| 甲基磺酸电镀锡工艺的研究 |
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| 引用本文： | 胡立新,程骄,占稳,夏浩,欧阳贵.甲基磺酸电镀锡工艺的研究[J].电镀与环保,2009,29(6):29-32. |
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| 作者姓名： | 胡立新 程骄 占稳 夏浩 欧阳贵 |
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| 作者单位： | 1. 湖北工业大学化学与环境工程学院,湖北武汉,430068
2. 武汉材料保护所,湖北武汉,430030 |
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| 摘 要： | 研究了一种新的甲基磺酸盐电镀锡工艺,通过单因素和正交实验考察了主盐、添加剂和工艺条件对镀层性能的影响,获得了最佳工艺配方。利用扫描电子显微镜、线性扫描伏安法及其它研究方法对镀液和镀层的性能进行了检测。结果表明：该镀锡液具有良好的稳定性,得到的镀层均匀、细致、半光亮。
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| 关 键 词： | 甲基磺酸 添加剂 表面形貌 极化 |
A Study of Methylsulphonate Tin Electroplating Process |
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| HU Li-xin,CHENG Jiao,ZHAN Wen,XIA Hao,OUYANG Gui.A Study of Methylsulphonate Tin Electroplating Process[J].Electroplating & Pollution Control,2009,29(6):29-32. |
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| Authors: | HU Li-xin CHENG Jiao ZHAN Wen XIA Hao OUYANG Gui |
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| Affiliation: | HU Li-xin~1,CHENG Jiao~1,ZHAN Wen~1,XIA Hao~1,OUYANG Gui~2(1.School of Chemical , Environmental Engineering,Hubei University of Technology,Wuhan 430068,China,2.Wuhan Research Institute of Materials Protection,Wuhan 430030,China) |
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| Abstract: | A new methylsulphonate tin plating process was researched.The effects of main salts,additives and technological conditions on cladding properties were investigated by single factor and orthogonal experiments,as a result the optimal process formula was obtained.The properties of the coating was tested by scanning electron microscope,linear sweep voltammetry and other methods.The results show that the plating solution has a superior stability,and the cladding is uniform,fine and semi-bright. |
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| Keywords: | methylsuiphonate additive surface morphology polarization |
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