| 埋容电路用高介电常数热塑性聚酰亚胺的性能研究 |
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| 引用本文： | 张翔宇,茹敬宏,梁立,孙宝磊,戴周.埋容电路用高介电常数热塑性聚酰亚胺的性能研究[J].覆铜板资讯,2011(1). |
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| 作者姓名： | 张翔宇 茹敬宏 梁立 孙宝磊 戴周 |
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| 作者单位： | 广东生益科技股份有限公司; |
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| 摘 要： | 通过填料预分散法和原位聚合法合成了一种BaTiO3填充的热塑性聚酰亚胺树脂。考察不同填充量的填料对热塑性聚酰亚胺的力学性能,热性能和电性能的影响。结果发现:随着BaTiO3添加量的增大,TPI的介电常数和介电损耗都增大,力学性能急剧下降,尤其是柔韧性急剧降低;玻璃化转变温度不变,热分解温度相应增加,热膨胀系数减小,吸潮率降低,TPI与铜箔之间的粘接力减少。
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| 关 键 词： | 热塑性聚酰亚胺 钛酸钡 BaTiO3 |
Research of the thermoplastic polyimide/BaTiO_3 composite use in buried capacitor circuits |
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| Abstract: | A series of thermoplastic polyimide/BaTiO3 composite was synthesised by in-situ polymerization. The effect of BaTiO3 loading on the mechanical, thermal and electronic properties of thermoplastic polyimide(TPI) were researched. The results showed that: with the increased loading of BaTiO3,the dielectric constant(Dk) and the dissipation fator(Df) increased; the Td,CTE,water effecient and the adhesion between TPI and the copper foil decreased, Tg keep a constant. |
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| Keywords: | thermoplastic polyimide barium titanate BaTiO3 |
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