application of the device, the most suitable technique can be selected.     

分级分段印制插头工艺的研发与应用

介绍了一种采用特殊的设计方法制作分级分段印制插头的工艺生产的印制插头完全没有引线残留的踪迹,对分级分段印制插头的品质做到了有效的控制,可靠性实达到品质要求,通过了实际生产应用的验证,建立了工艺规范和品质管制计划,为批量生产奠定了坚实基础。     

基于GhostNet-YOLOv4算法的印刷电路板缺陷检测

针对印刷电路板表面面积小而且上面电子器件焊点众多,传统检测方法很难进行有效检测的问题,提出了一种基于GhostNet-YOLOv4的印刷电路板表面焊点检测算法。首先,修改了YOLOv4算法的主干网络以增强特征提取能力,其次加入注意力机制使网络更注重缺陷特征,用GhostNet代替CSPDarknet53作为主干网络。此算法相比于传统的印刷电路板检测算法提高了检测精度和检测速度,可以实现对印刷电路板表面常见的断路、漏焊、短路等缺陷的精确检测和迅速分类。通过对印刷电路板数据集的检测结果分析表明,该改进算法具有较好的实用性,在测试集上的平均精度为86.68%,FPS达到了25.43,可以满足印刷电路板实际检测需求。     

Enhanced solder joint bonding strength of electronic packaging with electrowetting effect

This paper reports a novel method to enhance solder ball or solder ring bonding strength by using electrowetting-on-dielectric (EWOD) effect. With a low melting point, the metal Sn has been widely used in electronic packaging technology. Since Sn will be molten into liquid when the temperature is increased above the melting point, the method for treating liquid can be herein employed. Contact angle of the molten Pb-free balls or ring structure on silicon substrate have been experimentally changed by applying electric field across the thin dielectric film between the molten solder and the conductive silicon substrate. The contact area between the solder and the substrate is enlarged due to the decrease of the contact angle. Our testing results on the EWOD enhanced packaging structures of solder balls, flip-chip and solder ring hermetic package generally show about 50% enhancement in bonding shear strength. The significantly enhanced solder link bonding strength is hopeful for improving packaging reliability and is promising to be used in high performance silicon based electronic or microelectromechanic SiP (system in package) technologies.     

阻焊前塞孔工艺的应用

为了提高小孔径过孔的稳定性,现在越来越多的产品需要进行塞孔。本着提高生产效率,降低成本的方针,从油墨特性、工艺流程、生产控制几方面,对阻焊前塞孔工艺的制定进行了实验和总结。主要的研究方向:(1)不同阻焊前塞孔流程的比较;(2)塞孔印刷的堵孔板分析;(3)堵孔板塞孔和网绢塞孔的对比;(4)阻焊弹油影响因素的实验;(5)阻焊前塞孔产品后烤参数实验。阻焊前塞孔工艺不仅提高了产品通过的效率、节省了成本。并且由于减少了砂带磨铜,减少了产品的受力变形,避免了外层、阻焊、铣床等环节,因产品尺寸涨缩导致的质量问题。     

银浆中的玻璃粉对晶硅太阳电池串联电阻的影响

研究了丝网印刷银电极中玻璃粉对晶体硅太阳能电池的串联电阻的影响。通过制备不同含量的玻璃粉银浆料,以及对浆料的体电阻率、接触电阻和焊接拉力等性能的表征测试,发现银粉颗粒间隙是造成银电极体电阻增大的主要因素,在一定范围内,用PbO-SiO2系玻璃粉有助于降低银电极体电阻和接触电阻,增加焊接拉力。     

Notch effect on creep–fatigue life for Sn–3.5Ag solder

This paper studies the creep–fatigue crack initiation and failure lives of Sn–3.5Ag solder notched specimens focused on the multiaxial strain at the notch root. Push–pull creep–fatigue tests were performed using three circumferential notched specimens using four kinds of creep–fatigue strain waveforms. Multiaxial strains at the notched section were calculated by finite element (FE) analysis under four kinds of creep–fatigue loading. Creep–fatigue damage laws were applied for evaluating the crack initiation and failure lives using the multiaxial strains obtained by the FE analysis. von Mises equivalent strain at the notch root estimated the crack initiation lives with a large scatter as well as the failure lives. Instead, the mean value of von Mises equivalent strain over the cross section of the notch root estimated the crack initiation and failure lives with a small scatter.     

Electrodeposition of eutectic Sn96.5Ag3.5 films from iodide–pyrophosphate solution

Electrodeposition of SnAg alloy films and the effect of additives like PEG-600 and hydrazine hydrochloride on the same were studied in KI–K₄P₂O₇ solutions. PEG-600 was found to adsorb on the electrode surface, resulting in strong reduction inhibition of tin pyrophosphate complex ions, but it does not affect the reduction of silver iodide complex. It was found that hydrazine hydrochloride acted as a reducing agent for Sn⁴⁺ species and greatly improved surface morphology and roughness of the films by preventing the formation of Sn dendrites during electrodeposition. Eutectic Sn_96.5Ag_3.5 was obtained from a plating solution that contained both PEG-600 and hydrazine hydrochloride as additives, at the deposition current density of 40 mA cm⁻². Stress measurements of the SnAg films showed that it was tensile. X-ray analysis of the deposit showed the presence of β-Sn and ?-Ag₃Sn phases in the eutectic SnAg film. The DSC profile of SnAg film gave the melting point as 222 °C.     

PCB焊点焊接缺陷原因分析

PCB焊点焊接缺陷产生的原因可能很多,如果你从扩散焊接的特点考虑就会变得明了起来！熔化的焊料原子沿着被焊接金属的结晶晶界的扩散,扩散所需要的激活能也可称为“表面自由能”比体扩散小。一般锡料的活性能约为380达因/厘米,鲜活的铜面在助焊剂的辅助下约为1265达因/厘米,所以焊接可以良好进行。