| 陶瓷基板表面金属化研究现状与发展趋势 |
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| 引用本文： | 秦典成,李保忠,肖永龙,张军杰.陶瓷基板表面金属化研究现状与发展趋势[J].材料导报,2017,31(Z2):277-281. |
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| 作者姓名： | 秦典成 李保忠 肖永龙 张军杰 |
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| 作者单位： | 乐健科技珠海有限公司,广东省LED封装散热基板工程技术研究中心,珠海 519180,乐健科技珠海有限公司,广东省LED封装散热基板工程技术研究中心,珠海 519180,乐健科技珠海有限公司,广东省LED封装散热基板工程技术研究中心,珠海 519180,乐健科技珠海有限公司,广东省LED封装散热基板工程技术研究中心,珠海 519180 |
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| 基金项目： | 秦典成:男,1985年生,硕士研究生,研究方向为LED散热管理 E-mail:mike_qin@rayben.com |
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| 摘 要： | 散热基板是大功率电子元器件散热的重要通道,其导热性能将直接影响功率型电子元器件的可靠性与使用寿命。详细介绍了陶瓷作为高导热的散热基板材料,其表面金属化的技术方案及发展现状,同时指出了各种金属化方案的关键技术难点,对比分析了各类陶瓷封装散热基板的特点与性能差异,并在此基础上对陶瓷基板的发展趋势进行预测。
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| 关 键 词： | 散热基板 封装 高导热 金属化 |
Research Situation and Development Trend of Ceramic Metallization |
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| QIN Diancheng,LI Baozhong,XIAO Yonglong and ZHANG Junjie.Research Situation and Development Trend of Ceramic Metallization[J].Materials Review,2017,31(Z2):277-281. |
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| Authors: | QIN Diancheng LI Baozhong XIAO Yonglong and ZHANG Junjie |
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| Affiliation: | Rayben Technologies Zhuhai Limited, Guangdong LED Package-used Thermal Substrate Engineering Technology Research Center, Zhuhai 519180,Rayben Technologies Zhuhai Limited, Guangdong LED Package-used Thermal Substrate Engineering Technology Research Center, Zhuhai 519180,Rayben Technologies Zhuhai Limited, Guangdong LED Package-used Thermal Substrate Engineering Technology Research Center, Zhuhai 519180 and Rayben Technologies Zhuhai Limited, Guangdong LED Package-used Thermal Substrate Engineering Technology Research Center, Zhuhai 519180 |
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| Abstract: | Substrates, the thermal conductivity of which would directly impact on reliability and service life of powerful electronic components, Act as an important thermal path for their Packaging. In this paper, it has been introduced the techniques and current development of surface metallization of ceramic with high thermal conductivity and the key technical difficulties of each techniques. There is an introduction of distinguishing features of five different kinds of ceramic substrates and also a performance comparison among them. In the end, the developing trend of ceramic substrates has also been predicted in this paper. |
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| Keywords: | thermal substrates packaging high thermal conductivity metallization |
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