A novel method of processing pulse echo data in adhesive bond inspection |
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| Authors: | E. Segal P. Dickstein Y. Segal S. Kenig H. Dodiuk |
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| Affiliation: | (1) RAFAEL, M.O.D., Haifa, Israel;(2) Department of Nuclear Engineering, Technion-Israel Institute of Technology, 32000 Haifa, Israel |
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| Abstract: | ![]()
A novel method for evaluating nondestructively the quality of bonded assemblies is presented. It is shown that a combination of HOC (higher order crossing) analysis and another frequency domain parameter can distinguish between different surface treatments, as well as predicting cohesive or adhesive failure of bonds. It is believed that this method will open the way to predict the durability of bonded structures at the manufacturing or inservice stages. |
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| Keywords: | Ulstrasonics adhesive bond higher order crossing (HOC) interface nondestructive testing |
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