内置微通道T/R组件壳体设计及试验研究

为了降低界面热阻对微通道散热性能的制约，提出了一种组件壳体内置微通道散热单元的设计架构，以满足新一代高功率芯片T/R组件的热控需求。对内置微通道的传热特性进行数值仿真分析，优选出最佳结构参数组合。基于优选设计参数，整合UV-LIGA微细加工技术、精密扩散焊接技术及微组装技术，完成内置微通道散热单元T/R组件的模拟样件研制。开发微通道换热器性能测试系统，对模拟样件散热效果进行试验验证。结果表明，内置微通道散热单元T/R组件的热流密度达到274.2 W/cm²，可保障高功率芯片工作在允许的温度范围内。该设计方式值得在局部热流密度过高的电子器件热设计中推广应用。

Design and Test of T/R Module Shell with Built-in Micro-channels

This paper presents a design of T/R module shell with built-in micro-channels to reduce the restriction of interface thermal resistance on the heat dissipation performance of micro-channels. Through this research, the goal of heat dissipation performance of the new generation high-power chips is achieved. The heat transfer characteristics of the built-in micro-channels are analyzed by numerical simulation, and the best combination of design parameters is optimized. The T/R module samples with built-in micro-channels are prepared by UV-LIGA, diffusion welding and micro-assembly technologies. The performance testing system for the micro-channel heat exchanger is developed to verify the heat dissipation effect of the samples. The results show that the heat flux of the T/R module with built-in micro-channels reaches 274.2 W/cm², which can keep the high power chips to work under the allowable temperature. This thermal design method can be widely used in the electronic device with high heat flux in local area.