| Copper-Ti3SiC2 composite powder prepared by electroless plating under ultrasonic environment |
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| 作者姓名： | ZHANG Zhongbao XU Shaofan |
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| 作者单位： | School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China |
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| 摘 要： | In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature （62-65℃） with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2 The optimum procedure before plating aimed to add activated sites and the adjustment of the traditional composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 gm/h. X-ray diffraction （XRD） indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.
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| 关 键 词： | 复合材料 电镀 Ti3SiC2 界面强度 |
| 收稿时间： | 19 April 2006 |
| 修稿时间： | 2006-04-19 |
Copper-Ti3SiC2 composite powder prepared by electroless plating under ultrasonic environment |
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| ZHANG Zhongbao XU Shaofan.Copper-Ti3SiC2 composite powder prepared by electroless plating under ultrasonic environment[J].Rare Metals,2007,26(4):359-364. |
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| Authors: | ZHANG Zhongbao XU Shaofan |
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| Affiliation: | 1. Division of Engineering Materials, Department of Management and Engineering, Linköping University, SE-58183 Linköping, Sweden;2. Siemens Industrial Turbomachinery AB, SE-61283 Finspong, Sweden;3. Department of Physics, Chemistry and Biology, Linköping University, SE-58183 Linköping, Sweden;4. GKN Aerospace Engine Systems, SE-46181 Trollhättan, Sweden |
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| Abstract: | In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature (62-65 ℃) with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2. The optimum procedure before plating aimed to add activated sites and the adjustment of the tradifonal composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 μm/h. X-ray diffraction (XRD) indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength. |
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| Keywords: | composites electroless plating Ti3SiC2 ultrasonic interfacial strength |
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