Improved corrosion protection of aluminum alloys by electrodeposited silanes

Organofunctional silanes recently have emerged as outstanding, environmentally friendly corrosion protectors for metal substrates, compared with conventional chromate treatments. A simple immersion technique is typically used to coat the metal surface with silane films. However, the thickness and uniformity of the films are uncontrolled in this process. This paper proposes a new deposition technique for the silane films on the metal surface, i.e., by electrodeposition. Hydrolyzed silanes are water-soluble, ionized molecules, so they can be deposited on metals by electrodeposition. Various combinations of silane mixtures were tested at different voltages, pH values, bath concentrations, and exposure times on panels of alloy aluminum and mirror-polished ferro-plate. The surface structure was characterized by scanning electron microscopy (SEM) and ellipsometry. The resistance of the film to corrosion was investigated by direct current (DC) polarization and electrochemical impedance spectroscopy (EIS) techniques. Electrodeposition results in a more organized and uniform film with fewer pores, compared with immersed or dipped films. This paper was presented at the 2nd International Surface Engineering Congress sponsored by ASM International, on September 15–17, 2003, in Indianapolis, Indiana, and appears on pp. 320–26 of the Proceedings.     

碱性电镀光亮锌镍合金研究

研究了镀液的组成与镀层中镍含量、镀层的相结构以及阴极电流效率的关系。提出了碱性电镀光亮锌镍合金的最佳镀液组成和工艺规范,并对茴香醛、四乙烯五胺和ZN—A5添加剂的吸附行为及其对锌镍电沉积过程的阻化作用进行了探讨。     

Nickel Electroplating

NICKEL ELECTROPLATING has been practicallyused for decades.There is an unknown part in theplating,although this is easy to plate.Applications ofthe plating are described from the practical viewpoint.Purpose of Nickel Electroplating(1)Decorative,and corrosion resistanceNickel electroplating is deposited on iron,cupper,zinc and aluminum substrate etc.,and chromiumplating is usually deposited on nickel plating.Hexavalent chromium plating has an important effecton the corrosion resisitan…     

ITO和ZnO基底对电化学沉积氧化亚铜薄膜的形貌、结构的影响及作用机制

采用电化学恒电位沉积方法在ITO导电玻璃上和在ZnO薄膜上沉积氧化亚铜（Cu2O），并通过X射线衍射（XRD）和扫描电镜（SEM）对晶体的微观结构和表面形貌进行了分析．在ZnO基底上沉积得到了纳米级的Cu2O粒子并且具有明显择优取向，而在ITO导电玻璃上仅得到粒径为2—5胛的Cu2O粒子，没有明显的择优取向，对薄膜的生长机理进行了讨论．     

Initial stages of tin electrodeposition from sulfate baths in the presence of gluconate

Tin electrodeposition in its initial stages in acid sulfate/gluconate baths was studied with varying tin and gluconate concentrations using potential-controlled electrochemical techniques. The deposit morphology was observed by scanning electron microscopy (SEM). A comparison with tin electrodeposition from acid sulfate baths in the absence of gluconate was also carried out. Use of a highly acidic bath leads to nonuniform deposits, even in the presence of gluconate; at pH 4 deposits are uniform, brilliant and suitable for finishing applications. Tin crystallites have a well defined morphology which depends on bath agitation conditions. In the absence of agitation, the crystallites have the same tetragonal shape as in a sulfate bath without gluconate.     

Magneto-sensitive nickel nanowires fabricated by electrodeposition into multi- and single-ion track templates

Polycarbonate templates of (30±1) μm thickness containing cylindrical etched-track nanochannels of (500±50) nm diameter were used for electrodeposition of Ni nanowires. Using 10⁴ channels per cm², the most favourable deposition potential of  − 1.0 V was determined in a potentiostatic mode by varying the deposition potential with respect to an Ag/AgCl reference electrode over a range between  − 0.1 V and  − 1.5 V. The deposition efficiency at  − 1.0 V was estimated around 10%. The resulting single wires had a resistance around 200 Ω and showed an anisotropic magnetoresistance (AMR) effect of 1%, applicable to directionally sensitive magnetic field sensors.     

Electrodeposition of catalytically active nickel for the oxygen evolution reaction — effects of anionic composition

Nickel electrodes were prepared by electrodeposition in electrolytes of various anionic compositions. The deposition conditions and bath types were evaluated with special emphasis on the electrocatalytic properties for the oxygen evolution reaction (OER). Electrochemical characterizations in a 5 mol/L KOH solution at 25°C showed that the electrode deposited from the chloride bath, having a low Tafel slope of 50 mV/dec and an overpotential of 396 mV at 100 mA/cm², is the most catalytically active among electrodes prepared in electrolytes of various anionic compositions. The electrode activity for the OER is related to the real surface areas, which depend on the anion compositions in the deposition bath and the deposition conditions.     

Electrodeposition, composition and structure of Zn—Cr alloys

The effect of polyethylene glycol (PEG 1500) as additive and of deposition conditions on Zn—Cr alloy electrodeposition from an acidic sulfate electrolyte at room temperature, without agitation was investigated. PEG polarizes the overall cathodic reaction and inhibits Zn deposition. Cr codeposition with Zn starts at a cathodic potential of about –1,95 V vs Hg/Hg₂SO₄, which is reached at current density of about 20 A dm^–2 in galvanostatic conditions. Zn—Cr alloy coatings containing up to 28 at % Cr were obtained depending on the plating conditions. SEM observations showed an island-like structure, formed by the local growth of crystals, which covered the surface during further deposition. In the first stages of electrodeposition the powder diffraction spectra contain lines of b.c.c. -(Zn,Cr) phase (a 3.02 Å). After 30 s deposition time weak lines of Zn-based phase (a 2.67 Å, c 4.90 Å) appear, and become clearly visible in coatings deposited for 90 s. The average Cr content in the alloy coatings decreases with advancing deposition. The as-plated surface contains C in organic compounds and Zn(OH)₂. After 50 min sputtering, Zn and a mixture of Cr, Cr₂O₃ and Cr₇C₃ were found. The presence of organic C and O, probably from inclusions of PEG, were also detected.     

电沉积触媒的制备及其合成金刚石的研究

用电沉积的方法以Ni70Mn25Co5为基材制备了合成金刚石的触媒，选择适当的合成条件，在国产六面顶压机上用此电沉积触媒合成出颜色和晶型都较好的金刚石，为纯铁片做为基材制备电沉积触媒，降低合成金刚石触媒生产成本奠定了一定基础。     

Electrochemical investigations of copper behaviour in different cupric complex solutions: Voltammetric study

The electrochemical behaviour of copper has been investigated in different cupric complex solutions by cyclic voltammetry. In pyridinic and picolinic solutions the reduction of cupric complex occurred in two stages leading to Cu(I) and Cu(0), respectively. The electrodeposited copper is oxidized in two steps leading to Cu(I) and Cu(II) as in ammoniacal cupric complex solutions. In glycine, alanine, sulfamic acid and ethylenediamine solutions, the cuprous complex is an intermediate in the cupric complex reduction but it is not detected during the oxidation of the electrodeposited copper in these solutions. In EDTA and triethanolamine solutions, the cuprous complex is not observed. The rate of copper etching was determined in pyridinic and ammoniacal cupric solutions and was shown to be faster in ammoniacal cupric solutions than in the pyridinic solutions.