| 选择性焊接工艺技术的研究 |
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| 引用本文： | 鲜飞.选择性焊接工艺技术的研究[J].电子测试,2008(9). |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,武汉,430074 |
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| 摘 要： | 选择性焊接是现代组装技术的新概念,它的出现促进了SMT(表面贴装技术)的发展,并为PWB设计者提供了新的工艺选择。本文介绍了选择性焊接的概念、特点、分类和使用工艺要点。与传统波峰焊情况不同.选择性焊接可以保护表面贴装元件来实现对通孔元件焊接,大幅度降低生产工序和周期时间,印刷线路板的焊接质量也被提升。选择焊接工艺允许充分有效利用SMT贴装设备,消除对点胶机的使用。可以确信选择性焊接将会被更多地应用于电子组装上,成为一种具有竞争力的焊接技术。
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| 关 键 词： | 选择性焊接 印刷线路板 波峰焊 |
Research of selective soldering |
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| Xian Fei.Research of selective soldering[J].Electronic Test,2008(9). |
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| Authors: | Xian Fei |
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| Abstract: | Selective soldering is a new concept of the contemporary assembly technology.It is said that selective soldering has developed and innovated SMT since it was appeared and also provides a new choice for PWB designer.The things of selective soldering's concept,character- istics,division and technical gist are described in this paper.It allowed through-hole compo- nents to be soldered,and protected the SMT components from the wave,unlike in the case of wave soldering.Cycle time and labor content were greatly r... |
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| Keywords: | selective soldering PWB wave soldering |
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