选择性波峰焊应对线路板组装新挑战

分析了手工焊、波峰焊、通孔回流焊在高密度线路板组件中通孔插装元器件焊接上的优缺点，介绍了选择性波峰焊的概念、特点、分类和使用工艺要点，指出选择焊是应对PCB焊接新挑战的最佳方法。与传统波峰焊情况不同，选择性波峰焊可以保护表面贴装元件来实现对通孔元件焊接，大幅度降低生产工序和周期时间，印刷线路板的焊接质量也被提升。选择型波峰焊工艺允许充分有效利用SMT贴装设备，消除对点胶机的使用。可以确信选择性波峰焊将会被更多地应用于电子组装上，成为一种具有竞争力的焊接技术。

Selective Soldering Replies the New Challenge of PCB Assembly

This article analyzed advantage and disadvantage of hand soldering, wave soldering, through- hole reflow applied on through-hole components soldered in high density PCB assembly. It introduced the selective soldering concept, characteristics, division and technical points. It was indicated that selective soldering was the best way to reply to the new challenge of PCB assembly. It allowed through-hole components to be soldered, and protected the SMT components from the wave, unlike the traditional wave soldering. Cycle time and labor content were greatly reduced by selective soldering. Soldering quality of the PCB was also improved. The soldering procedure allowed for efficient use of the SMT placement equipment and eliminated the use of adhesive application machines. It was believed that selective soldering will be more adopted in electronics assembly, and will also be a competitive soldering technology.