| RFID芯片超声倒装封装技术研究 |
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| 引用本文： | 张加波,安兵,孙亚男,蒋青青,吴懿平.RFID芯片超声倒装封装技术研究[J].电子工艺技术,2011,32(6):326-329. |
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| 作者姓名： | 张加波 安兵 孙亚男 蒋青青 吴懿平 |
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| 作者单位： | 武汉光电国家实验室,湖北武汉,430074 |
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| 基金项目： | 国家自然科学基金项目(项目编号:60876070,60976076) |
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| 摘 要： | 超声倒装是近年来芯片封装领域中快速发展的一种倒装技术,具有连接强度高、接触电阻低、可靠性高、低温下短时完成和成本低的优势,特别适合较少凸点的RFID芯片封装。在镀Ni/Au铜基板上进行了RFID芯片超声倒装焊接实验,金凸点与镀Ni/Au铜基板之间实现了冶金结合,获得了良好的力学与电气性能,满足射频要求。
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| 关 键 词： | 射频识别 芯片封装 超声倒装 冶金结合 |
RFID Die Packaging by Ultrasonic Flip-chip Technology |
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| ZHANG Jia-bo,AN Bing,SUN Ya-nan,JIANG Qing-qing,WU Yi-ping.RFID Die Packaging by Ultrasonic Flip-chip Technology[J].Electronics Process Technology,2011,32(6):326-329. |
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| Authors: | ZHANG Jia-bo AN Bing SUN Ya-nan JIANG Qing-qing WU Yi-ping |
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| Affiliation: | ZHANG Jia-bo1,2,AN Bing1,SUN Ya-nan1,JIANG Qing-qing1,WU Yi-ping1,2(1.Wuhan National Laboratory for Optoelectronics,Wuhan 430074,China 2.Huazhong University of Science and Technology,China) |
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| Abstract: | Ultrasonic flip chip packaging is a rapidly developing technology for die bonding in the recent years.It has the advantages of high bonding strength,low contact resistance,high reliability,low cost,low-temperature and short-time process,and is especially suitable to the RFID die packaging with small bumps.The RFID die is bonded on the nickel-gold-plated copper substrate by the ultrasonic flip-chip welding.The metallurgical bonding is achieved between the gold bumps and the nickel-gold substrate,which offer ... |
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| Keywords: | Radio Frequency Identification Die bonding Ultrasonic flip-chip Metallurgical bonding |
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