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Cryogenic flat-panel gas-gap heat switch
Affiliation:1. NASA/Goddard Space Flight Center, Greenbelt, MD 20771, USA;2. University of Wisconsin, Madison, WI, USA;1. Massachusetts Institute of Technology, Cambridge, MA 02139, USA;2. Code 552, NASA/Goddard Space Flight Center, Greenbelt, MD 20771, USA;3. Department of Physics, Kanazawa University, Kanazawa 920-1192, Japan;4. National Research Institute for Metals, 1-2-1 Sengen, Tsukuba, Ibaraki 305, Japan;1. Univ. Grenoble Alpes, CEA, INAC, SBT, F-38000 Grenoble, France;2. ISAS-JAXA, 3-1-1Yoshinodai, Chuo-ku, Sagamihara, Kanagawa 252-5210, Japan;3. R&D-JAXA, 2-1-1 Sengen, Tsukuba, Ibaraki 305-8505, Japan;4. High Energy Accelerator Research Organization (KEK), 1-1 Oho, Tsukuba, Ibaraki 305-0801, Japan;5. CNES Toulouse, F-31055 Cedex 4, France;6. ESA-ESTEC, Noordwijk, The Netherlands
Abstract:A compact additive manufactured flat-panel gas-gap heat switch operating at cryogenic temperature is reported in this paper. A guarded-hot-plate apparatus has been developed to measure the thermal conductance of the heat switch with the heat sink temperature in the range of 100–180 K. The apparatus is cooled by a two-stage GM cooler and the temperature is controlled with a heater and a braided copper wire connection. A thermal guard is mounted on the hot side of the device to confine the heat flow axially through the sample. A gas handling system allows testing the device with different gas pressures in the heat switch. Experiments are performed at various heat sink temperatures, by varying gas pressure in the gas-gap and with helium, hydrogen and nitrogen gas. The measured off-conductance with a heat sink temperature of 115 K and the hot plate at 120 K is 0.134 W/K, the on-conductance with helium and hydrogen gases at the same temperatures is 4.80 W/K and 4.71 W/K, respectively. This results in an on/off conductance ratio of 37 ± 7 and 35 ± 6 for helium and hydrogen respectively. The experimental results matches fairly well with the predicted heat conductance at cryogenic temperatures.
Keywords:Gas-gap  Thermal control  Heat switch  Additive manufacturing
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