基于仿生学的微通道耦合射流系统设计与研究

随着芯片热流密度的不断增长，散热问题日益严峻。文中以叶片脉络、斐波那契数列螺旋和雪花晶体结构为基础设计了3种由中心向四周拓扑的微通道耦合射流模型。通过仿真计算，分析了这3种仿生模型和典型肋柱模型的温度分布，并分析了这4种模型在不同雷诺数下的平均努塞尔数、在不同热流密度下的芯片温升和在不同泵功率下的综合性能。结果表明：3种仿生模型的散热性能都优于典型肋柱模型；在流量一致的情况下，斐波那契螺旋模型的换热性能最佳；在泵功率一致的情况下，分形脉络模型的综合性能最优。最后，设计了一种贯通式液冷VPX模块，并将微通道耦合射流系统应用其中。通过试验验证了仿真计算结果与试验结果的一致性，也进一步论证了仿生微通道耦合射流系统强大的散热性能。

Design of and Research on Microchannel Coupled Jet System Based on Bionics

With the increase of heat flow density of the chip, the heat dissipation problem becomes increasingly serious. Based on the leaf veins, Fibonacci spirals and snowflake structures, three microchannel coupled jet models that diverge from the center to the surroundings are designed in this paper. Through simulation calculations the temperature distribution of these three bionic models and a typical rib-column model are analyzed. The average Nusser number under different Reynolds numbers, chip temperature rise under different heat flux densities and comprehensive performance under different pump powers of these 4 models are analyzed. The results show that the heat dissipation performance of the three bionic models is better than the typical ribcolumn model, the Fibonacci spiral model has the best heat transfer performance when the flow is consistent and the fractal vein model has the best comprehensive performance when the pump power is consistent. Finally, a permeable liquid-cooled VPX module is designed and the bionic microchannel coupled cooling system is applied to it. The consistency between the simulation calculation and the experiment is verified and the powerful heat dissipation performance of the bionic microchannel coupled jet system is further demonstrated by test.