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Dielectric properties of doped silicon carbide powder by thermal diffusion
引用本文:苏晓磊 李智敏 罗发 王晓艳 朱冬梅 周万城. Dielectric properties of doped silicon carbide powder by thermal diffusion[J]. 中国有色金属学会会刊, 2007, 17(A02): 649-652
作者姓名:苏晓磊 李智敏 罗发 王晓艳 朱冬梅 周万城
作者单位:State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, China
基金项目:Project (50572090) supported by the National Natural Science Foundation of China
摘    要:
The doped SiC powders were prepared by the thermal diffusion process in nitrogen atmosphere at 2 000℃. Graphite film with holes was used as the protective mask, The dielectric properties of the prepared SiC powders at high frequencies were investigated. The complex permittivity of the undoped and doped SiC powders was measured within the microwave frequency range from 8.2 to 12.4 GHz. The XRD patterns show that before and after heat treatment no new phase appears in the samples of undoped and nitrogen-doped, however, in the aluminum-doped sample the AIN phase appears. At the same time the Raman spectra indicate that after doping the aluminum and nitrogen atoms affect the bond of silicon and carbon. The dielectric real part (ε) and imaginary part (ε") of the nitrogen-doped sample are higher than those of the other samples. The reason is that in the nitrogen-doped the N atom substitutes the C position of SiC crystal and induces more carriers and in the nitrogen and aluminum-doped the concentration of carriers and the effect of dielectric relaxation will decrease because of the aluminum and nitrogen contrary dopants.

关 键 词:碳化硅 热扩散 介电性能 电介质
收稿时间:2007-07-15
修稿时间:2007-09-10

Dielectric properties of doped silicon carbide powder by thermal diffusion
SU Xiao-lei, LI Zhi-min, LU Fa, WANG Xiao-yan, ZHU Dong-mei, ZHU Wan-cheng. Dielectric properties of doped silicon carbide powder by thermal diffusion[J]. Transactions of Nonferrous Metals Society of China, 2007, 17(A02): 649-652
Authors:SU Xiao-lei   LI Zhi-min   LU Fa   WANG Xiao-yan   ZHU Dong-mei   ZHU Wan-cheng
Affiliation:SU Xiao-lei, LI Zhi-min, LU0 Fa, WANG Xiao-yan, ZHU Dong-mei, ZH0U Wan-cheng
Abstract:
Keywords:silicon carbide   dielectric properties   thermal diffusion
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