A 20-ns 128-kbit×4 high speed DRAM with 330-Mbit/s data rate |
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Authors: | Lu N.C.C. Chao H.H. Hwang W. Henkels W.H. Rajeevakumar T.V. Hanafi H.I. Terman L.M. Franch R.L. |
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Affiliation: | IBM Thomas J. Watson Res. Center, Yorktown Heights, NY; |
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Abstract: | The authors describe a high-speed DRAM (HSDRAM), designed primarily for high performance, while retaining the density advantage of the one-transistor DRAM cell. The 128-kb×4, 78-mm2 chip shows a random access time of 20 ns and a column access time of 7.5 ns, measured at 5.0 V, 25°C, and 50-pF load. A 256-b×4 high-speed page mode is provided which has 12-ns cycle into 60 pF, resulting in a data rate of 330 Mb/s. Additional measurements on HSDRAM further demonstrate that DRAM operation in a high-speed regime is not precluded by noise, power, wiring delay, and soft error rate. The device is implemented in a 1.0 μm n-well CMOS process |
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