不同前处理工艺对阻焊桥的影响

随着线路板布线密度的提高,阻焊桥宽度的逐渐减小,阻焊前处理日益显示其重要的地位,线路板表面的前处理效果直接影响着阻焊的良品率。本文通过扫描电镜、金相显微镜和3M胶带拉力测试等分析方法,分别对针刷＋不织布磨板、火山灰磨板,以及喷砂等几种前处理方式对阻焊桥板的效果进行了分析,并分别从无铅喷锡、化学沉镍金、化学沉锡等表面处理效果角度分析阻焊层受攻击程度,最终确定阻焊桥板制作的最佳前处理方式。

The impact of pre-treatment in solder mask bridge of PCB production

As the circuit layout density becomes higher and higher and the width of the solder mask bridges starts to shorten,the solder mask pre-treatment is showing its critical position in the PCB manufacturing.The pre-treatment quality will determine the solder mask quality directly.The paper analyses the influence of the different pre-treatments（pin brush＋ nonwoven scrubbing,pumice scrubbing,sand blasting,etc） on the solder mask bridge boards with the help of SEM,metallographic microscope and 3M tape tension test.And in terms of the different pre-treatments,like the lead-free HASL,immersion Ni-Au,and immersion Sn,the paper studies the influence grade of the solder mask layer,and it finally determines the optimum pre-treatment method of the manufacturing of the solder mask bridge boards.