高精度超薄水晶片表面超声磨削机理的研究

高精度超薄水晶片的加工效率、表面损伤及翘曲变形等问题，一直是从事该方面研究和生产的难题之一。本文利用超声加工宏观磨削力、磨削应力、磨削热小，对加工材料表面损伤低的特点，再结合相关磨料对高精度超薄水晶片表面进行超声磨削加工。在工作机理研究的基础上，对超薄水晶片超声磨削进行了实验研究，优化了其工作参数，获得了满意的效果，为该技术的实际应用奠定了理论与实验基础。

Research on Mechanism of High-accuracy Ultrasonic Grinding for Ultrathin Crystal Chips

Some problems in ultrathin crystal chips grinding, such as processing efficiency, surface damage, warping deformation, always torment the researchers and workers. This paper takes use of the features of ultrasonic grinding which can make the macroscopic force, stress and calory in grinding lower, and then utilizes relevant abrasive in the ultrasonic grinding. On the basis of studying the working mechanism, we carried out the experiment to research the ultrasonic grinding for ultra thin crystal chips, then optimized its working parameters, and obtained satisfied result, established the theory and experiment foundation for the practical application of this technology.