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| Sn-Zn无铅钎料合金化改性研究 | |
| 引用本文： | 吴松,康慧,曲平. Sn-Zn无铅钎料合金化改性研究[J]. 电子工艺技术, 2008, 29(2): 66-70 |
| 作者姓名： | 吴松 康慧 曲平 |
| 作者单位： | 北京航空航天大学,北京,100083;北京航空航天大学,北京,100083;北京航空航天大学,北京,100083 |
| 摘 要： | 各国立法限制或禁止Pb的使用极大地促进了无铅钎料的研究和应用.Sn-zn钎料作为一种很有潜力的钎料,引起了研究人员的广泛兴趣,成为了无铅钎料的研究热点.加入合金元素能显著改善Sn-Zn钎料的性能.本文阐述了加入Ag、Cu、Zn、Bi、Re、Al等金属对Sn-Zn钎料的熔点、润湿性、力学性能、抗氧化腐蚀以及接头的金属间化合物(IMC)方面的影响.最后简单阐述了Sn-zn钎料的应用现状和未来的改进方向. |
| 关 键 词： | 无铅钎料 Sn-Zn 合金化 应用 |
| 文章编号： | 1001-3474(2008)02-0066-05 |
| 修稿时间： | 2008-01-11 |
Study of Sn-Zn Lead-free Solder by Alloying |
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| WU Song,KANG Hui,QU Ping. Study of Sn-Zn Lead-free Solder by Alloying[J]. Electronics Process Technology, 2008, 29(2): 66-70 | |
| Authors: | WU Song KANG Hui QU Ping |
| Affiliation: | WU Song,KANG Hui,QU Ping(Beijing University of Aeronautics , Astronautics,Beijing 100083,China) |
| Abstract: | Study and application of Lead-free Solder is accelerating because of the restriction and prohibition of lead-containing solders by legislation.Sn-Zn has gained much attention from researcher.It is considered as a much potential Lead-free Solder and become more and more hot.Alloy elements were added to Sn-Zn Lead-free Solder for better the properties.The effect of different alloy elements added to Sn-Zn based lead-free solders on the solder ability of the solders,melting point,mechanics properties of soldere... |
| Keywords: | Sn-Zn |
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