| 溅射靶材的应用及制备初探 |
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| 引用本文： | 刘志坚,陈远星,黄伟嘉,黄华俭.溅射靶材的应用及制备初探[J].南方金属,2003(6):23-24,32. |
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| 作者姓名： | 刘志坚 陈远星 黄伟嘉 黄华俭 |
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| 作者单位： | 广东省钢铁研究所,广东,广州,510640 |
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| 摘 要： | 随着电子及信息产业突飞猛进的发展，世界溅射靶材的需求越来越多，本文介绍了靶材的发展概况、分类和应用情况，以及靶材的特性要求．探讨Ni-Cr合金靶材的制备工艺，结果表明，产品能满足靶材特性要求。
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| 关 键 词： | 溅射 靶材 电阻薄膜 纯度 晶粒度 |
| 文章编号： | 1009-9700(2003)06-0023-02 |
Manufacture and application of sputtering target materials |
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| LIU Zhi-jian,CHEN Yuan-xing,HUANG Wei-jia,HUANG Hua-jian.Manufacture and application of sputtering target materials[J].Southern Metals,2003(6):23-24,32. |
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| Authors: | LIU Zhi-jian CHEN Yuan-xing HUANG Wei-jia HUANG Hua-jian |
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| Abstract: | The demand for sputtering target materials are increased with the rapid development of the electronic and information industries in the world. This paper describes the general development, classification and application of the target materials, as well as the properties required for them. In addition, the making technology of the Ni-Cr alloy target material is investigated. It is shown that a qualified target material can be made by using this technology. |
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| Keywords: | sputtering target materials electro-resistance film purity grain size |
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