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基于单片机加压控制的PCD复合片真空扩散焊接
引用本文:万天军,徐爱钧,杨雄.基于单片机加压控制的PCD复合片真空扩散焊接[J].石油仪器,2006,20(6):27-29.
作者姓名:万天军  徐爱钧  杨雄
作者单位:1. 长江大学电信学院,湖北,荆州
2. 长江大学机械学院,湖北,荆州
摘    要:文章针对普通钎焊的聚晶金刚石钻头剪切强度不高,提出了采用单片机加压控制的PCD复合片真空扩散焊接的设计思想,在对原真空扩散焊机液压改造的基础上给出如何由单片机控制加压的电路和程序流程设计。实际应用表明,该技术经济实用,有较好的经济效益。

关 键 词:真空扩散焊接  液压系统  单片机  加压控制
文章编号:1004-9134(2006)06-0027-03
收稿时间:2006-07-03
修稿时间:2006-07-03

Vacuum diffusion bonding of PCD compound piece base on microcontroller pressure
Wan Tianjun,Xu Aijun and Yang Xiong..Vacuum diffusion bonding of PCD compound piece base on microcontroller pressure[J].Petroleum Instruments,2006,20(6):27-29.
Authors:Wan Tianjun  Xu Aijun and Yang Xiong
Abstract:As shear strength of polycrystalline diamond compact bit ,which is made of ordinary braze welding, is not high, a new kind of design thought of using microcontroller to pressurize and control the PCD compound piece in vacuum diffusion bonding is proposed. On the basis of transformation hydraumatic system of original vacuum proliferation welding machine, pressurized circuit controls by microcontroller and program process is designed. The practical application indicates that this technique is economical and practical and yield good economic returns.
Keywords:vacuum diffusion bonding  hydraumatic system  microcontroller  pressurized control
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